KARI PROPRIETARY
Request For Proposal
Power Amplifier Set for Galileo Signal
November 24, 2010
Space Test Department
Korea Aerospace Research Institute
P.O.Box 113 Yuseung, Daejeon, 305-600, KOREA
Phone : 82(42)860-2977, Fax : 82(42)860-2234
KARI PROPRIETARY
Request For Proposal
for
Power Amplifier Set for Galileo Signal
IMPORTANT
1. This RFP should be kept in confidentiality and should
neither be copied nor distributed to the third parties.
2. The questions and opinions on this RFP can be asked or
suggested to Korea Aerospace Research Institute before
submission of the proposal.
3. This RFP should be returned to Korea Aerospace Research
Institute with bidder’s proposal.
4. This RFP shall be legal bind after the contract is awarded
unless the bidder explicitly expresses the differences from the
RFP in the compliance sheet.
November 24, 2010
Space Test Department
Korea Aerospace Research Institute
P.O.Box 113 YUSEONG
DAEJEON, 305-600, KOREA
Phone : 82(42)860-2977, FAX : 82(42)860-2234
e-mail : jjw0302@kari.re.kr
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PART I. Overview
1.
Overview of the project
1.1. Korea Aerospace Research Institute (hereinafter referred to as
“KARI”) is located at Daeduk Research Complex, 140 km south of
Seoul.
1.2. KARI has a satellite assembly, integration and test center
(hereinafter referred to as “AITC”) for joint use by corporations and
research institutes for the purpose of the effective development of
domestic satellites. And basic facilities and equipment for satellite
assembly and test have been supplied, installed and used.
1.3. The purpose of this project is to change the power amplifier
system, remote control panel, relating cable lines and Bi-directional
coupler installed in control room of the large EMC chamber.
1.4. The main undertakings of the project are to perform factory and
site acceptance tests, install, guarantee quality and training, etc.
1.5. The supply should submit the business showings of the installing
the power amplifier & control system.
1.6. All the descriptions in this RFP are minimum requirements and the
supplier can suggest the better one to improve the overal
performance and cost. But in this case, the proposal should clearly
indicate the improvements from KARI’s requirements.
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2.
Procedures of the project
2.1. The project shall be proceeded with five parts as follows:
2.1.1. Organization of power amplifier, external directional coupler,
control panel.
2.1.2. Factory acceptance test & safety plan verification
2.1.3. Transportation
2.1.4. Installation at KARI
2.1.5. Final acceptance test at KARI according to supplied test
procedure & previous test results
2.2. The participants shall submit the detailed work schedule for article
2.2.1. Specially, the work schedule at KARI shall be confirmed by
KARI for avoiding overlap with KARI’s other test schedules.
2.3. The format of proposal
2.3.1. The participants shall submit 6 copies of a detailed proposal
to KARI according to the format and contents satisfying the
requirements stipulated in this RFP.
2.3.2. The compliance sheet with the requirement of this RFP shall
certainly be included in the proposal.
2.3.3. The price of the system shall be broken down.
2.3.4. The participants shall make out a proposal with their own
writing.
2.3.5. The language shall be English or Korean.
2.4. The proposal shall be delivered to KARI before the due date for
submission.
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2.5. All proposals and documents submitted shall become the property
of KARI.
3.
Requisites of participants
3.1. The participants shall supply information about themselves.
3.2. The participants shall have experience of installation, operation,
arranging, integration of power amplifier to be installed in EMC
chamber.
4.
Scope of the contract
4.1. The project is on turnkey base and the proposal shall include the
following;
4.1.1. Engineering work of the equipment
4.1.2. Manufacture, assembly and turnkey delivery of the equipment
4.1.3. Parts and particular instruments necessary to operate the
equipment
4.1.4. Installation work and acceptance test at factory & KARI site
4.1.5. Project management, site operation, cooperation with KARI
4.1.6. Basic principle, operation, warranty, maintenance, repair, safety
and training for the equipment
4.1.7. Relevant books and manuals
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4.1.8. Other necessary matters required for acquiring and installing
the equipment (including checking of AITC building interface
and construction)
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PART II. TECHNICAL REQUIREMENTS
I. General
Power amplifier set will be installed in control room of EMC chamber in
KARI as shown in Figure 2.1 & 2.2.
Amplifier
Room
Control
Room
Amplifier
Large
EMC
chamber
Fig. 2.1 Expected amplifier set position in EMC chamber of KARI
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Expected Amplifier Position
in control room
External
Air-conditioner
Air-conditioning system
Inside Control Room in KARI EMC chamber
Fig. 2.2 Expected amplifier set position inside control room
II. DETAIL SPECIFICATION
1.
System concept
1.1. Modular "construction system" enables individual combinations
with almost unlimited flexibility
1.2. Platform concept al ows compact system dimensions for
customized configurations
1.3. Integral overall system design
1.4. RF adapted design
1.5. Rugged mechanical design
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1.6. Requried to efficient cooling
1.7. Flexible remote control : TTL, IEEE 488.2, RS-232C, USB and LAN
TCP/IP
1.8. MIL-Standard based system design in correspondence with
instrument safety regulations (VDE, CE)
2.
Environment condition
2.1. Temperature condition
2.1.1. Ambient temperature : 0℃ ~ 45℃
2.1.2. Storage temperature: -20˚C ~ +85˚C
2.2. Relative humidity : up to 95%
2.3. Location : normal laboratory environment
2.4. Operating altitude : up to 2000m above sea level
3.
Composition
Power amplifier set is composed by following items.
3.1. RF Power amplifier set
3.2. External directional coupler
3.3. RF Power Amplifier System Technical Specifications
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4.
Electrical Specification
4.1. Power amplifier Set
Power amplifier set should have performances more than defined value
in table 4.1.
Table 4.1 Electrical specification in power amplifier
Item
Specification
Frequency Range
9kHz~220MHz
Output Power
More than 3,000W at 1dB compression point over
the operating frequency range
Gain
minimum 64 dB
Harmonics
12dBc for 2nd harmonic
18dBc for 3rd harmonic
Line Power
Less than 25 kVA
Spurious (at PN)
-50 dBc typical (excluding harmonics)
Class of Operation
A-linear
Overdrive Protection
up to +10 dBm for no damage
Input Impedance
50 Ohm nominal
Output Impedance
50 Ohm nominal
Input VSWR
<2:1 typical
Load VSWR
2:1 maximum
RF Input
N(female)
RF Output
standard on rear panel
PN >1 kW 7/16(female)
Main Supply Power
3 × 380V AC, 60Hz
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4.2. Directional Coupler
Directional coupler should have performances more than defined value
in table 4.2.
Table 4.2 Electrical specification in directional coupler
Item
Specification
Frequency range
9 kHz to 1GHz
Power handling capability
3,000 W
Coupling
50 dB
Insertion loss
<0.2 dB
Ripple
±1 dB
VSWR(max.)
1.15 : 1
RF interface
7/16 inches
5.
RF Power amplifier system structure
5.1. Power stage
- D/C Bias supply power source
5.2. Control stage
- Diagnostic function
5.3. Driver module
- Amplifier stage to drive high-power
5.4. Final stage
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- Including output combiner
6.
RF characteristic
6.1. System parameters specified at rated output power (harmonic
distortion, spurious, power consumption etc.)
6.2. Standard operating range up to +45°C without degradation
6.3. Isolation of all individual RF transistors for optimum protection
against extreme mismatch and for providing a fault tolerant
system layout
6.4. VSWR optimized PIN-diode switches for optimum RF matching
6.5. Reliable continuous operation without degradation including
+45°C
7.
Power supply
7.1. Distributed design supporting a fault tolerant concept allows
continued operation with degraded performance
7.2. Individual power drains for all output transistors
7.2.1. Ideal supply conditions (individual sense lines)
7.2.2. Separate current and voltage limiting
7.2.3. Protection of output transistors against extreme mismatch
7.3. Enhanced efficiency for reduced source power requirements
7.4. Optimum supply and perfect protection of amplifier stages
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8.
Mechanical design
8.1. RF modules milled from solid
8.1.1. RF shielding
8.1.2. heat dissipation
8.1.3. RF grounding
8.2. Massive base plates
8.2.1. thermal sources (transistors and load resistors) are directly
soldered onto massive base plates
8.3. All metal parts protected by surface passivation
8.3.1. protection from oxidation (corrosion)
8.3.2. excellent long term system stability
8.3.3. perfect system grounding
8.4. Compact and rugged mechanical design for mobile applications
(ground, seaborne and airborne)
9.
Cooling System Design
9.1. Standard air cooling
9.1.1. special high efficiency heat sinks with double side assembling
9.1.2. highly efficient straight air flow
9.1.3. compact system layout
9.2. External Heat Exchangers convection cooling up to +50°C
9.2.1. no high capacity required for conventional air condition
9.2.2. less power consumption
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9.2.3. compact size (compared to compression type)
9.3. Optimum system cooling to ensure high reliability and extended
lifetime
10.
Acceptance and Training
10.1. Acceptance inspection
10.1.1. Unpacking
10.1.2. Visual inspection
10.1.3. Installation of the Amplifier in EMC chamber
10.1.4. Electricity connection
10.1.5. RF cable connection
10.1.6. After attaching Dumb load which is provided by vendor,
output power check
10.1.7. Remote control line connection
10.2. Training
11.
Warranty and Maintenance supporting
11.1. Warranty for minimum 1 year
11.2. Maintenance supporting system
11.2.1. Occur technical obstacles
11.2.2. Receipt obstacles
11.2.3. Obstacle definition and type analysis
11.2.4. First visiting the site and find solution
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11.2.5. Find detail causes
11.2.6. Domestic / Overseas repair or replace units
11.2.7. Second visiting for each type
11.2.8. Remove obstacles
11.2.9. Confirm result
11.2.10. Report and save details of obstacles and manage each case