- 1 -
별첨 2
과제제안요구서
(스페이스파이오니어사업 세부과제)
“ 2차원 다채널 적외선검출기 ”
- 2 -
2차원 다채널 적외선 검출기
□ 추진배경
ᄋ 제3차 우주개발 진흥 기본계획(`18.2.)에 근거하여, 차세대정지궤도위성 개발사업이 `23년 ~
`28년간 추진될 계획이며, 조기경보위성이 `40년까지 3기 발사 계획임
- 해양관측위성(해색 & 해수온)이나 조기경보와 같은 지구관측 위성에서, 가시광 영역에서 감지할
수 없는 적외선(중파장/장파장 적외선) 영역 관측이 중요함
- 정지궤도위성의 기상탑재체를 통한 기상 정보 분석에서도 다채널의 적외선 영상 획득은 중요한 정보
로 활용됨
- 적외선센서는 관측을 위해 반드시 필요한 부품으로, 심우주 탐사를 위해서는 고감도 / 대면적 적
외선 센서 개발이 요구됨
- 현재 국내 저궤도위성의 적외선 검출기는 1차원/단채널(중파장) 적외선 검출기로, 해외로부터 검
출기를 구매하여 탑재(현재 국내 위성에 탑재된 적외선 검출기는 1차원/단채널(중파장)의 검출
기로, Step-staring 관측 방식의 임무를 수행하는 정지궤도위성에는 탑재하여 운용이 불가능함)
ᄋ 국내 적외선센서 개발은 대부분 국방/산업용에 한정되어, 본격적으로 우주에서 지구관측에 필요
한 성능을 구현하기 위해 적외선 센서 스펙 향상이 필요함
ᄋ 광학위성의 관측스펙트럼이 넓어짐에 따라, 중파장/장파장 적외선 검출기의 탑재가 필수적임
- 기존 저궤도위성에 탑재된 3~5μm 중파장 적외선 영역뿐만 아니라, 열 영상 획득에 효과적인
8~12μm 장파장 적외선 영역의 관측이 중요함
ᄋ 2차원 형태의 다채널 적외선 검출기의 개발을 통해 적외선 영상의 품질을 향상시키고 저궤도/정지궤도에
탑재가 가능할 것으로 기대됨
과제제안요구서(RFP)
연구과제명
2차원 다채널 적외선 검출기
1. 연구목표
ᄋ 지구관측위성용 2차원 다채널 QM급 적외선 검출기 개발목표 및 내용
- 정지궤도/저궤도 지구관측위성에 적합한 다채널 적외선 검출기 개발
구분
현재수준
2차원 다채널 중적외선
검출기
2차원 다채널 원적외선
검출기
정성
목표
2차 원
다 채 널
적외선 검출기
단채널 중적외선
검출기 기술 확보
위성탑재를 위한 중적외선
감지용 검출기 QM 개발
위성탑재를 위한 원적외선
감지용 검출기 QM 개발
정량
목표
TRL단계
4(중적외선)/
2~3(원적외선)
최종 6
최종 6
EMI/EMC
-
MIL-STD-461F
MIL-STD-461F
- 3 -
NETD : Noise Equivalent Temperature Difference
ESCC 9020
-
F2/F3
F2/F3
반응파장대역
-
3-5.2㎛ [TBD]
10-12.5㎛ [TBD]
배열수/픽셀피치
-
2048 x 2048/10㎛ [TBD]
1024 x 1024/20㎛ [TBD]
선형도
-
+/- 5%
+/- 5%
최소분해가능온도차
(NETD)
-
≤ 25mK(@80K)[TBD]
≤ 35mK(@65K)[TBD]
2. 연구내용 및 연구성과
￭ 세부기술 개발 내용
ᄋ 1차년도
- 2차원 다채널 중적외선 검출기 기본 설계
- 2차원 다채널 중적외선 검출기 부품레벨/공정 인증시험 준비
- 2차원 다채널 원적외선 검출기 개념 설계
ᄋ 2차년도
- 2차원 다채널 중적외선 검출기/구동전자부 EM 개발
- 2차원 다채널 중적외선 검출기 부품레벨/공정 인증시험
- 2차원 다채널 원적외선 검출기/구동전자부 기본설계(DM개발)
ᄋ 3차년도
- 2차원 다채널 중적외선 검출기/구동전자부 QM 개발
- 2차원 다채널 원적외선 검출기/구동전자부 설계 검증
- 2차원 다채널 원적외선 검출기 부품레벨/공정 인증시험 준비
ᄋ 4차년도
- 2차원 다채널 중적외선 검출기/구동전자부 우주환경 인증시험
- 2차원 다채널 원적외선 검출기/구동전자부 EM 개발
- 2차원 다채널 원적외선 검출기 부품레벨/공정 인증시험
ᄋ 5차년도
- 2차원 다채널 원적외선 검출기/구동전자부 QM 개발
ᄋ 6차년도
- 2차원 다채널 원적외선 검출기/구동전자부 우주환경 인증시험
- QM 이후 체계연계를 고려한 FM급 계획(안) 수립
￭ 시험검증 방법
ᄋ QM의 경우 한국항공우주연구원의 우주환경시험실 활용*
- 우주 인증을 위한 충격, 진동, 열진공 시험, 전자파 환경시험 등을 수행
- 정지궤도/저궤도 위성의 우주환경 규격에 대한 검증 수행
* QM의 경우 한국항공우주연구원의 우주환경시험실 활용을 우선 권고하나 연구일정 준수 등을 고
려 시 주관 개발 기관의 제안도 가능함
ᄋ IDDCA QM의 방사선 환경시험은 국내/외 가속기 시험시설 활용
- 개발된 검출기에 대한 방사선 환경시험 수행
- 유럽우주국의 ECSS-9020의 방사선 환경 규격에 대한 검증 수행
- 4 -
ᄋ 검출기 QM의 우주 인증 시험
- 개발된 검출기에 대하여 유럽우주국의 ECSS-9020 시험 규격에 대한 검증 수행
￭ 최종성과물 및 활용 방안
최종성과물
목표 체계
성과활용방안
지구관측위성 탑재용 중적외선
검출기, 원적외선 검출기 인증
모델(QM) 개발 및 인증
[최초 적용 체계]
‘29년 발사예정인 우주과학검증위성
’29년 발사예정인 차세대 정지궤도위
성에 탑재(해양환경)
[이후 적용 체계]
후속 조기경보위성(~`32년) (미정) 탑재
확보된 기술을 반영하여 차세대중형
위성(~`34년) (미정)에 탑재
지구 관측을 위한 광학위성의 주요
핵심부품으로 전자광학탑재체에 적
용
3. 특기사항
- 전기지상지원장비(EGSE) 및 기계지상지원장비(MGSE) 포함됨
- 적외선검출기는 냉각기와 냉각기구동전자부를 포함한 적외선초점면 유닛을 의미함. (*냉각기와 냉각구
동부는 해외 구매품 적용 가능)
4. 연구기간 및 연구비
ㅇ
(연구기간) ’21.9.~’26.12(6년)
ㅇ
(연구비) 160억원(중소기업 기관부담금 기준 40억원 포함)
연도
2021
2022
2023
2024
2025
2026
합계
정부 지원금
8.11
19.36
36.74
36.85
13.04
5.90
120
민간 부담금
2.70
6.45
12.25
12.29
4.35
1.96
40
합계
10.81
25.81
48.99
49.14
17.39
7.86
160
(단위: 억원)
※ 연구기간 및 연구비는 정부 예산사정 및 사업추진 방향 등에 의해 변동•조정될 수 있음
별첨 2-1
제안 요청서
스페이스파이오니어사업 세부과제
2차원 다채널 적외선검출기
2021. 07.
스페이스파이오니어사업단
- 2 -
<제목 차례>
제 1 장. 개요 ·
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3
제 1 절. 제안요청서의 구조 ·
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제 2 절. 본 사업의 목표 ·
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제 3 절. 주요 용어 및 약자 ·
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4
제 2 장. 과제계획서 제출 요령 ·
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제 1 절. 작성 과제계획서 양식 ·
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제 2 절. 과제계획서 작성 목차 ·
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제 3 절. 과제계획서 평가 지표 (안) ·
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7
제 3 장. 기술적 요구사항 ·
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8
제 1 절. 요구조건 ·
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8
제 2 절. 요구사항 ·
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8
제 3 절. 납품항목 목록 ·
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11
제 4 절. 진도점검회의 ·
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16
제 4 장. 기타 특수조건 ·
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17
제 1 절. 연구개발수행기관의 책임 및 의무사항 ·
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17
제 2 절. 개발품목 시험 ·
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17
제 3 절. 제품보증 ·
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17
제 4 절. 진도관리 ·
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18
제 5 절. 도면관리 ·
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18
제 6 절. 사업단(체계연계지원팀 등)의 기술관리 수용 ·
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18
제 7 절. 해외 수출면허 규정 ·
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19
제 8 절. 붙임 ·
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19
붙임#1 보안유지 서약서 ·
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20
붙임#2 2차원 다채널 적외선검출기 규격서 ·
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21
붙임#3 품질인증 요구규격 ·
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22
붙임#4 EMC 시험규격 ·
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23
- 3 -
제 1 장. 개요
본 제안요청서는 공모를 통하여‘2차원 다채널 적외선검출기’개발을 수행할
업체를 선정할 목적으로 작성한다.
제 1 절. 제안요청서의 구조
가. 본 제안요청서는 제 2 장 ‘과제계획서 제출 요령’ 제 3 장 ‘기술적 요구사
항’, 제 4 장 ‘기타 특수조건’과 특수조건 등에서 요구하는 붙임의 양식 등
을 포함하며, 제 2 장에서는 제안서 제출요령 및 사업관리 등 방안 등을, 제 3
장과 제 4 장에서는 참여업체가 수행해야 할 업무 및 조건 등을 정의한다.
제 2 절. 본 사업의 목표
가. 연구의 목표
‘2차원 다채널 적외선검출기’개발
* Cooler & CDE는 국외개발품 적용 가능
나. 최종 성과물 및 활용 체계
구분
2차원 다채널 중적외선 검출기
2차원 다채널 원적외선 검출기
비고
모델
EM & QM
EM & QM
(설계검증용 DM 포함)
2차원 다채널 검출
기 FEE, Cooler &
CDE, EGSE 포함
개발목표
위성탑재를 위한 중적외선
감지용 검출기 개발
위성탑재를 위한 원적외선
감지용 검출기 개발
반응파장대역
3-5.2㎛ [TBD]
10-12.5㎛ [TBD]
배열수/픽셀피치
2048 x 2048/10㎛ [TBD]
1024 x 1024/20㎛ [TBD]
선형도
+/- 5%
+/- 5%
최소분해가능
온도차 (NETD)
≤ 25mK(@80K)[TBD]
≤ 35mK(@65K)[TBD]
최종성과물
목표 체계
성과활용방안
지구관측위성 탑재용
중적외선검출기, 원적
외선 검출기 인증 모델
(QM) 개발 및 인증
[최초 적용 체계]
‘29년 발사예정인 우주과학검증위성
’29년 발사예정인 차세대 정지궤도위성
에 탑재(해양환경)
[이후 적용 체계]
후속 조기경보위성(~`32년) (미정) 탑재
확보된 기술을 반영하여 차세대중형위성
(~`34년) (미정)에 탑재
지구관측을 위한 광학위성의 주요 핵
심부품으로 전자광학탑재체에 적용
- 4 -
제 3 절. 주요 용어 및 약자
◯ 기술자료 : 메모, 서신, 영상 및 음성 기록물, 사진, 설계, 컴퓨터 S/W,
공정(절차)서 및 계약서 등 일체의 자료 및 정보
◯ KARI
Korea Aerospace Research Institute
◯ EOS
Electro-Optical Subsystem
◯ COC
Certificate of Conformity
◯ DR
Design Review
◯ ICD
Interface Control Drawing 또는 Document
◯ MRR
Manufacturing Readiness Review
◯ NCR
Non Conformance Record
◯ KIP
Key Inspection Point
◯ MIP
Mandatory Inspection Point
◯ SCD
Source Control Drawing
◯ TBD
To Be Determined
◯ TBR
To Be Resolved
◯ TBC
To Be Confirmed
◯ TRR
Test Readiness Review
◯ PTR
Post Test Review
◯ S/C Bus
Spacecraft Bus
◯ EDC
Effective Date of Contract
◯ ECO
Engineering Change Order
◯ KO
Kick Off Meeting
◯ SRR
System Requirement Review
◯ SDR
System Design Review
◯ PDR
Preliminary Design Review
◯ CDR
Critical Design Review
◯ MRR
Manufacturing Readiness Review
◯ PTR
RCT K10 Post-Test Review
- 5 -
제 2 장. 과제계획서 제출 요령
제 1 절. 작성 과제계획서 양식
붙임의 ‘2021년 국책연구본부 신규 계획서 양식’에 작성하되, 참여기업은
사업의 추진 구조에 따라 각각 총괄, 세부, 위탁, 단위 과제계획서를 제출하
여야 한다.
<참고> 컨소시엄 구성 시
총괄 계획서
(공통격벽 추진제 탱크 개발)
세부
1
세부
2
위탁
1
기관
A
기관
B
기관
C
<참고> 단독 기업/기관 제안 시
단위계획서
(공통격벽 추진제 탱크 개발)
위탁
1
위탁
2
위탁
3
기관
A
기관
B
기관
C
제 2 절. 과제계획서 작성 목차
과제계획서는 2021년 국책연구본부 신규 계획서 양식을 기준으로 하여 아
래에서 명시한 각각의 세부 항목은 모두 포함하여야 한다.
1. 연구개발과제의 필요성
2. 연구개발과제의 목표 및 평가 기준, 설정 근거
3. 연구개발과제의 내용, 추진체계 및 일정
1) 연구개발과제의 내용
- 총괄과제 개발 대상 설계 및 세부 개발안
(요구조건에 대한 Compliance Matrix 포함)
- 검증계획
- 업무 범위 (RFP 제3장 제3절의 납품목록 포함)
- 6 -
- 제작, 조립 및 시험 계획
- 공정 및 품질관리 방안
2) 연구개발과제의 추진체계
- 사업관리 방안
- 사업실패 대응계획 (Back-up Plan)
- 품질인증 체계
- 우주급 부품 (구성품) 조달계획 (구매관리)
- 중점관리품목 및 위험요소 관리 방안
- 자체개발분야 기술의 세부개발안
- 하청생산 및 위탁 연구 계획 (필요시)
3) 추진 일정 (아래 일정 포함)
- SRR (System Requirement Review)
- SDR (System Design Review)
- PDR (Preliminary Design Review)
- CDR (Critical Design Review)
- MRR (Manufacturing Readiness Review)
- EM PTR(Post-Test Review)
- QM PTR(Post-Test Review)
4. 연구개발성과의 활용방안 및 기대효과
1) 연구개발성과의 활용방안
2) 연구개발성과의 기대효과
5. 연구수행역량 (연구개발기관 현황 및 역량 포함)
6. 연구개발비 사용에 관한 계획
7. 연구개발 안전 및 보안조치 이행계획
8. 연구개발성과의 사업화 전략 및 계획
- 7 -
제 3 절. 과제계획서 평가 지표 (안)
평가항목
평가 주안점
배점
연구계획
(30)
연구주제안내서(RFP)와의 부합성
10
연구목표의 명확성 및 달성 가능성(타당성)
10
연구내용 및 추진체계의 합리성 (컨소시엄 구성 적절성 확인 포함)
10
체계연계성
(30)
체계연계를 위한 중점기술개발 방안 및 구체성
∘체계연계를 위한 성능 만족 개발방안의 구체성 등
15
체계연계를 위한 계획의 구체성
∘체계연계에 대한 리스크 식별 및 대응방안이 우수한가?
15
연구역량
(20)
참여기관 실적의 우수성, 적합성 및 수행능력 평가
10
참여기관의 재무 건정성 및 신뢰성
5
참여연구원 구성의 적절성
5
결과활용
(20)
연구결과 활용가능성 및 파급효과
10
연구결과의 실용성 및 적용방안의 구체성
10
합
계
100
- 8 -
제 3 장. 기술적 요구사항
제 1 절. 요구조건
본 제안 요청서의 붙임#2와 붙임#5의 요구조건에 근거하여 설계, 세부 개발안
과 Compliance Matrix와 Verification Matrix를 작성한다.
붙임#2“2차원 다채널 적외선검출기 규격서 (SPPO-SP-302-000_Multi-band IRFPU
Specification_Rev00.docx)”
붙임#3“품질인증 요구규격 (General Unit Product Assurance Requirements)”
제 2 절. 요구사항
가. 성능 요구조건
붙임#2“2차원 다채널 적외선검출기 규격서 (SPPO-SP-302-000_Multi-band IRFPU
Specification_Rev00.docx)”참조
나. 개발요구사항
붙임#2“2차원 다채널 적외선검출기 규격서 (SPPO-SP-302-000_Multi-band IRFPU
Specification_Rev00.docx)”참조
- 9 -
다. 연차별 목표 및 평가지표 (예시)
□ 연차별 목표
12
2차원 다채널 적외선 검
출기
(’21년 ~ ’26년)
1차년도
2차원 다채널 중적외선 검출기 기본 설계
2차원 다채널 중적외선 검출기 부품레벨/공정 인증시험 준비
2차원 다채널 원적외선 검출기 개념 설계
2차년도
2차원 다채널 중적외선 검출기/구동전자부 EM 개발
2차원 다채널 중적외선 검출기 부품레벨/공정 인증시험
2차원 다채널 원적외선 검출기/구동전자부 기본설계(DM개발)
3차년도
2차원 다채널 중적외선 검출기/구동전자부 QM 개발
2차원 다채널 원적외선 검출기/구동전자부 설계 검증
2차원 다채널 원적외선 검출기 부품레벨/공정 인증시험 준비
4차년도
2차원 다채널 중적외선 검출기/구동전자부 우주환경 인증시험
2차원 다채널 원적외선 검출기/구동전자부 EM 개발
2차원 다채널 원적외선 검출기 부품레벨/공정 인증시험
5차년도
2차원 다채널 원적외선 검출기/구동전자부 QM 개발
6차년도
2차원 다채널 원적외선 검출기/구동전자부 우주환경 인증시험
QM 이후 체계연계를 고려한 FM급 계획(안) 수립
□ 연차별 평가지표
평가항목
가중치
(%)
연차
연차별 목표 (조건/환경)
12. 2차원 다채널 적외선 검출기(’21년 ~ ’26년)
(정성)
2차원 다채널
중적외선 검출기
QM급 모델 개발
20
1차년도
(2021년)
2차원 다채널 중적외선 검출기 기본 설계
(요구사항 도출/광학성능 분석/초점면어레이 및 리드아웃
집적회로 기본설계)
2차원 다채널 중적외선 검출기 부품레벨/공정 인증시험 준비
2차년도
(2022년)
2차원 다채널 중적외선 검출기 공학모델 개발
(중적외선 검출기, 냉각기(구동부), 구동전자부, 듀어 패키기
개발)
3차년도
(2023년)
2차원 다채널 중적외선 검출기 인증모델 개발
(중적외선 검출기, 냉각기(구동부), 구동전자부, 듀어 패키기
개발)
4차년도
(2024년)
2차원 다채널 중적외선 검출기 우주환경 인증시험
(우주방사선/충격/진동/열진공/전자파 환경시험 수행)
5차년도
(2025년)
“당해년도 계획없음”
6차년도
(2026년)
“당해년도 계획없음”
(정량)
2차원
다채널
중적외선검출기
초점면배열, 파
장대역 및 NETD
30
1차년도
(2021년)
“당해년도 계획없음”
2차년도
(2022년)
중적외선 검출기 공학모델에 대한 기능/성능시험 수행
(초점면배열, 파장대역 및 선형도, NETD 확인, 방사선
조사에 따른 성능 변화 )
중적외선 검출기 부품레벨/공정 인증시험
- 10 -
평가항목
가중치
(%)
연차
연차별 목표 (조건/환경)
3차년도
(2023년)
중적외선 검출기 인증모델에 대한 기능/성능시험 수행
(초점면배열, 파장대역 및 선형도 확인)
4차년도
(2024년)
중적외선 검출기 인증모델의 우주환경 인증시험에 의한
기능/성능변화 확인 (초점면배열, 파장대역, 선형도,
NETD 변화)
5차년도
(2025년)
“당해년도 계획없음”
6차년도
(2026년)
“당해년도 계획없음”
(정성)
2차원
다채널
원적외선검출기
QM급 모델 개발
20
1차년도
(2021년)
2차원 다채널 원적외선검출기 개념설계
(적외선검출기 시스템 개념설계 및 요구사항 도출)
2차년도
(2022년)
2차원 다채널 원적외선검출기 기본설계(DM 개발)
(광학성능 분석/초점면어레이 및 리드아웃 집적회로 기본설계)
3차년도
(2023년)
2차원 다채널 원적외선검출기 설계검증
(원적외선검출기, 냉각기(구동부), 구동전자부, 듀어 패키기
개발)
2차원 다채널 원적외선 검출기 부품레벨/공정 인증시험 준비
4차년도
(2024년)
2차원 다채널 원적외선검출기 공학모델 개발
(원적외선검출기, 냉각기(구동부), 구동전자부, 듀어 패키기
개발)
5차년도
(2025년)
2차원 다채널 원적외선검출기 인증모델 개발
(원적외선검출기, 냉각기(구동부), 구동전자부, 듀어 패키기
개발)
6차년도
(2026년)
2차원 다채널 적외선 검출기 우주환경 인증시험
(우주방사선/충격/진동/열진공/전자파 환경시험 수행)
(정량)
2차원
다채널
원적외선검출기
초점면배열, 파
장대역 및 NETD
30
1차년도
(2021년)
“당해년도 계획없음”
2차년도
(2022년)
“당해년도 계획없음”
3차년도
(2023년)
원적외선 검출기 개발모델의 기능/성능시험 수행 (초점
면배열, 파장대역 및 선형도, NETD 확인)
4차년도
(2024년)
원적외선 검출기 공학모델에 대한 기능/성능시험 수행
(초점면배열, 파장대역 및 선형도 확인, 방사선조사에
따른 성능 변화 )
원적외선 검출기 부품레벨/공정 인증시험
5차년도
(2025년)
원적외선 검출기 인증모델에 대한 기능/성능시험 수행
(초점면배열, 파장대역 및 선형도 확인)
6차년도
(2026년)
원적외선 검출기 인증모델의 우주환경 인증시험에 의한
기능/성능변화 확인 (초점면배열, 파장대역 및 선형도
변화)
소계
100
- 11 -
□ 평가항목의 설정 근거
평가항목
목표 설정근거
(정성)
2차원
다채널
광 대 역 ( 중 - 장
적외선) 감지용
적외선 검출기
QM 개발
광학위성의 관측스펙트럼이 넓어짐에 따라, 중적외선 뿐만 아니라 열 영상 획
득에 효과적인 장파장 적외선 검출기의 탑재는 필수이며, 다채널 광대역 감지
용 적외선 검출기 QM개발은 중파장 및 장파장 적외선 검출기 칩 개발뿐만 아
니라 우주환경 하에서의 적외선 검출기 구동을 위한 듀어, 냉각기, 구동전자
부 등을 개발하는 것이 핵심임.
(정량)
적 외 선 검 출 기
파장대역
및
선형도
3~5μm 중파장 적외선 영역과 열 영상 획득에 효과적인 10~12μm 장파
장 적외선 대역의 다채널 검출기로 2048 X 2048 pixel[TBD]크기의
25mK 이상의 최소분해가능온도차와 1024 X 1024 pixel[TBD]크기의
35mK 이상의 최소분해가능온도차를 갖는 검출기는 위성의 임무를 수행하
기 위한 필수적인 기술임.
라. 시험검증방안
ᄋ QM의 경우 한국항공우주연구원의 우주환경시험실 활용*
- 우주 인증을 위한 충격, 진동, 열진공 시험, 전자파 환경시험 등을 수행
- 정지궤도/저궤도 위성의 우주환경 규격에 대한 검증 수행
ᄋ IDDCA QM의 방사선 환경시험은 국내/외 가속기 시험시설 활용
- 개발된 검출기에 대한 방사선 환경시험 수행
- 유럽우주국의 ECSS-9020의 방사선 환경 규격에 대한 검증 수행
ᄋ 검출기 QM의 우주 인증 시험
- 개발된 검출기에 대하여 유럽우주국의 ECSS-9020 시험 규격에 대한 검증 수행
* QM의 경우 한국항공우주연구원의 우주환경시험실 활용을 우선 권고하나 연구일정 준수 등을
고려 시 주관 개발 기관의 제안도 가능함
제 3 절. 납품항목 목록
가. 납품문서 목록
※ D: Draft, P: Preliminary, F: Final for documents,
A: Approval, R: Review, I: Investigation for acceptance criteria.
※ 단, 계약업체는 설계 및 제작 기간 중에 필요시 항우연 요청에 따라 수시
로 문서(최종 문서가 아니어도 됨)를 제공해야 함.
문서번호
문서 제목
제출기일
Program Management
SPPO-XXX-PN-01
Development Management Plan
P-EDC+1M, R-As required
SPPO-XXX-PN-02
Monthly Schedule Reports
Monthly
SPPO-XXX-PN-03
Monthly Progress Reports
Monthly
- 12 -
문서번호
문서 제목
제출기일
Program Assurance
SPPO-XXX-PA-01
Product Assurance Plan
F-EDC+2M
SPPO-XXX-PA-02
XXXPU Verification Plan
P-SRR, R-As revised, F-CDR
SPPO-XXX-PA-03
Manufacturing Flow Diagram
P-SRR, R-As revised, F-CDR
SPPO-XXX-PA-04
Reliability Prediction Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-05
Part Identification List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-06
Part Approval Document
As generated
SPPO-XXX-PA-07
Wafer Lot Acceptance Report
PSR
SPPO-XXX-PA-08
Special In-process Controls Report
PSR
SPPO-XXX-PA-09
Photo Identification Report
PSR
SPPO-XXX-PA-10
Screening & Qualification Report
PSR
SPPO-XXX-PA-11
Acceptance Test Report
TRB, PSR
SPPO-XXX-PA-12
Verification Report
PSR
SPPO-XXX-PA-13
End Item Data Package
PSR
SPPO-XXX-PA-14
Assurance Status Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-15
Verification Specification
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-16
Fabrication and Assembly Flow Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-17
Inspection and Test Record
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-18
Limited Life Item List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-19
Reliability Prediction
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-20
FMECA
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-21
Critical Item List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-22
Part Stress Analysis
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-23
Worst case Analysis
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-24
Parameter Trend Analysis
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-25
Justification for Derating Rules
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-26
Materials Identification List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-27
Process List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-28
MUA with the following documents;
- Material and/or process
specifications
- Evaluation plan and/or report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-29
Contamination Control Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-30
Contamination Analysis Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-31
Contamination Budget Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-32
EEE Part Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-33
Part Identification List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-34
PAD
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-35
Part Specification
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-36
DPA Procedure and Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-37
Radiation Assessment Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-38
Part Evaluation Plan and Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-39
User’s Manual
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-40
Safety Assessment Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-41
M&P Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-42
M&P Identification List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-43
RFA
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-44
M&P Specification
P-SDR, R-As revised, F-CDR
- 13 -
문서번호
문서 제목
제출기일
SPPO-XXX-PA-45
M&P Evaluation Plan and Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-46
Software Assurance Plan
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-47
Software List
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-48
Budget Analysis of Resource
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-49
Software Test Plan and Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-PA-50
Software Maintenance Plan
P-SDR, R-As revised, F-CDR
System Engineering
SPPO-XXX-SE-01
XXXPU Specification
P-SRR, R-As revised, F-CDR
SPPO-XXX-SE-02
Design Review Data Package
Kick-off
1. SRR (System Requirement Review)
2. SDR (System Design Review)
3. PDR (Preliminary Design Review)
4. CDR (Critical Design Review)
5. TRR (Test Readiness Review)
6. TRB (Test Review Board)
7. EM PSR (Pre-shipment Review)
8. QM PSR (Pre-shipment Review)
9. FM PSR (Pre-shipment Review)
Design Review
SPPO-XXX-SE-03
Design Review Report
After Design Review
SPPO-XXX-SE-04
Performance Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-05
Structure Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-06
Thermal Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-07
Radiation Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-08
Timing Simulation Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-09
Infrared Detector Design Description
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-10
XXX Design Description
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-11
Electrical Interface Control Document
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-12
Mechanical Interface Control
Document
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-13
Thermal Interface Control Document
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-14
Drawing Tree
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-15
Mechanical Engineering Drawing
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-16
Electrical Engineering Drawing
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-17
Thermal model and report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-18
3D CAD model (STEP file format)
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-19
Structure FEM model (Nastran format)
and report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-20
XXXPU Cleaning Procedure
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-21
Geometrical Measurement Report
10. Mechanical and optical references
11. Flatness
12. Die alignment
13. Pixel location
14. Optical distance between image
plane and window
P-TRB, F-PSR
SPPO-XXX-SE-22
Electro-optical Measurement Report
P-TRB, F-PSR
- 14 -
※ 상기 납품문서는 사업단과 세부과제 주관기관의 협의 하에 조정될 수 있음.
또한, 작성 및 관리방법에 대해서는 사업단에서 지원/협력할 수 있음.
문서번호
문서 제목
제출기일
SPPO-XXX-SE-23
Electrical Measurement Report
P-TRB, F-PSR
SPPO-XXX-SE-24
Operation Manual
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-25
Part Identification List
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-26
PAD with the following documents;
- Part specification
- Evaluation plan and/or report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-27
Mass Property Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-28
Power Budget Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-29
EMI/EMC Analysis Report
P-SDR, R-As revised, F-CDR
SPPO-XXX-SE-30
Design Description for XXXPU
software
P-SDR, R-As revised, F-CDR
System Handling & Transportation
SPPO-XXX-SH-01
Transportation, Storage Plan and
Requirement
P-CDR, F-PSR
SPPO-XXX-SH-02
Photos taken at the level of board
level assembly
F-PSR
System Test
SPPO-XXX-ST-01
Qualification and Acceptance Test
Plan
P-SDR, F-CDR
SPPO-XXX-ST-02
Qualification and Acceptance Test
Procedure
4 weeks before ATP
SPPO-XXX-ST-03
Qualification and Acceptance Test
Data
(including cal. Curve for analog
signal)
2 weeks after ATP
SPPO-XXX-ST-04
Qualification and Acceptance Test
Report
2 weeks after ATP
SPPO-XXX-ST-05
EMI/EMC test procedure
P-CDR, R-as generated
SPPO-XXX-ST-06
EMI/EMC test data
P-CDR, R-as generated
SPPO-XXX-ST-07
Procedure for integration and
alignment of XXXPU at satellite level
P-SDR, R-As revised, F-CDR
SPPO-XXX-ST-08
On-orbit verification and correction
Procedure
P-SDR, R-As revised, F-CDR
System Operation
SPPO-XXX-SO-01
XXX Command and Telemetry
Handbook
P-SDR, R-As revised, F-CDR
SPPO-XXX-SO-02
Operational Handbook and Manual
(including treatment of ignition
material)
P-SDR, R-As revised, F-CDR
SPPO-XXX-SO-03
Description of XXXPU Simulator
P-SDR, R-As revised, F-CDR
- 15 -
나. 하드웨어 개발 목록 (일정은 제안서 제출시 변경제안 가능)
□ 2차원 다채널 중적외선 검출기
No
Item
Quantity
Delivery Date
Notes
1
IRFPU EM
1 set
EDC + months
2
IRFPU QM
1 set
EDC + months
3
MGSE
1 set
EDC + months
EDC + months
4
EGSE
1 set
EDC + months
EDC + months
5
Test
Harnesses
1 set
EDC + months
For EM & QM
□ 2차원 다채널 원적외선 검출기
No
Item
Quantity
Delivery Date
Notes
1
IRFPU EM
1 set
EDC + months
2
IRFPU QM
1 set
EDC + months
3
MGSE
1 set
EDC + months
EDC + months
4
EGSE
1 set
EDC + months
EDC + months
5
Test
Harnesses
1 set
EDC + months
For EM & QM
※ MGSE, EGSE, Test Harness 규격과 개발상세는 협약 후 사업단과 협의하여 결
정함
- 16 -
제 4 절. 진도점검회의
아래의 주요 진도점검회의는 본 사업 연구개발성과의 체계연계를 위해 필수적
으로 판단되는 사항이며, 아래 진도점검회의 외에도 스페이스파이오니어사업단 및
관련 부처, 연구재단 및 연구개발수행기관의 요구발생 시 수시로 설계 및 개발경
과 관련 회의가 개최되어야 한다.
동시에 연구개발수행기관은 매달 사업단에 연구개발진도 보고서를 제출한다.
□ 주요일정
- SRR (System Requirement Review)
- SDR (System Design Review)
- PDR (Preliminary Design Review)
- CDR (Critical Design Review)
- MRR (Manufacturing Readiness Review)
- EM PTR (Post-test Readiness Review)
- QM PTR (Post-test Readiness Review)
□ 사업 주요일정 (일정은 제안서 제출시 변경제안 가능)
사업기간
사업일정
예정일 (TBD)
비고
2021.9.1.-
2024.12.31
(2차원 다채널
중적외선검출기)
EDC
TBD
SRR
EDC + 1 months
PDR
EDC + 6 months
CDR
EDC + months
EM PSR
EDC + months
QM MRR
EDC + months
QM TRR
EDC + months
QM PSR
EDC + months
2021.9.1.-
2026.12.31
(2차원 다채널
원적외선검출기)
EDC
TBD
SRR
EDC + 1 months
PDR
EDC + 6 months
CDR
EDC + months
EM PSR
EDC + months
QM MRR
EDC + months
QM TRR
EDC + months
QM PSR
EDC + months
※ EDC : Effective Date of Contract, 협약일
※ 항우연이나 업체의 요구발생 시 수시로 설계 및 개발경과 관련 미팅 수행
- 17 -
제 4 장. 기타 특수조건
본 제안요청서의 붙임#2와 본 장에서 언급하는 것에 상충하는 것이 있다면 본
장의 내용이 우선한다.
제 1 절. 연구개발수행기관의 책임 및 의무사항
- 연구개발수행기관은 주요 제작 공정 및 품목을 사진(연도/월/일 포함) 혹은 동
영상으로 기록하여 유지한다.
제 2 절. 개발품목 시험
- 연구개발수행기관은 본 사업의 과제제안요청서에 언급된 “개발”품목의 검
증시험을 도면에 명기하여 수행해야 한다.
- 단, 검증시험 방법에 이견이 있을 시, 개발수행기관이 제시하는 방법이 당초
제안요청서에서 요구하는 방법과 차이가 없음을 입증해야 한다.
- 연구개발수행기관은 수용 가능한 경우 사업단에서 요구하는 검증시험을 추가
비용 없이 수행하고, 수행 후 2주일 내에 시험 결과를 사업단에 제출해야 한
다. 요구성능 미달 시, 이에 대한 기술회의를 사업단과 수행한 후 제시된 개
선책에 따라 재시험을 수행해야 한다.
- 모든 검증시험 경우, 계획서는 사전에 사업단의 승인을 득해야한다. 연구개발
수행기관의 시험 항목 및 방법 변경 시는 사업단과 서면 협의 후 새로운 방
법에 대한 검증이 선행되어야 한다.
- 이러한 검증시험은 연구개발수행기관에 의해 수행되거나 “연구개발수행기관
과 계약을 맺은 전문 시험기관에 의하여 수행될 수 있으며, 이 경우 사업단이
지정한 검사원이 입회할 수 있다.
- 본 제안요청서에서 요구하는 계획 이외의 환경시험은 협의하여 수행한다.
제 3 절. 제품보증
- 연구개발수행기관은 사업단의 제품보증요구조건(Products Assurance Requirements,
이하 “PAR”) 및 사업단의 승인을 받은 연구개발수행기관의 제품보증계획서
(Product Assurance Program Plan, 이하 “PAPP”)를 준수하여 “개발”된 납품품
목을 납품해야 한다.
- 연구개발수행기관은 “PAR” 및 “PAPP”에 따라 제품보증 활동을 수행해야
- 18 -
하며, 이에 적합한 조직과 인력을 구성해야 한다.
- 사업단은 연구개발수행기관 혹은 연구개발수행기관의 외주업체에 대한 제품보증 활
동을 주기적으로 확인 및 감독 할 수 있으며, 필요시 시정 조치를 요구할 수 있다.
- 사업단이 연구개발수행기관 혹은 연구개발수행기관의 외주업체에 대한 품질
확인(MIP: Mandatory Inspection Point 포함)을 실시하는 경우, 연구개발수행기
관은 사업단이 요구하는 모든 필요한 지원을 제공해야 하며, 품질확인에 대한
승인을 득해야 한다.
- 연구개발수행기관은 “PAPP”에 따른 전 과정 및 납품품목의 품질에 대한 최
종 책임을 진다.
제 4 절. 진도관리
- 연구개발수행기관은 계약 완료일까지 개발에 대한 진도보고서(일정계획 포함)
를 매월 사업단에게 제출해야 한다.
- 연구개발수행기관은 위 제3장 제4절 진도점검 회의 일정에 따라 진도검검 회
의를 개최해야 한다.
- 연구개발수행기관은 사업단의 요구에 따라 주간, 격주 혹은 월간 단위로“개
발”회의를 진행하고 사업단의 요구에 따라 관련 자료를 제출해야 한다.
- 사업단은 필요하다고 판단되는 시기에 연구개발수행기관에 대한 실사를 실시할
수 있으며, 실사결과에 따라 필요시에는 연차평가 및 차년도 협약에 반영한다.
제 5 절. 도면관리
- “연구개발수행기관은 “개발”에 관련된 모든 도면이 제작 시작 전 사업단
의 서면 승인이 완료되도록 지원해야 한다.
- 연구개발수행기관에 의하여 생성되는 도면은 사업단에 의한 “도면작성방
법”, “도면 작성 및 배포 절차” 및 “도면번호” 등을 따르며, 사업단의
형상관리 절차에 따라 사업단의 CDMO(Configuration Data Management
Office)에 등록한다.
- 또한, 연구개발수행기관은 “PAPP”에 따른 자체 도면관리 체계를 갖추어야 한다.
제 6 절. 사업단(체계연계지원팀 등)의 기술관리 수용
- 사업단(체계연계지원팀 등)의 세부 개발 사양 검토 및 요건이 반영되도록 하여야 함
- 사업단(체계연계지원팀 등)이 지정한 연구진 출입 및 관련 자료, 연구성과물 등의
- 19 -
열람을 보장하고, 기술관리가 수행될 수 있도록 지원하여야 함
※ 연구개발계획서 내 기술관리를 수용할 수 있는 추진 계획을 제시하여야 함
- 최종 연구성과물의 활용도 제고를 위하여, 후속 체계사업과 관련된 제반사항(시험
등) 지원 등을 성실히 수행하여야 함
제 7 절. 해외 수출면허 규정
본 사업의 개발품은 해외 수출면허 규정의 제한을 받지 않도록 개발하여야 함.
개발 특성상 해외 수출면허 부품사용이 불가피할 경우 이후 개발을 위한 대안이
나 대비계획을 제시하여야 함
제 8 절. 붙임
붙임은 본 제안요청서의 일부로 본다.
- 20 -
붙임#1. 보안유지 서약서
관 련 : 2021년도 스페이스파이오니어사업 세부과제 선정 관련
기술문서 습득
과 제 명 :
2021년 월 일
수 령 기 관 :
(인)
수 령 자 :
(인)
수령자 및 수령기관(이하 수령인)은 2021 스페이스파이오니어사업의 세
부과제 선정과 관련된 제안요청서에 부속한 기술문서를 수령함에 있어, 본
기술문서들이 보안 및 재산적 정보로 간주됨을 인정하고 동의합니다. 본
기술문서의 수령 목적은 오로지 2021 스페이스파이오니어사업의 세부과제
에 선정되기 위함이며, 수령인은 본 기술문서 상의 정보 및 검토과정에서
습득한 모든 정보와 지식을 자신의 재산적 정보를 보호하는 관리수준과 동
일한 정도로 타인에게 누설되지 않도록 보호하여야 함을 인정하고 동의합
니다. 수령인은 스페이스파이오니어사업단(이하 사업단)의 사전 서면 승인
없이 기술문서를 상기 관련에서 규정한 목적이외에는 사용할 수 없음을 인
정하고 동의합니다. 본 기술문서 뿐 아니라 이에 기반하여 복사 또는 복제
로 창출된 모든 기술적 정보는 사업단의 소유이며 세부과제 선정 과정 이
후, 사업단의 서면 요청 시점으로부터 30일 이내에 수령인의 선택에 의하
여 즉각 사업단에 반환되거나 파기되어야 하며, 파기의 경우 수령인은 상
기 서면 요청일로부터 30일 이내에 동 요청을 이행하였다는 서면 확인서를
사업단에 제공하여야 함에 동의합니다.
보안유지 서약서
- 21 -
붙임#2. 2차원 다채널 적외선검출기 규격서(2D Multi-band
IRFPU Specification)
- 별도문서 : SPPO-SP-302-000_Multi-band IRFPU Specification_Rev00.docx 참조
SPPO-SP-320-001 Space Pioneer Program Environmental Design
and Test Requirement Specification(환경시험 규격) 참조
* 상세기술자료는 스페이스파이오니어사업단(한국항공우주연구원 내)에 방문, 보안서약서(붙임#1
참조) 오프라인 제출 이후 직접 수령 가능
- 22 -
붙임3. 품질인증 요구규격 (General Unit Product
Assurance Requirements)
- 별도문서 : SPPO-D0-800-002 D.00, General Unit PAR.doc
Distribution Limitation (무단복사 배포금지), KARI Proprietary Data : The data contained in this document, without the
permission of KARI, will not be used or disclosed for any purpose other than Space Pioneer Program. The data subject to
this restriction is contained on all pages.
Korea Aerospace Research Institute
Space Pioneer Program Office
169-84 Gwahak-ro, Yuseong-gu, Daejeon, 34133,
Republic of KOREA
Space Pioneer Program
Product Assurance Requirements
for General Unit
Date: 15 April 2021
Doc. No: SPPO-D0-800-002
Issue: D.00
Total page: 93
Superseding N/A
Prepared By:
You gwang Kim DATE
Product Assurance, Space pioneer program
Reviewed by:
Seo yoon Lee
DATE
Woo jun Lee
DATE
Reliability Engineer
EEE Part Engineer
Chang-Ho Lee
DATE
Phil soo Kim
DATE
Contamination Engineer
M&P Engineer
DATE
DATE
Approval Signature:
Guen Young Park
DATE
Sang soon Yong
DATE
Head of SMART
Program Manager, Space Pioneer Program
Original SPOO Release ____________________
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REVISION / CHANGE RECORD
Issue/
Revision
DOCUMENT
DATE
REVISION / CHANGE DESCRIPTION
PAGES
AFFECTED
D.00
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All
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Table of Contents
과제에서 합의된 요구사항에 대한 적합성 입증(Compliance Demonstration
사업단 참여 보장(Access Right) ................................................................... 1
사실 기반 확인(Evidence based Verification) ................................................ 1
적합성점검표(Compliance Summary Table)................................................... 1
프로그램 기술관리 검토회의 (Program Review) - TBD (by 사업단) ........... 2
약어 및 정의 (Acronyms and Definitions) ............................................................. 2
제품보증 계획(PA program planning) .................................................................... 7
제품보증 조직/책임(PA Organization and Responsibilities)........................... 7
PA책임자의 협업(PA Management Interfaces) .............................................. 7
제품보증 이행계획서(PA Plan) ...................................................................... 8
제품보증계획 이행(PA Plan Implementation) ........................................................ 8
PA 진행연황보고(PA Status Reporting) ......................................................... 8
중요관리대상 관리(Critical Items control) ...................................................... 9
문서 작성 및 자료 관리(Documentation and Data control) .......................... 9
형상관리 관련 PA 역할(PA contribution to configuration management) ....... 9
부적합관리(Nonconformance control) .......................................................... 10
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Material, Part and Process Control (자재/부품/공정 관리) .................................. 12
EEE Parts Control (전기전자부품 관리) .............................................................. 12
Cleanliness and Contamination Control (청정도 및 오염 관리) ......................... 14
소프트웨어 보증(Software Assurance) ................................................................ 15
A.2.2. 관련 문서 및 참조문서(Applicable and Reference Documents) ............................. 16
A.2.3.1 제품보증 조직/인력 및 업무분장(PA Organization/Personnel and Activities) 16
A.2.3.7 소재 및 공정(Materials and Process, M&P) ................................................... 17
A.2.3.8 소프트웨어 품질보증(Software Assurance) .................................................... 17
A.2.3.9 청정도 및 오염관리(Cleanliness and Contamination Control) ....................... 17
B.1.1 PA Status Report 문서번호, 개정이력(Rev.000), 보고일자 ............................... 18
B.1.2 Milestone status (이행일자, 회의록 관리번호) ................................................... 18
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APPENDIX D. 프로그램 검토회의 (Program review) 수행 ...................................................... 26
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H.3. FAILURE MODE, EFFECTS, AND CRITICALITY ANALYSIS ..................................... 45
APPENDIX J. 자재/기계부품 및 공정 (Material, Mechanical Part and Process) ..................... 50
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J.9. MATERIALS, MECHANICAL PARTS AND PROCESSES LIST ................................... 55
[QUALITY REQUIREMENT FOR EEE PARTS FOR GEO] .......................................... 58
[QUALITY REQUIREMENT FOR EEE PARTS FOR LEO] .......................................... 58
K.3.3. Lot Acceptance Test and Quality Conformance Inspection ................................ 61
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Table K-1. QUALITY REQUIREMENT FOR EEE PARTS FOR LEO .................................. 66
Table K-2. QUALITY REQUIREMENT FOR EEE PARTS FOR GEO .................................. 72
APPENDIX L. 청정도 및 오염관리 (Cleanliness & Contamination Control) ............................. 78
L.3. EQUIPMENT CLEANLINESS REQUIREMENTS ......................................................... 78
L.4. CLEANLINESS REQUIREMENTS FOR TRANSPORTATION ..................................... 79
APPENDIX M. 소프트웨어 품질보증 (SOFTWARE QUALITY ASSURANCE) ......................... 80
M.10. DELIVERY, INSTALLATION, AND ACCEPTANCE .................................................... 82
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1. INTRODUCTION
1.1. GENERAL
1.1.1. 과제에서 합의된 요구사항에 대한 적합성 입증(Compliance Demonstration to
Consensus Requirements)
- 스페이스파이오니아사업에 참여하는 장비/유닛의 개발시 요구사항(Requirements)은
RFP문서에서 정하는 기본 요구사항(General Requirements)이다.
- 세부과제 주관기관은 기본 요구사항에 추가하여 목표로 하는 실용위성 또는 목표시장
에서 포지셔닝 하고자 하는 기대목표를 충족하기 위하여 추가적으로 필요한 요구사항
(Voluntary Consensus Standards/Specifications)을 제안하여야 한다.
- 세부과제 주관기관은 과제에서 정한 기본요구사항과 합의된 추가하고자 입증하고자 하
는 요구사항(Consensus Standards/Specifications)에 적합함을 입증(Demonstration of
Compliance to Requirements)하여야 한다.
1.1.2. 사업단 참여 보장(Access Right)
- 스페이스파이오니아 사업의 목적을 위해 필요한 활동을 이행할 수 있도록 사업단 또는
사업단이 지정한 대리인이 세부과제 주관기관의 시설(협력업체 및 참여기관을
포함한다.) 및 문서에 접근(제공을 포함한다.)할 수 있도록 협조하여야 한다.
지적재산과
관련한
내용을
포함하는
경우,
비밀유지합의서(Non-disclosure
agreement)와 같은 제도적 장치를 통해 문서 및 시설에 대한 접근을 보장할 수 있는
적극적인 방안을 고려하여야 한다.
1.1.3. 사실 기반 확인(Evidence based Verification)
- 세부과제 주관기관은 적합성에 대한 입증이 사실(설계, 해석, 시험, 검사, 도면,
절차서/표준서, 운용 매뉴얼/절차 등의 객관적인 증거)에 기반한 적합성 확인이 되도록
하여야 한다.
1.1.4. 적합성점검표(Compliance Summary Table)
- 세부과제 주관기관은 본 문서에 대한 적합성 입증계획 및 입증결과를 요약한
적합성점검표 (Compliance Summary Table)를 과제 착수시점에 작성하여 과제기간
동안 입증결과를 요약한 내용을 업데이트하여 재개정 관리를 이행하여야 하며,
과제종료시점에 최종본을 제출하여야 한다.
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1.1.5. 프로그램 기술관리 검토회의 (Program Review)
- 세부과제 주관기관은 다음의 개발품에 대한 검토회의(Design Reviews and/or EQSR,
MRR, TRR/PTR, PSR) 수행체계를 갖추어야 한다. 수행체계는 INPUT(작성문건,
발표자료 템플릿)과 OUTPUT(회의록, Action Item, Data Package)의 관리를 포함하여야
한다.
- 세부과제 주관기관은 검토회의와 관련하여 APPENDIX D를 참조한다.
- 기술관리 검토회의의 Go/No-Go Decision 권한은 사업단에게 있다.
1.2. 약어 및 정의 (ACRONYMS AND DEFINITIONS)
ABCL
As Built Configuration List
ACA
At Contract Award
AIT
Assembly, Integration, and Test
ASIC
Application Specific Integrated Circuit
ASTM
American Society for Testing and Materials
CADM
Configuration And Data Management
CCB
Configuration Control Board
CDR
Critical Design Review
CDRL
Contractual Document Requirements List
CFE
Customer Furnished Equipment
CI
Configuration Item
CIDL
Configuration Item Document List
CIL
Critical Items List
COC
Certificate of Conformance
CPPA
Centralized Part Procurement Agency
CVCM
Collected Volatile Condensable Mass
DDEF
Displacement Damage Equivalent Fluence
DDSF
Displacement Damage Sensitive Fluence
DPA
Destructive Physical Analysis
ESCC
European Space Component Coordination
EEE
Electrical Electronic, and Electromechanical
EGSE
Electrical Ground Support Equipment
EIDP
End Item Data Package
EM
Engineering Model
EMC
Electromagnetic Compatibility
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EOL
End of Life
EPPL
European Preferred Part List
ESA
European Space Agency
ESD
Electrostatic Discharge
ESR
Equipment Suitability Review
FDIR
Fault Detection, Isolation, and Recovery
FM
Flight Model
FMECA
Failure Modes, Effects, and Criticality Analysis
FTA
Fault Tree Analysis
GIDEP
Government Industry Data Exchange Program
GSFC
Goddard Space Flight Center
IC
Integrated Circuit
ICD
Interface Control Document
IOC
Interoffice Correspondence
KIP
Key Inspection Point
LAT
Lot Acceptance Test
LET
Linear Energy Transfer
M&P
Materials and Processes
MGSE
Mechanical Ground Support Equipment
MIL-STD
Military Standard
MIP
Mandatory Inspection Point
MMIC
Microwave Monolithic Integrated Circuits
MPCB
Material and Process Control Board
MRB
Material Review Board
MRR
Manufacturing Readiness Review
MUA
Material Usage Agreement
NASA
National Aeronautics and Space Administration
NCR
Non-Conformance Report
NDT
Non-Destructive Testing
NPSL
NASA Parts Selection List
NSPL
MIL-STD-975, NASA Standard Electrical, Electronics, and Electromechanical Parts
List
NVR
Nonvolatile Residue
PA
Product Assurance
PAD
Part Approval Document
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PAPP
Product Assurance Program Plan
PAR
Product Assurance Requirements
PCB
Part Control Board
PDR
Preliminary Design Review
PEM
Plastic Encapsulated Microcircuit
PIL
Part Identification List
PIND
Particle Impact Noise Detection
PM&P
Parts, Materials and Processes
PMPCB
Parts, Materials, and Processes Control Board
PPL
Preferred Part List
PPM
Part Per Million
PSA
Part Stress Analysis
PSR
Pre-Ship Review
QA
Quality Assurance
QCI
Quality Conformance Inspection
QPL
Qualified Part List
RF
Radio Frequency
RFA
Request for Approval
RFD
Request for Deviation
RFW
Request for Waiver
SEB
Single Event Burn Out
SEFI
Single Event Functional Interrupt
SEGR
Single Event Gate Rupture
SEL
Single Event Latch Up
SEP
Single Event Phenomenon
SES
Single Event Snap Back
SET
Single Event Transient
SEU
Single Event Upset
SOW
Statement of Work
TCI
Technology Conformance Inspection
TID
Total Ionizing Dose
TML
Total Mass Loss
TRR
Test Readiness Review
TQCM
Thermal Electrically Controlled Quartz Crystal Microbalance
UV
Ultraviolet Ray
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WCA
Worst Case Analysis
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2. APPLICABLE DOCUMENTS
Applicable documents and revision levels listed herein form a part of this document.
If any conflict arises between this PAR and those referenced, the requirements of this PAR shall
take precedence and govern until resolved by KARI.
2.1. US MILITARY AND NASA DOCUMENTS
MIL-STD-750
Test Methods for Semiconductor Devices
MIL-STD-883
Test Methods and Procedures for Microelectronics
MIL-STD-889 A
Dissimilar Metals
MIL-STD-975 M
NASA Standard Electrical, Electronics, and Electromechanical
Parts List
MIL-STD-981C
Design, Manufacturing and Quality Standards for Custom
Electromagnetic Devices for Space Applications
MIL-STD-1547 B
Electronic Parts, Materials, and Processes for Space and
Launch Vehicles
MIL-HDBK-217 F Notice 2
Reliability Prediction of Electronic Equipment
MIL-PRF-38534G
Hybrid Microcircuits, General Specification for
GSFC EEE-INST-002
Instructions for EEE Part Selection, Screening, Qualification,
and Derating
NASA-STD-(I)-6001A
Flammability, Off-gassing, and Compatibility Requirements and
Test Procedures
2.2. ESA DOCUMENTS
ECSS-E-30 Part 6A
Mechanical - Part 6: Pyrotechnics
ECSS-Q-ST-30-11C
Derating - EEE Components
ECSS-Q-60-11A
Derating and End-of-life Parameter Drifts - EEE Components
ECSS-Q-ST-60-02C
ASIC and FPGA Development
ECSS-Q-ST-60-12C
Design, Selection, Procurement and Use of Die-form Monolithic
Microwave Integrated Circuits
ECSS-Q-ST-60-14C
Relifing Procedure - EEE Components
ECSS-Q-70B
Materials, Mechanical Parts and Processes
PSS-01-608
Generic Specification for Hybrid Microcircuits
ECSS-Q-70-36A
Material Selection for Controlling Stress-corrosion Cracking
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3. 제품보증 관리(PRODUCT ASSURANCE MANAGEMENT)
3.1. 제품보증 계획(PA PROGRAM PLANNING)
3.1.1. 제품보증 조직/책임(PA Organization and Responsibilities)
- 스페이스파이오니아사업에 참여하는 위성용 장비 개발기관(이하 "세부과제 주관기관"
이라 한다.)은 책임과 권한을 갖는 제품보증 책임자(이하 "PA책임자"라 한다.)와 PA
엔지니어링(신뢰성, 안전성, 신뢰성, 재부품공정, 소프트웨어 보증) 담당자 및 PA 품질
/관리(품질관리, 오염관리, 구매관리, 안전관리) 관련 담당자를 지정하여야 한다.
[주기] 우주제품은 우주사용중 수리가 어려운 1회 개발/제작/사용의 특징을 갖는 제품군
이므로 개발/검증 단계에서부터 PA 책임자 및 전문 PA 인력의 참여가 필수적으로 요
구된다.
[주기] 별도의 PA책임자를 지정하지 않는 경우, 세부과제 주관기관 과제책임자(PM)가 PA
책임자의 기능을 겸하는 것으로 간주하여야 한다.
[주기] "전기전자부품 관리", "소프트웨어 보증"에 한해, 제품 개발 범위에 포함되지 않는
경우 해당 담당자를 두지 않아도 된다. 이 외의 모든 PA 분야에 대해서는 담당자를
지정하여야 한다.
- PA책임자는 PA 업무를 이행함에 있어서 PA 엔지니어링 담당자와 품질/관리 관련 담
당자의 업무를 관리하여야 한다.
3.1.2. PA책임자의 협업(PA Management Interfaces)
- 세부과제 주관기관은 PA책임자가 다음의 업무를 이행하도록 하여야 한다.
1) PA책임자는 PA 관련 이슈와 관련하여 세부과제 주관기관 과제책임자와 협력하여
야 한다.
2) PA책임자는 세부과제 주관기관내 형상관리, 위험관리, 체계종합, 엔지니어링 개발
부서와 PA 관련 이슈와 관련하여 협력하여야 한다.
3) PA책임자는 참여업체 및 Lower-Tier업체와의 PA 관련 이슈를 관리하여야 한다.
4) PA책임자는 과제의 기술검토회의(Design Review/EQSR, MRR, TRR, PTR, PSR)에
참여하여 PA 관련 이슈, PA 문서, PA 활동현황 등 PA 관련 내용을 제시하여야 한다.
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3.1.3. 제품보증 이행계획서(PA Plan)
- 세부과제 주관기관은 스페이스파이오니아 사업에서 정한 본 문서에 따른 장비 제품보
증요구사항(PA Requirements for General Unit)을 만족하는 제품보증 계획서를 스페이스
파이오니아 사업단에 작성하여 제출하고 이행하여야 한다. 제품보증 이행계획서(PAP,
PA Plan)의 문서 구성은 APPENDIX A를 참조한다.
[주기] 세부과제 주관기관은 향후 실용위성개발에 참여시에 고객이 발행하는 제품보증
요구사항(Subcontractor PA Requirements)을 만족하는 제품보증계획서를 작성하여 제
출하여야 하며, PA책임자는 고객의 Subcontractor PAR 요구사항에 따라 PA 관련 이슈
에 대응하여야 한다. 세부과제 주관기관은 Subcontractor PAR과 본 PAR for General
Unit의 목적과 다루는 범위가 차이가 있을 수 있음을 명확하게 인지하고 적절한 대책
을 수립하여 시행하여야 한다.
3.2. 제품보증계획 이행(PA PLAN IMPLEMENTATION)
3.2.1. PA 관리(PA management)
- 세부과제 주관기관은 설계 초기 단계부터 제품보증 요건에 대한 적합성을 고려한 설
계를 수행하여 PA 관련 이슈를 식별하고 관리하여야 한다.
- 세부과제 주관기관은 PA 이행계획을 구현하는 데 필요한 PA 자원을 식별하고 PA 작
업을 이행할 수 있는 자원을 제시하여야 한다.
- 세부과제 주관기관은 참여업체 및 Lower-Tier 협력업체가 본 문서 및 PA 이행계획에
따라 관리됨을 보증하여야 한다.
3.2.2. PA 진행현황보고(PA Status Reporting)
- 세부과제 주관기관은 PA책임자가 개발일정별로 요구되는 제품보증문서 현황 및 개
발중 발생하는 모든 PA 관련 이슈를 관리하여야 한다.
- PA책임자는 최소한 다음 사항을 포함된 PA 현황보고서(PA Status Report)를 작성하여
진행현황을 사업관리의 일부로 보고하여야 한다. PA 현황보고서는 정기적으로 보고되
는 과제현황보고서의 일부로 통합하여 관리할 수 있다. PA Status Report에 포함되어야
할 내용은 APPENDIX B를 참조한다.
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3.2.3. 중요관리대상 관리(Critical Items control)
- 세부과제 주관기관은 중요관리대상(Critical Item)을 식별하고 식별된 중요관리대상의
리스크를 제거(removal)하거나 완화(mitigation) 또는 원하지 않는 결과를 예방하기 위
하여 취해야 하는 방안을 포함하는 조치계획(action plan)을 수립하고 관리하여야 한다.
- 중요관리대상 관리와 관련하여 APPENDIX H를 참조한다.
3.2.4. 문서 작성 및 자료 관리(Documentation and Data control)
- PA 책임자는 PA 이행계획 실행에 필요한 활동이 이행되는 모든 장소에서 유효한 문
서 및 데이터가 사용될 수 있도록 하여야 한다. 유효하지 않은 문서 및 데이터는 사
용시점에 사용장소에서 제거되도록 하여 의도하지 않은 사용을 방지하여야 한다.
- PA 책임자는 PA 승인이 필요한 문서를 포함하여 승인이 필요한 과제문서를 식별하여
야 한다.
3.2.5. 품질기록(Quality Records)
- 세부과제 주관기관은 모든 PA 작업의 완전하고 성공적인 이행을 위한 객관적인 증
거를 제공하고 요구 사항 준수를 입증하기 위해 품질 기록 관리체계를 수립하고 유지
해야합니다.
3.2.6. 형상관리 관련 PA 역할(PA contribution to configuration management)
- PA 책임자는 형상관리활동의 일부로 참여하여 도면, 시험 계획/절차서, 규격서/절차서
(해당문서의 변경사항을 포함한다.)의 사용을 위한 배포(Release)가 적합한 지를 확인
해야 한다.
- PA 책임자는 설계형상(As-designed configuration status)이 문서로 모두 식별되었는 지
와 제작 착수전에 배포되는 지를 확인하여야 하며, 제작형상(As-built configuration
status)이 문서로 모두 문서로 식별 및 기록되어 제품과 함께 최종산출물(EIDP)의 일
부로서 제공되도록 하여야 한다.
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3.2.7. 부적합관리(Nonconformance control)
- 세부과제 주관기관은 고객(향후 실용위성 개발기관 또는 차상위 서브시스템/장비유닛
개발기관)에게 주의 및 판단이 필요한 정보를 제공할 수 있도록, 개발중 발생한 모든
제작/시험/시험운용 중 발생하는 부적합과 이에 대한 처리내용 및 예방조치를 포함하
는 정보를 제공할 수 있는 체계를 수립하여 운용하여야 한다.
- 부적합기록(Nonconformance Record) 체계, 부적합검토위원회(MRB) 구성, 부적합검토
위원회(MRB) 회의록 체계 등을 포함하여야 한다.
- 세부과제 주관기관은 부적합관리 계획 수립시 APPENDIX E을 참조한다.
- 개발단계에서 부적합은 인정되지 않는 것이 일반적이다. 따라서 세부과제 주관기관은
Major 부적합은 설계 변경을 통해 제품의 특성으로 반영하는 것을 원칙으로 하여야
한다.
[주기] 세부과제 주관기관은 개발단계에서 고객(Satellite System Integrator) MRB에 의한
피드백을 받을 수 없음을 인지하여야 하며, 향후 이러한 MRB에 대응하는 체계를 갖
추어야 한다. 세부과제 주관기관에서 수용한 NCR은 향후 고객(Satellite System
Integrator)에게 보고되어야 하며, 최종 판단권한은 고객에게 있음을 인지하여야 한다.
3.3. CONFIGURATION CONTROL (형상관리)
- 세부과제 주관기관은 형상관리계획 수립시 APPENDIX F를 참조한다.
- 개발단계에서 규격에 대한 RFD/RFW를 통한 면제 처리는 인정되지 않는 것이 일반적
이다. 따라서 세부과제 주관기관은 RFD/RFW로 예상되는 규격 불일치는 설계 변경을
통해 제품의 특성으로 반영하거나, 재재작/재시험 등을 통해 규격을 만족함을 보여야
한다.
[주기] 세부과제 주관기관은 개발단계에서 고객(Satellite System Integrator) CCB에 의한
피드백을 받을 수 없음을 인지하여야 하며, 향후 이러한 CCB에 대응하는 체계를 갖
추어야 한다.
4. PA 기능별 요건(PA REQUIREMENTS PER DISCIPLINES)
4.1. QUALITY ASSURANCE (품질보증)
- 세부과제 주관기관은 APPENDIX G를 만족하는 제품보증 관리 계획을 수립하여 이행
하여야 한다.
- 세부과제 주관기관은 세부과제 주관기관 내에 제품개발에 적합한 품질보증 체계를 수
립하여 이행할 책임이 있다.
[주기] ISO9001, AS9100, TS16949와 같은 품질경영시스템 인증이 별도로 개발하고자 하
는 우주개발품의 업무범위를 포함하고 있지 않는 한, 우주개발에 적합한 품질경영시
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스템을 갖추고 있음으로 해석되지 않아야 한다. AS9100 항공우주 품질경영시스템의
목적에서 선언하고 있는 바와 같이, 고객 및 제도적 요건을 반영한 품질경영시스템을
구축하여 운용하기 위해 노력해야 한다.
- 세부과제 주관기관은 구매품(하드웨어, 소프트웨어 및 서비스)의 구매관리 체계 수립
시, 추적성 확보를 위해 사용 자재의 원재작자 보증서(Original Manufacturer's COC)가
확보될 수 있도록 구매요구사항의 일부로 기술하고 인수검사시 이를 확인하여야 한다.
- 세부과제 주관기관은 개발단계에서 고객(Satellite System Integrator)에 의한 고객검사
(MIP, Mandatory Inspection Point)의 지정 및 실행에 의한 피드백을 받을 수 없음을 인
지하여야 하며, 고객검사 수준의 기능적으로 독립적인 인력에 의한 전문적인 자주검
사(KIP, Key Inspection Points)가 수행될 수 있도록 검사체계를 구축하여야 한다.
- KIP/MIP 검사를 상정하는 경우 다음을 고려하여야 한다.
1) 중요공정(critical process)이 수행된 후 실시
2) 후속공정에서 검사를 위한 접근이 불가한 경우 후속공정전 실시
3) 메카니즘의 조립 기간동안 실시
4) Safety Critical Item의 장착 과정동안 실시
5) Qualification Test 및 Acceptance Test 전/후 실시
4.2. RELIABILITY (신뢰성)
- 세부과제 주관기관은 APPENDIX H를 만족하는 신뢰성 관리 계획을 수립하여 이행하
여야 한다.
- 세부과제 주관기관은 목표로 하는 실용위성 또는 목표시장에서 포지셔닝 하고자 하는
기대목표를 충족할 수 있는 신뢰도를 제안하고, 이를 만족하도록 신뢰도예측보고서
(Reliability Prediction Report)를 통해 이를 입증하여야 한다.
- 세부과제 주관기관은 고장모드, 영향 및 치명성분석(FMECA)을 수행하고 Single Point
Failure, Critical Item, Limited Life Item 등을 식별하여야 한다. 세부과제 주관기관은
FMECA의 세부과제 주관기관 설계부서에서 주관하도록 업무 분장하여야 하고, Critical
Item으로 식별된 항목이 적합하게 검증되는 지를 PA에서 확인하도록 업무 분장하여
야 한다.
- 세부과제 주관기관은 전기전자 유닛의 경우 PSA를 수행하여야 한다.
- 세부과제 주관기관은 전기전자 유닛의 경우 WCA를 수행하여야 한다.
- 세부과제 주관기관은 실용위성 사용을 목표로 하는 장비/유닛이 Limited Life Item에 해
당하는 경우, Life cycle test 프로그램 계획을 수립하고 이행하여야 한다.
4.3. SAFETY (안전성)
- 세부과제 주관기관은 APPENDIX I를 만족하는 안전관리 계획을 수립하여 이행하여야
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한다.
4.4. MATERIAL, PART AND PROCESS CONTROL (자재/부품/공정 관리)
- 세부과제 주관기관은 APPENDIX J를 만족하는 자재/부품/공정관리 계획을 수립하여
이행하여야 한다.
- 세부과제 주관기관은 Prohibited/Restricted Material이 사용되지 않도록 설계에 반영하
여야 한다. Prohibited/Restricted Material로 식별되는 경우 Critical Item으로 식별하고,
Hermitically sealing과 같은 Mitigation 방안 또는 유사한 기능을 수행하는 대체 물질의
활용을 통한 Removal 방안 등을 조치계획을 수립하여야 한다.
- 세부과제 주관기관은 기존 실용위성 개발에서 공정역량이 확인된 기관의 공정(KARI-
approved Process or NASA/ESA Space Heritage Process)을 최대한 활용하여야 한다.
그렇지 않은 경우, 별도의 공정검증계획서를 구체적으로 수립/제시하고 이를 공식적으
로 승인받아야 한다.
- 세부과제 주관기관은 Non-standard/Non-qualified Parts/Process가 포함된 경우, 공정검
증 및 사용가 판정을 위해 추가적인 비용/일정/시간이 소요되는 것이 검증된 우주제품
의 특징임을 인지하고 이에 대한 고려를 하여야 한다.
- 세부과제 주관기관은 DML(재료목록), DMPL(기계부품목록), DPL(공정목록)을 설계완료
시점에서 공식적으로 제시하고 승인받아야 하며, 해당 내용의 정보와 도면, 작업지시
서(Shop Order, Traveler), 작업기록, 검사기록 등의 정보가 일치하는 지를 교차 검증하
여야 한다.
4.5. EEE PARTS CONTROL (전기전자부품 관리)
- 세부과제의 주관기관은 APPENDIX K를 만족하는 전기전자부품관리 계획을 수립하여
이행하여야 한다.
- 표준부품의 사용 : 세부과제 주관기관은 목표로 하는 APPENDIX K 적용시, 개발품이
저궤도위성에만 사용되는 경우 Table K-1. EEE Part Quality For LEO을 참조하며, 그 이
외의 중궤도위성, 정지궤도위성, 달탐사 등에서 사용을 목표로 하는 경우에는 Table
K-2. EEE Part Quality For GEO를 참조하여 표준부품을 사용하여야 한다.
- 비표준부품의 사용 : QM을 개발하는 경우, 표준부품과 form, fit, function이 동일한 비
표준부품을 사용할 수 있다. 이 경우에 part identification list에 향후 FM 개발 시 사용
될 부품의 부품번호와 본 과제에서 사용하는 QM 부품의 부품번호를 모두 기록해야
한다. 표준부품과 form, fit, function이 동일한 비표준부품이 없는 경우, QM제품에도 표
준품을 사용해야 한다. 표준부품과 form, fit, function이 동일한 비표준부품을 사용하는
경우, 부품제조사의 시험/검사를 생략하고 수입검사만을 진행할 수 있다.
- 상용부품의 사용 : Form, fit, function이 동일한 표준부품이 존재하지 않는 비표준부
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품은 상용부품으로 정의하며, 상용부품의 사용은 최소화해야 한다. 비용이나 개발기간
단축의 목적으로 상용부품을 사용할 수 없으며, 유사한 성능이나 기능을 갖는 표준부
품이 없으며 기능을 구현하는데 불가피한 경우에만 사용이 가능하다.
- 상용부품 사용 시에는 해당 부품이 설계변경 없이 FM에도 사용될 수 있다는 것을
보증을 위하여, QM 하드웨어 제작 착수 전 해당 상용부품에 대하여 EEE-INST-002
요구사항에 따라서 screening 및 qualification이 완료되어야 한다. 만약 해당 부품에
대하여 EEE-INST-002의 screening 및 qualification 내용을 포함하는 시험성적서 또는
이와 동등한 수준의 시험성적서를 확보할 수 있는 경우 시험의 면제가 가능하다. 또
한 부품 종류별로 3개씩 DPA를 수행하여야 한다.
- APPENDIX K 9.4에 명시된 특수한 부품은 EEE-INST-002가 아닌 APPENDIX K 9.4에
명시된 문서를 따라서 시험을 수행한다.
- 우주용 규격에 따른 시험 데이터가 없는 상용부품을 선정하는 경우, EEE-INST-002에
따른 시험 결과 또는 방사선 시험결과가 요구사항을 만족하지 못하면 새로운 부품을
선정해야 한다. 세부과제의 주관기관은 상용부품의 사용 시, 시험 결과가 우주부품 요
구사항을 만족하지 못하면 새로운 부품의 납기 소요 및 방사선 시험 기간 소요, 설계
변경 기간 소요 등으로 프로젝트 기간 내 QM의 개발 및 검증을 완료할 수 없는 리스
크가 있음을 인지하여야 한다. 원칙적으로 상용부품은 불가피한 경우를 제외하고는
사용하지 않아야 하며, 상용부품을 사용하더라도 screening, qualification 및 방사선 시
험 데이터가 존재하여 우주용으로 사용가능함이 알려진 부품을 선정해야 한다.
- 표준품을 포함한 모든 능동소자 부품에 대해서는 ECSS-Q-ST-60-15C 및 APPENDIX
K를 따라서 radiation analysis report를 작성해야 하며, 이 때 사용하는 radiation data는
제조사에서 제공하는 데이터, 또는 최근 4년 이내에 시험결과를 인용해야 한다. 데이
터 확보가 불가능한 경우 APPENDIX K의 radiation hardness 요구사항에 따라서 방사
선 시험을 수행하여 데이터를 확보해야 한다.
- QM 제작 착수 전 부품의 스크리닝, Lot 수락시험 결과보고서 작성 및 radiation
analysis report, part identification list 작성이 완료되어야 한다.
- Single event effect 중 부품에 영구적인 손상을 주는 효과의 LETth가
60 MeV∙cm2/mg
보다 작은 경우 사용을 금지한다. Single event effect 중 부품의 오동작을 발생시키는
효과는 LETth가
60 MeV∙cm2/mg 보다 작은 경우 다른 부품으로 교체를 검토하거나,
이를 억제할 수 있는 설계(필터, TMR, EDAC 등)를 구현해야 한다. Radiation analysis
report에는 구현한 설계를 반영하여 년간 오동작 발생횟수를 예측하여 기술하여야 한
다. 궤도환경은 개발된 과제를 통하여 제품이 사용될 것으로 예상되는 궤도를 개발
기관의 책임 하에 모사하여 적용한다.
- 세부과제의 주관기관은 자체적인 PMPCB 또는 이에 준하는 회의체를 구성하여 QM
에 사용되는 모든 전기전자부품에 대한 적합성 여부를 검토하여야 하며, 필요 시 스
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페이스파이오니아 사업단의 요구에 의하여 회의내용 및 관련 문서를 확인할 수 있도
록 관리하여야 한다.
- Part Identification List에 들어가는 내용은 ECSS-Q-ST-60C rev.2의 Annex B를 따른다.
- 세부과제의 주관기관은 APPENDIX K의 subcontractor와 customer 역할을 동시에 수
행한다. 만약 협동연구기관(공동연구기관, 위탁연구기관 등)에서 납품받는 전기전자
부품이 있다면 이 부품에 대하여 주관기관은 customer 역할을 하며, 협동연구기관은
subcontractor 역할을 갖는다.
- 세부과제 주관기관의 전기전자부품 담당자는 상기 역할을 수행하기 위하여 ECSS-Q-
ST-60C, ECSS-Q-ST-60-15, EEE-INST-002 문서 및 연관 문서의 내용을 충분히 이해
하여야 한다.
4.6. CLEANLINESS & CONTAMINATION CONTROL (청정도 및 오염 관리)
- 세부과제 주관기관은 장비/유닛의 개발시 청정도를 고려한 설계하여야 한다.
- 설계 베이스라인이 청정도 요구사항과 불일치하는 경우, 설계변경 대상으로 식별하고
시정조치를 이행하여야 한다.
- 세부과제 주관기관은 사용을 목표로 하는 실용위성, 위성개발 프로세스상의 단계, 상
위 서브시스템/유닛에 요구되는 적합한 청정도 및 오염관리 기준을 설정하여야 한다.
- Cleanliness Level guidelines
1) Unit including Mirror, Lens, Focal Plan and Contamination critical items,
handling/testing: Cleanroom class 1,000 or better
2) Other unit handling/testing: Cleanroom class 100,000 or better
3) General integration/assembly/testing: Cleanroom class 100,000 or better
- Outgassing (RML and CVCM) guidelines
1) 최소 Outgassing 기준은 RML <1%, CVCM<0.1%으로 한다. 기준을 초과하는 경우,
RFA를 작성하고 사용에 대한 정당성(Justification)을 제시하여야 한다.
2) 오염민감품목 주변 자재의 Outgassing 기준은 다음을 참조한다.
Mass of material concerned(gram)
around Room Temp.
CVCM
(%)
RML
(%)
>100
<0.01
<1
10 ~ 100
<0.05
<1
<10
<0.1
<1
Mass of material concerned(gram)
below Room Temp.
CVCM
(%)
RML
(%)
>100
<0.01
<0.1
10 ~ 100
<0.05
<1
<10
<0.1
<1
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- 세부과제 주관기관은 제작/조립/시험/보관/운송/궤도임무 기간 동안 세부과제 주관기관
이 설정한 청정도 및 오염관리 기준을 만족하기 위한 관리계획을 수립하여 시행하여
야 한다. 장비/유닛의 클린룸 시설 수준 및 노출시간 등이 청정도 요구사항을 만족하
는 지를 확인할 책임은 세부과제 주관기관에 있다.
- 세부과제 주관기관은 조립/운송/위성체 발사장 작업에서 고려하여 할 주의사항
(Precautions)과 조치방안(Provisions)을 제시하여야 한다.
- 세부과제 주관기관은 분자오염(Molecular contamination)을 저감하기 위한 조치로 수행
되는 Bake-out 요건(수행시점/온도/시간) 설정하여야 한다. 오염민감품목의 경우 비행
궤도(In-orbit)에서의 교차오염(Cross-contamination)을 예방하기 위한 궤도상 Bake-out
요건을 포함하여야 한다.
- 청정도 및 오염관리 계획 수립시 APPENDIX L를 참조한다.
4.7. 소프트웨어 보증(SOFTWARE ASSURANCE)
- 소프트웨어 개발을 포함하는 경우, 세부과제 주관기관은 소프트웨어 보증 계획을 수
립하여 시행하여야 한다. 소프트웨어 보증 계획은 PA 계획서의 일부로 작성하거나 별
도 문서로 작성할 수 있다.
- 소프트웨어 보증 계획 수립시 APPENDIX M를 참조한다.
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APPENDIX A. 제품보증 이행계획서 (PAP)의 구성
A.1 일반사항
- PAP 구성요구사항 중 "소프트웨어 보증"과 같이 개발하는 장비/유닛에 포함되지 않는
경우, 해당 절(Section)은 유지하고 비적용(Not Applicable)으로 본문에 기술한다.
- 표지를 포함하여야 한다.
- 문서관리 번호(제/개정 번호 포함)를 포함하여야 한다.
- 작성자, 세부과제 주관기관책임자(Project Manager), 제품보증책임자(PA Manager)의 서
명을 포함하여야 한다.
- 목차를 포함하여야 한다.
- 제/개정 이력을 포함하여야 한다.
- 개정 이력(Rev., 제개정일자, 제/개정 내용 및 관련 문서위치(Section) 정보)를 포함하여
야 한다.
A.2 구성
A.2.1. 일반사항(GENERAL)
- 작성의 목적, 목표 및 이유를 제시한다.
[주기] PAP의 목적은 세부과제 주관기관이 정한 임무목표와 관련하여 우주제품의 품질
을 보장하고 해당 PA 요구사항에 적합함을 입증하기 위해 세부과제 주관기관이 이행
하는 활동을 기술하기 위한 것이다. 사용을 목표로 하는 실용위성 구분, 위성개발 프
로세스상의 단계, 상위 서브시스템/유닛 등에 대한 정보를 포함한다.
A.2.2.
관련 문서 및 참조문서(APPLICABLE AND REFERENCE
DOCUMENTS)
2.1 관련 문서(Applicable Documents)
2.2 참조 문서(Reference Documents)
A.2.3. 제품보증 관리(PA MANAGEMENT)
A.2.3.1 제품보증 조직/인력 및 업무분장(PA Organization/Personnel and Activities)
- 본 문서의 본문 "제품보증 계획(PA program planning)" 요구 사항을 충족하기 위해 적
용할 활동, 프로세스 및 절차를 제시한다. 조직/인력(책임과 권한 포함)을 포함하여야
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한다.
[주기] 해당 제품보증 요구 사항을 충족하기 위해 개발기과에서 적용할 활동, 프로세스
및 절차를 제시한다.
A.2.3.2 제품보증 이행(PA Implementation)
본 문서의 본문 "제품보증계획 이행(PA Plan Implementation)" 요구 사항을 충족하기
위해 세부과제 주관기관에서 적용할 활동, 프로세스 및 절차를 제시한다.
A.2.3.3 품질보증(Quality Assurance)
품질보증을 이행하기 위해 세부과제 주관기관에서 적용할 활동, 프로세스 및 절차
를 제시한다.
A.2.3.4 신뢰성(Reliability)
신뢰성 요구사항을 충족하기 위해 적용할 활동, 프로세스 및 절차를 제시한다.
A.2.3.5 안전성(Safety)
안전 요구사항을 충족하기 위해 세부과제 주관기관에서 적용할 활동, 프로세스 및
절차를 제시한다.
A.2.3.6 전기전자부품(EEE Parts)
EEE 부품 요구사항을 충족하기 위해 세부과제 주관기관에서 적용할 활동, 프로세
스 및 절차를 제시한다.
A.2.3.7 소재 및 공정(Materials and Process, M&P)
재료 및 공정 요구사항을 충족하기 위해 세부과제 주관기관에서 적용할 활동, 프로
세스 및 절차를 제시한다.
A.2.3.8 소프트웨어 품질보증(Software Assurance)
소프트웨어 보증 요구사항을 충족하기 위해 세부과제 주관기관에서 적용할 활동,
프로세스 및 절차를 제시한다.
A.2.3.9 청정도 및 오염관리(Cleanliness and Contamination Control)
청정도 및 오염관리 요구사항을 충족하기 위해 세부과제 주관기관에서 적용할 활동,
프로세스 및 절차, 시설을 제시한다.
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APPENDIX B. PA 현황보고서 (PA STATUS REPORT) 포함내용
B.1 구성
B.1.1 PA Status Report 문서번호, 개정이력(Rev.000), 보고일자
B.1.2 Milestone status (이행일자, 회의록 관리번호)
- Kick off Meeting, Design Review, MRR, TRR, PTR, PSR
B.1.3 EEE Part status
- 미승인 부품 status(mitigation plan 포함)
- DCL 문서 발행 현황(작성 및 개정 Rev.)
- Part Approval Document of EEE Part (PAD)
B.1.4 Material, Mechanical Part, Process status
- 미승인 자재/부품/공정 status(mitigation plan 포함)
- Request for Approval of M&P(RFA)
- DML 문서 발행 현황(작성 및 개정 Rev.)
- DMPL 문서 발행 현황(작성 및 개정 Rev.)
- DPL 문서 발행 현황(작성 및 개정 Rev.)
B.1.5 Nonconformance status
- 사내 별도관리 되는 경우, 관리문서번호로 표시
B.1.6 KIP/MIP status
B.1.7 Critical Items (including mitigation plan status)
B.1.8 PA Documentation Status
- FMECA 문서 발행 현황(작성 및 개정 Rev.)
- PSA 문서 발행 현황(작성 및 개정 Rev.)
- WCA 문서 발행 현황(작성 및 개정 Rev.)
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B.2 참조
B.2.1 EEE Part status
B.2.2 Material, Mechanical Part, Process status
- 공정검증 대상 식별 및 진행현황
- 공정검증 식별 현황, 추가적인 공정검증이 필요한 공정 진행현황을 관리하여야 한
다. 실용위성에서 검증된 이력이 없는 시설/기관에서 이행되는 공정은 비승인 공정으
로 판단되어야 하며, 적절한 공정검증 표준에 따라 공정검증 계획 수립, 계획에 따른
검증 진행, 결과보고서의 작성을 통해 공정의 적합성을 확보하여야 한다.
a. 공정검증 기준으로 사용되는 표준서의 식별
b. 공정검증 기준에 따른 적절한 시설, 장비의 식별
c. 공정검증 기준에 따른 시편, 시험종류 및 절차, 검사 종류 및 절차 식별
d. 공정검증 기준에서 정한 기준을 만족하는 결과에 대한 판단
B.2.3 Nonconformance status
세부과제 주관기관의 NCR 관리체계에 따라 발생 이력/조치현황 관리
B.2.4 KIP/MIP status
작성문서현황: 계획된 자주검사(KIP, Key Inspection Points)에 따라 이행한 검사결과
현황 및 생성된 검사보고서 목록(일자, 관리번호, 검사결과 등)
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APPENDIX C. 제품보증 양식 (FORMS)
This section describes the minimum information should be included in the PA forms. The
Subcontractor can use his own report form if his form includes all the contents of the template
provided in this Section.
C.1. 변경제안서 (Change Proposal)
Change Proposal shall include at least following information:
1 : Document number for change proposal
2 : Title of change proposal
3 : Applicable CI number
4 : Applicable model type (FM, PFM, EM, etc.)
5 : Applicable serial number
6 : Class of change (class 1, class 2)
7 : Affected documents due to this change
8 : Price influence due to this change
9 : Schedule influence due to this change
10 : Description of changes
11 : Reasons for changes
12 : Subcontractor
’s CCB approval
13 : KARI
’s CCB approval
C.2. 면제요청서 (Request for Waiver)
1 : Document number for RFW
2 : Title of RFW
3 : Applicable part number
4 : Applicable model type (FM, PFM, EM, etc.)
5 : Applicable serial number
6 : Document number of drawing or specification for applicable product
7 : Description of RFW
8 : Reasons for RFW
9 : Any adverse effect expected due to this waiver
10 : Document number for applicable nonconformance report
11 : Subcontractor
’s MRB approval
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12 : KARI
’s MRB approval
C.3. 완화요청서 (Request for Deviation)
1 : Document number for RFD
2 : Title of RFD
3 : Applicable part number
4 : Applicable model type (FM, PFM, EM, etc.)
5 : Applicable serial number
6 : Part number of next assembly
7 : Document number of drawing or specification for applicable product
8 : Description of RFD
9 : Reasons for RFD
10 : Any adverse effect expected due to this deviation
11 : Document number for applicable nonconformance report
12 : Subcontractor
’s CCB approval
13 : KARI
’s CCB approval
C.4. 부적합보고서 (Nonconformance Report)
1 : Document number for nonconformance report
2 : Title of nonconformance report
3 : Applicable part number
4 : Applicable model type (FM, PFM, EM, etc.)
5 : Applicable serial number
6 : Description of nonconformance
7 : Classification of nonconformance (major, minor)
8 : Cause of nonconformance
9 : Subcontractor
’s MRB disposition proposal
10 : Any corrective actions proposed by Subcontractor
’s MRB
11 : Subcontractor
’s MRB approval
12 : KARI
’s MRB approval
C.5. 전기전자부품 식별목록 (PID ; EEE Part Identification List)
1 : Part number (commercial equivalent designation)
2 : Family
3 : Part type or Electrical function
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4 : Package
5 : Value or range of values with tolerance for non-qualified parts (optional)
6 : Description of the part
7 : Component manufacturer / Country
8 : Generic procurement specification
9 : Detail procurement specification (with issue and revision for non-qualified parts/commercial
parts)
10 : Specification amendment (including issue and revision),
11 : Name of the procurement agent (CPPA, supplier, distributor),
12 : Quality level and lot test (ESCC LAT or LVT, MIL TCI or QCI or CI),
13 : Space qualified status (yes or no),
14 : RVT (yes or no),
15 : Reference of the PAD or Justification Document, where required,
16 : Approval status of the part,
17 : Change identification between each PIL issue,
18 : Date
‐code (only for as-built PIL).
C.6. 부품승인문서 (PAD ; Part Approval Documents)
1 : Doc No - Unique sequential number
2 : Issue of document
3 : Date of issue
4 : Name of project using the part
5 : Name of the person submitting the PAD
6 : Name of the company submitting the PAD
7 : Family - Capacitor, resistor, etc.
8 : Group - Ceramic, tantalum, etc.
9 : Part Number in accordance with the procurement specification. It may be generic to cover
different range of parts. (e.g. range of resistors or capacitors or variants for connectors &
accessories)
10 : Commercial Equivalent Designation
11 : Technology/Characteristics - Additional details of the components covered by the PAD
12 : Pure tin free (Y/N) When tin ≥ 97% (inside the component and terminations)
13 : Generic specification
14 : Detail specification with issue and revisions only required for non-qualified parts
15 : Specification Amendment Relevant specification with issue and revisions
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16 : Quality level as defined in Section K.
17 : Procurement by - Identify the name of the company procuring the part. This can be
Subcontractor himself, CPPA, distributor, or a combination thereof.
18 : Manufacturer/Country
19 : Approval status - Information about known approvals (EPPL, ESCC, ESCC/QML, MIL,
MIL/QML, or other approvals / previous usage.)
20 : Evaluation program required - Y/N as applicable
21 : Procurement inspections and test - Y/N as applicable
22 : DPA sample size
23 : Complementary tests Testing/Inspection in addition to that defined in the procurement
specification shall be identified, e.g. PIND, up screening,
24 : Lot Acceptance - Identify level and subgroups
25 : Radiation Hardness Data for Total Dose.
26 : Radiation Hardness Data for SEL / SEU / SET / SEFI / SEB / SEGR, others
– LETth and
Cross-section, etc.
27 : Evaluation Test Data reference - Reference of the test report for Total Dose, Single Event
Latch up / Single Event Upset / Single Event Transient / Single Event Functional Interrupt /
Single Event Burn out / Single Event Gate Rupture. Radiation test report shall include data
source information.
28 : RVT Radiation Verification Test - Y/N as applicable
29 : Remarks - Any additional information
30 : Approval customer - Signature signifies acceptance
31 : Approval first-level supplier
C.7. 구매규격 (Procurement Specification)
1 : A description of the purpose, content and the reason prompting its preparation,
2 : A list of the applicable and reference documents,
3 : Any additional terms, definitions or abbreviations,
4 : Absolute maximum ratings,
5 : Electrical and mechanical parameters and limits,
6 : Screening, burn-in, and acceptance requirements,
7 : Package material and lead finish,
8 : Documentation/data requirements,
9 : Delta limits when applicable,
10 : Criteria for percent defective allowable,
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11 : LAT or LVT, QCI or TCI,
12 : Marking,
13 : Storage requirements,
14 : Requirements for lot homogeneity,
15 : Serialization (when applicable),
16 : Protective packaging and handling requirements,
17 : Radiation Verification Testing requirements, when applicable.
C.8. 승인요청서 (Request for Approval)
1 : Document number for materials approval document
2 : Category of the material (adhesive, screw, etc.)
3 : Chemical nature of the material
4 : Material name
5 : Manufacturer
6 : Document number of generic specifications
7 : Document number of detail specification
8 : Specification amendment information
9 : Quality level of the material
10 : Compliance status to the program requirements
11 : Reference of applicable qualified part list
12 : Heritage program information
13 : Environmental condition of application
14 : Document number of applicable process specification
15 : Description of application
16 : Rational for application of the material (In case of noncompliant material)
17 : Plan for supplementary verification
18 : Deliverable documents list
19 : Subcontractor
’s MPCB approval
20 : KARI
’s PMPCB approval
C.9. 재료 식별목록 (Materials Identification List)
1 : Document number for materials identification list
2 : Part number of EI
3 : Revision status
4 : Part number of the material
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5 : Materials name
6 : Description of the material
7 : Document number of specifications
8 : Chemical nature of the material
9 : Application purpose
10 : The location where the material is used
11 : TML characteristics
12 : CVCM characteristics
13 : Reference of outgassing information
14 : Document number of applicable process specification
C.10. 공정 목록 (Process List)
1 : Document number for process list
2 : Part number of EI
3 : Revision status
4 : Name of the process
5 : Description of the process
6 : Document number of process specification
7 : Main parameter of the specification
8 : Application Purpose
9 : The location where the material is used
10 : Flight materials used in the process
11 : Process heritage or qualification information
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APPENDIX D. 프로그램 검토회의 (PROGRAM REVIEW) 수행
The Subcontractor shall maintain a review process for the End Product. This review process will
consist of Design Reviews, MRR, TRR, and PSR.
The Subcontractor shall notify Customer (Satellite System Integrator) of the agenda 15 working
days before scheduled meeting.
In case Customer (Satellite System Integrator) participates in the reviews, Customer (Satellite
System Integrator) shall have the right to make a
“Go” or “No Go” decision.
Meeting minutes and action items from the reviews shall be documented and provided to
Customer (Satellite System Integrator).
D.1. DESIGN REVIEWS
The PDR and CDR shall evaluate the ability of the End Product to meet the program
requirements such as PAR, equipment specification, and interface control documents.
For the End Product which is already developed and qualified in the previous program, ESR
may substitute for Design Reviews.
During the review process, at least the following information shall be provided:
a. Compliance status to the design requirements including qualification status
b. Schematics or major characteristics of the design
c. Analysis results
D.2. MANUFACTURING READINESS REVIEW
The MRR shall evaluate the preparedness of the Subcontractor’s manufacturing processes for
fabricating the End Product to the standards described by this PAR. During the review process,
at least the following information shall be provided:
a. Configuration status
b. Manufacturing flow and instruction for critical process
c. Any design changes form the CDR baseline
D.3. TEST READINESS REVIEW
The TRR shall evaluate the preparedness of End Products and
the Subcontractor’s processes
for the testing of End Product to the applicable specifications. During the review process, at
least the following information shall be provided:
a. Configuration status
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b. Nonconformance status
c. Compliance Matrix which shows test criteria and specification requirements
d. Test procedures
D.4. PRE-SHIP REVIEW
The PSR shall evaluate compliance to the applicable requirements and the completeness of the
activities required by the contract. During the review process, at least the following information
shall be provided:
a. Summary of open actions during contract period
b. Requirement compliance status
c. EIDP documents
d. Configuration status
e. Nonconformance status
f. Acceptance test and analysis results
g. Contractual deliverable status
h. Visual inspection of the End Product
D.5. ASSURANCE STATUS REPORTS
The Subcontractor shall report periodically on the status of the PA Program as part of the
progress report. The following subjects shall be addressed in the progress report as
appropriate:
a. Significant or unsolved PA issues
b. Summary of waiver and deviation requests
c. Summary of nonconformance and failures
d. Summary of configuration changes
e. Summary of key inspection and test activities
f. Status summary of PAD, RFA, and nonconventional processes
g. Change summary of EEE part, materials, and processes list
h. Results of trend analyses and alerts surveys
i
. Status of procurement and Supplier’s PA Program
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APPENDIX E. 부적합관리 (NONCONFORMANCE CONTROL)
E.1. GENERAL
The Subcontractor shall establish and maintain a nonconformance control system in order to
track nonconformances systematically and to prevent reoccurrence. The system shall provide a
disciplined approach to the identification and segregation of nonconforming items, recording,
reporting, review, and disposition of nonconformances, and the implementation of corrective
actions.
Overstress analyses are required for nonconformances which occur during the unit test or
during operation susceptible to overstress of other components.
All nonconformances shall be closed prior to product shipment.
E.2. NONCONFORMANCE
E.2.1. Nonconformance Classification
Nonconformances shall be classified into minor or major on the basis of the severity of their
consequences.
Major nonconformances are those with possible impact on:
A. Unit performance including life duration, environmental compatibility, etc.
B. Unit interfaces or environmental characteristics such as thermal, vibration, RF, EMC, etc.
C. Unit reliability, especially due to the part problem.
D. Unit operation such as impacts on the operation manual, additional operational constraints,
etc.
Disposition of the major nonconformances shall be submitted to Customer (Satellite System
Integrator)’s MRB for review and approval before implementation.
Minor nonconformances are all other nonconformances which are not classified as major.
Minor nonconformances may be disposed and implemented at Subcontractor level, but it's
disposition status shall be provided for Customer (Satellite System Integrator) with the
Nonconformance Status List.
E.2.2. Nonconformance Report
Nonconformance shall be recorded directly on formal report forms at the time of observation.
Interim records such as scratch pads and notebooks are prohibited. Voiding of a recorded
discrepancy shall be accomplished without destruction of the record or its legibility.
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A nonconformance report shall contain sufficient data for the complete identification of non-
conforming item, the description of nonconformances, the status of related actions, and analysis
of nonconformances.
In case of minor nonconformances, the Subcontractor may use his own document form and
control system. But in case of major nonconformances, the Subcontract
or’s report shall include
all the contents provided in APPENDIX C.
The inspection status and identification of nonconforming items shall be documented at the
point and time of discovery in the item’s document folder and shal be immediately subject to
review.
List of all nonconformances and the major nonconformance report shall be submitted to
Customer (Satellite System Integrator) and all nonconformance report shall be kept available by
Customer
(Satellite System Integrator) at the Subcontractor’s facilities.
E.3. MATERIAL REVIEW BOARD
Major nonconformances shall be reviewed and disposition taken by a formal MRB, established
at all contractual levels.
A member of the Subcontractor’s PA organization shall act as chairman. And an approved
member of the Subc
ontractor’s engineering organization shall be responsible for reviewing the
nonconformances and making decisions on the engineering aspects of such nonconformances.
The Subcontractor’s MRB shall submit the review results of major nonconformances to
Customer
(Satellite System Integrator)’s MRB with the proposed disposition for approval by
Customer
(Satellite System Integrator)’s MRB.
E.4. NONCONFORMANCE STATUS LIST
The Subcontractor shall maintain the list of nonconformances for the contracted item. This list
shall identify the status of each nonconformance.
The status of all nonconformances shall be reported to Customer (Satellite System Integrator)
through assurance status reports.
E.5. ALERT INFORMATION
The Subcontractor shall provide Customer (Satellite System Integrator) with selected alerts that
document problems related with deliverable flight item as reported by the GIDEP, ESA alert, or
the equivalent from the Subcontractor’s country, if applicable.
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APPENDIX F. 형상관리 (CONFIGURATION MANAGEMENT)
다음은 국내 실용위성에서 요구하고 있는 형상관리 요구사항의 예시이다. 위성 시스템 레벨
의 피드백은 개별 위성개발 과제와 연동되어야 하므로 본 과제의 범위를 넘어선다. 세부과
제 주관기관은 본 과제에서 이행되지 않는 부분에 대해서서는 모사 검증 등 적절한 대안을
수립하여 시행한다.
[주기] Subcontractor는 세부과제 주관기관으로 해석한다.
[주기] 납품은 개발종료로 해석한다.
국내 실용위성급 형상관리 요구사항의 예시는 다음과 같다.
F.1. GENERAL
The Subcontractor shall maintain a Configuration Management program to identify CIs, to
control any changes, and to account for the configuration status of each CI.
The Subcontractor shall appoint a person to be responsible for the implementation, operation
and monitoring of the program configuration and data management.
F.2. CONFIGURATION IDENTIFICATION
Configuration identification shall incrementally establish and release controlled documentation
for the purpose of identifying configuration characteristics of the End Item until it is fully defined
with respect to its intended functional, performance and physical characteristics, thereby
ensuring the continuous integrity of the product configuration.
Documents necessary for Configuration Identi
fication shal be presented at the Subcontractor’s
key review described in Section 3.5. If the documents are approved, this will form the
configuration baselines.
The CIs shall be developed and maintained through distinct sequential levels of detail:
a. The functional baseline is identified by the overall performances, interfaces, and design
requirements. The contract, equipment specification by Customer (Satellite System
Integrator), and SOW shall consist of a functional baseline. This baseline will be
established at the contract.
b. The development baseline is identified by the technical specifications written by the
Subcontractor for his top level and lower level CIs to satisfy the functional baseline
requirements. The Subcontractor’s development specifications and engineering documents
at Design Reviews shall consist of a development baseline. This baseline will be
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established at Design Reviews.
c. The production baseline is identified by the released detailed solution for FM production,
testing, and operation. Drawings, associated lists, and work instructions together with test
procedures shall consist of a production baseline. This baseline will be established at MRR.
Baselines and approved changes from those baselines constitute the current configuration
identification.
F.3. CONFIGURATION CONTROL
The Subcontractor shall maintain a configuration control system by which, any change or
relaxation to the configuration identification of a CI after formal establishment of its baselines,
will be identified, evaluated, classified, justified, approved and implemented or rejected.
F.3.1. Change Classification
Any change between Customer (Satellite System Integrator) and the Subcontractors shall be
classified into Class 1 or Class 2. The criteria for change classification are described herein.
Class 1 changes impact the contractual or technical agreement reached between Customer
(Satellite System Integrator) and the Subcontractor. In particulate, any of the following changes
will have a definite impact on the agreement:
a. Functions, performances, and weight as defined in the contract, specifications, and SOW
requirements
b. Safety, reliability, and maintainability
c. Interface control requirements
d. Interchangeability of any item if the item has already been delivered
e. Any delivered technical manuals
f. Costs and schedule
-
Class 1 changes shal be submitted to Customer (Satel ite System Integrator)’s CCB for
review and approval before implementation.
- Class 2 changes are those which are not classified as Class 1, but those are necessary to
meet technical and contractual requirements and provisions.
-
Class 2 changes may be implemented after Subcontractor’s CCB approval, but shall be
forwarded to Customer (Satellite System Integrator) for information.
F.3.2. Configuration Control Board
The Subcontractor’s CCB, chaired by the program manager or his designee, shall be
responsible for the following activities:
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a. Review, evaluate, classify, and process all changes proposed.
b. Direct activities to accommodate Cus
tomer (Satellite System Integrator)’s change requests.
c. Direct activities necessary to implement approved changes.
The Subcontractor’s CCB authority, membership, and procedures shall be defined in the PA
Program Plan.
F.3.3. Change Documentation
The Subcontractor may initiate the change procedure with the following change documents:
a. Change Proposal : The document used by the Subcontractor, either in response to a
Change Request or on its own initiative, to propose a change in the current approved
configuration identification.
In case of a Class 2 change proposal, the Subcontractor may use his own document form and
control system. But in case of a Class 1 Change Proposal, the Subcontractor’s form shal
include all the contents provided in APPENDIX C, and shall contain all information, drawings,
and justifications.
The Class 1 Change Proposal shall be submitted to Customer (Satellite System Integrator)’s
CCB for approval.
b. Request for Waiver (RFW) : This aims to cover a nonconformance discovered during
manufacturing or test of an item, which has been proposed suitable for use by the
Subcontractor’s MRB. This shal be submitted with a nonconformance report and MRB
dispositions.
c. Request for Deviation (RFD) : This will be submitted to depart from a requirement, prior to
manufacture and test of an item. When approved, deviations will be part of the
configuration baseline of the CIs.
Incorporation of changes into any document shall be carried out by the Subcontractor
responsible for the issuing of the document.
The document change log sheet shall clearly identify references to Change Proposals.
F.4. INTERFACE CONTROL DOCUMENTS
For each End Product, the Subcontractor shall provide Customer (Satellite System Integrator)
with ICDs including as a minimum the following:
a. Electrical ICD : Power, primary secondary switching diagrams, protection characteristics of
each function, connectors list and electrical characteristics of the signals on each pin of
each connector, etc.
b. Command and Telemetry ICD : Command and telemetry characteristics, points, type,
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mnemonics, transfer function, bits and status meaning, etc.
c. Mechanical ICD : Geometry, dimensions, fixings, weight, inertia, and position of center of
gravity, etc.
d. Thermal ICD : Thermal characteristics.
When approved by Customer (Satellite System Integrator), ICD become a requirement for the
Subcontractor. Then, any change to approved ICDs shall be processed as a Class 1 change.
At lower levels, any Lower Tier Subcontractor having design authority over an interface between
CIs is responsible for the control of those interfaces and required to establish ICDs to control
them.
F.5. CONFIGURATION STATUS ACCOUNTING
The Subcontractor shall implement a status accounting system capable of maintaining and
verifying the configuration and change status of all deliverable equipment for which he has
design responsibility.
The major elements to be provided are the following documents:
a. CIDL : The CIDL shall describe current issue and revision of documents and approved
changes. CIDL shall include :
- Basic CI information
- Requirements data list : Documents concerning the functional baseline.
- Specifications data list : Documents concerning the development baseline
- Design data list : Documents concerning the production baseline.
- Operations support data list such as transportation, handling, storage, installation,
operation, calibration, maintenance, users manuals, etc.
b. ABCL : The ABCL will list the relevant applicable production baseline and the approved
waivers for this baseline, and will establish the actual composition of the CI by hardware
identification number.
F.6. CONFIGURATION VERIFICATION
The Subcontractor is responsible for the configuration verification of each deliverable CI:
a. Comparison between the as designed configuration and the as-built and tested configuration
b. Justification of any differences
Customer (Satellite System Integrator) will verify configuration of a CI during program reviews
and MIP.
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F.7. DOCUMENTATION MANAGEMENT
The Subcontractor shall establish a data center and maintain applicable data during the mission
life of the End Product.
Each Subcontractor shall maintain a documentation management system to:
a. Maintain a database for all documents produced under the contract,
b. Verify that all documents required in the SOW are produced and delivered,
c. Introduce approved changes in the baseline documents,
d. Set up a receipt, recording, and dispatch system for all the program documents.
For each document, a change log sheet shall be provided to list the different issues with dates,
information about the reason for modification or the incorporated Change Proposal.
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APPENDIX G. 품질보증 (QUALITY ASSURANCE)
G.1. GENERAL
The Subcontractor shall maintain a QA system consistent with ISO 9001 or equivalent
standards.
Customer (Satellite System Integrator) shall have the right to verify conformity of the
Subcontractor's Quality System or to verify the product in accordance with the specified
requirements at the Subcontractor's facilities and/or his Supplier's facilities.
G.2. QUALITY ASSURANCE SYSTEM
G.2.1. Quality Assurance Program
The Subcontractor shall implement and maintain a QA program to ensure that appropriate
quality requirements are established and implemented to verify progress and to ensure prompt
detection and correction of deficiencies. This program shall include the items manufactured or
processed by the Subcontractor, as well as items procured from Suppliers or Lower Tier
Subcontractors.
Design rules and methods shall be consistent with this PAR. Fabrication, integration, testing,
and maintenance are conducted in a controlled manner such that the End Item conforms to the
applicable requirements.
The Subcontractor shall prepare a Quality Manual covering the requirements of this document.
The Quality Manual shall include or reference the Quality System procedures.
The Supplier and Lower Tier Subcontractor shall ensure that the Quality System procedures are
readily available to Subcontractor's personnel, who are responsible for ensuring compliance
with requirement, and to Customer (Satellite System Integrator).
G.2.2. Organization
A QA manager shall be assigned and shall manage the program to ensure compliance with
quality requirements outlined in this PAR.
The Subcontractor shall define and document the responsibility and authority of personnel who
perform work affecting quality for ensuring that the Quality System is established, effectively
implemented, and maintained.
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G.2.3. Personnel Training
The Subcontractor shall maintain a training program to ensure adequate skill level conforms to
End Product requirements. Training shall be emphasized for the tasks which affect the quality
and reliability of the End Product being procured.
Training records for personnel affecting quality shall be maintained.
G.2.4. Personnel Certification
The Subcontractor shall maintain a system of personnel certification covering activities such as
welding, soldering, connector assembly, assembly, bonding, potting, plating, cleaning, NDT, and
other activities requiring special skills. Only certified personnel shall perform the above activities.
The certification shall be issued in accordance with applicable MIL, ESA, or equivalent
specifications.
G.3. PURCHASING AND PROCUREMENT
The Subcontractor shall establish adequate controls for the procurement of hardware, software,
and services. The control of procurement activity includes selection of procurement sources,
control of purchase documents, surveillance of Suppliers and control of incoming items.
G.3.1. Supplier and Lower Tier Subcontractor Control
The Subcontractor shall impose the requirements in this PAR on his Suppliers and Lower Tier
Subcontractors as appropriate.
The Subcontractor shall be responsible for implementing and maintaining an effective system of
control over his procurement sources to ensure that hardware, software, and services
purchased for the program meet the requirements outlined in this PAR.
The Subcontractor shall ensure that all purchased special processes and personnel are properly
certified in accordance with the requirements of this PAR.
G.3.2. Source Inspection
The Subcontractor shall exercise surveillance over all the activities carried out by his Suppliers
and Lower Tier Subcontractors during the contract period.
The Subcontractor shall ensure that each of his Suppliers implements adequate surveillance
over their lower level Suppliers, in accordance with this PAR.
Purchased products shall be verified upon receipt or at his Supplier's facility before shipment.
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G.3.3. Procurement documents
The Subcontractor shall ensure that supplies are precisely identified and that all applicable
requirements are properly defined in the procurement documents.
The Subcontractor shall ensure that requirements contained in lower tier procurement
documents are traceable and can be demonstrated.
G.4. PRODUCT TRACEABILITY
G.4.1. Product Identification and Traceability
The Subcontractor shall establish and maintain documented procedures for identifying a product
or lot by suitable means from receipt and during all phases of production, delivery, and
installation. All similar assemblies and subassemblies shall be serialized.
The Subcontractor’s system shall be capable of retrieving the identification and serialization
record at the subassembly level. It shall also be capable of retrieving fabrication and test
records of identifiable articles, materials, and parts in the event verification of the articles,
materials, or parts becomes necessary.
G.4.2. Photographic Identification
Prior to final closure of subassemblies and assemblies, a color photograph shall be taken to
identify the location and presence of parts therein.
The photograph shall be of sufficient clarity to enable the viewer to readily identify part
identification and location. The photograph shall be identified with the applicable part number,
revision, serial number, and date.
If the assembly is reopened for rework or adjustments and the validity of the photograph
affected, an additional photograph shall be taken.
A copy of these photographs shall be included in the EIDP.
G.5. INSPECTION AND TEST
The Subcontractor shall plan inspections and tests during manufacturing, assembly and
integration process where maximum assurance for correct processing and prevention of
unrecoverable or costly nonconformance can be obtained.
The Subcontractor shall perform formal inspection at critical process, called KIP inspections.
These shall verify that all the actions have been completed and the product satisfies applicable
requirements.
Among the inspections and tests, some selected inspections which is critical to performance
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and schedule, shall be performed by Customer (Satellite System Integrator) . This is called MIP
inspection. MIP inspection plan shall be agreed with Customer (Satellite System Integrator) and
described in the manufacturing flow diagram.
G.5.1. Receiving Inspection and Test
The Subcontractor shall perform receiving inspections and tests to verify that parts and
materials conform to the requirements of this PAR. The Subcontractor shall inspect the product
to ensure that it conforms to applicable procurement document.
Receiving inspection shall be performed in accordance with a pre-planned checklist. The
checklist shall describe item characteristics and its expected criteria.
G.5.2. In-Process Inspection and Test
The Subcontractor shall perform in-process inspection and test surveillance operations to verify
compliance with engineering and manufacturing requirements.
Inspection shall be planned at points in the fabrication and test cycle where subsequent
manufacturing operations would make any previous operations difficult to inspect.
Each inspection points shall be defined as a specific step in the assembly traveler documents.
Among these inspections, KIP/MIP shall be described in the manufacturing flow diagram. And
the Subcontractor shall notify Customer (Satellite System Integrator) of KIP/MIP event.
Prior to shipment, the Subcontractor shall perform formal inspections and tests of End Products
to ensure that they conform to applicable drawings and specifications with respect to
configuration, performance, construction, workmanship, and identification.
Test equipment and setups shall be verified to be of proper configuration as required by the test
procedure and to have valid calibration and certification status.
The Subcontractor shall establish controls which shall identify and physically segregate rejected
items from conforming items. Also, he shall establish controls for conditionally accepted items
which will allow tracking through assembly and, if required, retrieval of such items to prevent
shipment in the End Product.
G.5.3. Acceptance Test
The Subcontractor shall perform acceptance test to verify compliance with contractual
performance requirements.
Acceptance test shall verify environmental compatibility of the End Product as required by
contract documents.
Acceptance test result shall be certified by the Subcontractor Quality Manager and approved by
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Customer (Satellite System Integrator) before unit shipment.
G.5.4. Equipment Calibration
The Subcontractor shall maintain a calibration system in accordance with the applicable MIL or
ESA requirements.
Records of calibration shall be maintained and made available for review by Customer (Satellite
System Integrator) upon request.
G.6. CONTROL OF FABRICATION
G.6.1. Work Instruction
The Subcontractor’s production operations shall be accomplished through controlled and
documented work instructions. This instruction shall be clear, complete, and current and shall
indicate the proper methods, tooling, location, and equipment required to accomplish the work.
In case specific process specification is applicable, the instruction shall follow applicable
specification.
Work instruction for the hardware assembly will be a traveler document.
Applicable instructions and aids shall be located in the work areas and personnel shall be
familiar with the pertinent contents.
The Subcontractor Quality System shall provide for effective review and update of work
instructions and specifications to assure compliance with contract requirements.
G.6.2. Manufacturing Flow Diagram
For each type of deliverable End Product, the Subcontractor shall prepare and maintain a
manufacturing flow diagram identifying manufacturing and inspection operations.
The Subcontractor shall establish the KIP and MIP on the manufacturing flow diagram and
provide this to Customer (Satellite System Integrator) for concurrence. These shall include
visual as well as mechanical inspections and tests as appropriate.
G.6.3. Manufacturing Flow Control
In order to ensure quality uniformity, the following practices shall be implemented by the
Subcontractor and his Suppliers:
a. In general, once installed and inspected, a piece part, other than mechanical fasteners,
shall not be reinstalled in deliverable hardware.
b. An inspection per process specification and drawing requirements shall be performed and a
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surveillance of equipment and personnel certification and compliance with process
specifications instructions will be checked on a periodic basis.
c. Store surveillance shall be performed to verify that handling, packaging, and environmental
requirements is complied, and to verify that part type segregation is being implemented.
d. Completed work shall be inspected prior to cover-up the assembly and prior to assembly
traveler closeout as a minimum. Major inspection points shall be delineated in flow
diagrams for electronic hardware.
e. Special verification of polarized capacitors is required prior to power on. In addition, polarity
shall be verified by voltage measurement at first power on. All capacitors require
discharging before installation.
f. All feed through filters shall be tested for insulation resistance after installation and the
actual reading recorded on the assembly traveler.
g. Threaded fasteners shall be torqued to the values specified on assembly drawings or
travelers.
h. All socket contacts shall have the separation force measured and all removable type
contacts shall have a contact retention test performed to be assured of locked in contacts.
Separation forces for all connector types shall be measured after conditioning.
i. ESD protective dust caps shall be installed and delivered on external connectors. For high
sensitivity ESD units, grounded shorting plugs are suggested.
j. Flight hardware connectors which interface to GSE shall be protected by connector savers.
k. The Subcontractor shall maintain accountability and configuration control of all parts during
all phases of production.
G.6.4. Handling
The contractor shall prevent handling damage during all phases of manufacturing, assembly,
integration, testing, storage, transportation and operation, through the use of followings:
a. Protective measure during handling,
b. Handling devices, and
c. Procedures and instructions.
G.6.5. Storage
The contractor shall have secure storage areas available for:
a. Incoming materials,
b. Intermediate items needing temporary storage, and
c. End Items before shipping.
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Limited-life materials, suspended limited-life materials, nonconforming items awaiting MRB
disposition, scrap items and all other items which are designated to be stored separately for
health or safety reasons, shall be placed in segregated areas within the storage area. Each
segregated area within the stores shall be clearly identified and labeled.
Controls shall be maintained over acceptance into and withdrawal from the storage area.
Records shall be maintained to ensure that all stored items are within the usable life limits and
adequately controlled and retested, and to provide traceability within the storage area.
G.6.6. Preservation
The Subcontractor shall ensure that items subject to deterioration, corrosion or contamination
through exposure to air, moisture or other environmental elements are preserved by methods
that ensure maximum protection consistent with life and usage.
G.6.7. Packaging
The container and packaging condition shall protect delivered hardware from the external
environmental variation or events. The packaging condition for transportation shall consider the
following items:
a. ESD protective measure for the electronic End Product
b. Environmental monitoring provisions such as humidity, shock, etc.
c. Use of double bag to maintaining cleanliness
d
. Subcontractor’s QA seal after final inspection before shipment
e. Use of reusable container box is recommended.
G.6.8. Electrostatic Discharge Control
The Subcontractor shall implement an ESD control program based on the requirements of MIL-
STD-1686 and MIL-HDBK-263 as a guide. All ESD sensitive parts shall be shipped in protective
packages with clear indication of the part’s ESD sensitivity.
Handling and protective procedures are to be documented in the Subc
ontractor’s fabrication,
inspection and process procedures. Procedures shall have instructions for the use of equipment,
tools and materials, operating guidelines, approved packaging materials, and ESD controlled
workstation requirements for the handling and protection of ESD sensitive electronic parts.
G.7. END ITEM DATA PACKAGE
The Subcontractor shall prepare legible and reproducible EIDP for each deliverable End Item
under the contract as described by this PAR. Each EIDP shall be reviewed by Subcontractor
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personnel for accuracy, content, and legibility prior to submittal to Customer (Satellite System
Integrator).
The major contents of the EIDP shall be submitted to Customer (Satellite System Integrator) for
review at least 10 working days prior to the PSR.
During the PSR, the EIDP shall be presented to a Customer (Satellite System Integrator)
representative for review along with the deliverable item and shall be approved by review
members. The PSR shall be held after final acceptance of the item by the Subcontractor QA and
prior to shipment.
Final acceptance of the item shall be contingent upon the acceptability of the EIDP at Customer
(Satellite System Integrator).
Each data package shall be bound, divided into these sections and completed in this order:
a. Title page containing End Item description, Customer (Satellite System Integrator) part
number, revision number, serial number, specification number, and purchase order number.
b. Review and approval page of Subcontractor acceptability with signatures of an engineering
representative, a configuration representative, a program manager, and a QA manager.
This will be COC.
c
. ABCL, showing the as built revision of the Subcontractor’s lowest detail drawing level of the
End Item including the applicable serial number.
d
. User’s manuals which contains operation constraints and handling precautions
e. Nonconformances and changes section:
Nonconformance Status List. This list shall contain all of the minor and major
nonconformance status.
Copies of all the
Subcontractor’s change proposals which classified as Class 1
Copies of al the Subcontractor’s major nonconformance reports. These wil include retest
instructions.
Waivers and deviations requests
All applicable letters
f. Inspection report according to the mechanical ICD. This report shall include measurement
results.
g. Contamination budget report. This report shall be prepared for contamination critical
hardware.
h. Acceptance test report which contains analysis and test results, including special
engineering test, as applicable.
i. Trend analysis report for the critical parameter
j. Listing of test equipment used, including manufacturer, model number, serial number, and
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date of last calibration
k. The level of contamination at the delivery for the contamination critical hardware
l. Cumulative logs for operating time or operating cycles, vibration time per axis, number of
temperature and pressure cycles, number of switch actuations, and connector mate and
demate cycles. This log summary shall be annotated with part number, serial number, and
date
m. Photographic identification logs
G.8. CONFIGURATION CONTROL
Engineering, manufacturing, and tooling drawings and specifications are subject to a system of
configuration control in accordance with Section 5 of this PAR.
The system shall ensure that only drawings, test procedures, and specifications of the latest
applicable revision are available to operational personnel at the appropriate points during
manufacturing, inspection, and testing. The system shall ensure the removal of obsolete
documents from manufacturing, inspection, and test areas.
G.9. CONTAMINATION CONTROL
The Subcontractor shall have contamination control procedures for measuring and maintaining
the required levels of cleanliness during the various phases of hardware assembly and testing.
Contamination control requirements are further detailed in Section 11 of this PAR.
G.10. CUSTOMER FURNISHED EQUIPMENT
The Subcontractor shall establish and maintain documented procedure for the control,
verification, storage, and maintenance of CFE.
When CFE is furnished by Customer (Satellite System Integrator) , the Subcontractor shall
inspect to detect damage in transit and provide for the protection, periodic inspection, and
controls necessary to preclude damage or deterioration during handling, storage, or use.
The Subcontractor shall report to Customer (Satellite System Integrator) any parts which are
damaged, malfunctioning, or otherwise unsuitable for use and shall determine and report the
probable cause and necessity for withholding such CFE from use.
Unsuitable CFE shall be handled in such a manner as to prevent further damage and additional
repair costs.
G.11. GROUND SUPPORT EQUIPMENT
The status of the MGSE, EGSE, and test aids used for manufacturing or testing the hardware
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being procured shal be controlled by the Subcontractor’s QA system.
Validation of equipment shall be carried out before use with the FM. This validation shall include
a calibration status check, a maintenance status check, and a functional demonstration.
Evidence of validation shall be available to Customer (Satellite System Integrator) upon request.
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APPENDIX H. 신뢰성 (RELIABILITY)
H.1. GENERAL
The Subcontractor shall establish, implement, and maintain a reliability program plan as a part
of Product Assurance Plan.
The product shall comply with the reliability requirements listed here:
a. The product failure rate shall respect the reliability objective specified in the product
technical requirement.
b. The product shall respect the derating rules for EEE parts.
c. All parts shall demonstrate compliance with space environment specification.
d. The product shall provide provision for failure detection and switching off.
e. The product shall avoid failure propagation in case of redundancy.
f. The product shall respect the design safety factors.
g. The product shall be designed to meet the lifetime specified in the technical specification.
In case hardware configuration is modified, related analysis and reports shall be updated and
resubmitted to Customer (Satellite System Integrator).
H.2. RELIABILITY PREDICTION
A reliability prediction shall be performed under the actual environmental and stress condition.
For the high reliability parts which have appropriate quality level, MIL-HDBK-217F Notice 2 shall
be used preferably as the failure rate database. If the parts are not covered by MIL-HDBK-217F
Notice 2, failure rate investigation methods or its data source shall be agreed with Customer
(Satellite System Integrator).
The reliability prediction report shall include functional schematics, parts reliability data,
equipment reliability model, and any assumption used for the analysis.
H.3. FAILURE MODE, EFFECTS, AND CRITICALITY ANALYSIS
FMECA analysis procedures and documentation shall be performed in accordance with ECSS-
Q-ST-30-02 or equivalent standards with the severity categories described in Table H.1 and H.2.
The FMECA shall identify how each failure mode is detected and shall recommend counter-
measures to render such consequences. FMECA shall be accompanied by FDIR process.
For the failure modes of redundancy interface circuit or the failure modes resulting in a severity
of category 1, the failure mode shall be analyzed to the depth of parts level.
In case of a unit including software, the effects of software errors shall be assessed at the
functional level.
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Common-mode analyses shall be performed on reliability and safety critical items to identify the
root cause of failures that have a potential to negate failure tolerance levels. This analysis shall
be included in the FMECA.
An FTA shall be performed at system and subsystem level for specified top events when
specifically requested.
Table H.1 Severity category definitions at equipment level
Severity Category
Definition
1
Failure mode causes damage by propagation to interfacing units
2
Failure mode causes the loss of required function
2R
Failure mode causes the loss of redundant function
3
Failure mode causes the degradation of the required function
4
Failure mode causes minor degradation
5
No effect
Table H.2 Severity category definitions at subsystem level
Severity
Category
Definitions
Catastrophic
1
Failure modes that could result in serious injury or loss of
life or loss of launch vehicle
1R
Failure modes of redundant hardware item that, if all failed,
could result in Category 1 effects.
1S
Failure in a safety or hazard monitoring system that could
cause the system to fail to detect a hazardous condition or
fail to operate during such condition and leads to Severity
Category 1 consequences.
Critical
2
Failure modes that could result in loss of one or more
mission objectives.
2R
Failure modes of redundant hardware items that could
result in Category 2 effects if all failed.
Significant
3
Failure modes that could cause degradation to mission
objectives.
Minor
4
Failure modes that could result in insignificant effect to
mission objectives.
H.4. PART STRESS ANALYSIS
The derating rules applied to EEE parts will limit the application conditions of voltage, current,
power, temperature, mechanical environment, and duty cycle to achieve part failure rates
consistent with reliability requirements.
ECSS-Q-ST-30-11, GSFC EEE-INST-002, or MIL-STD-975 shall be applied to the application of
all EEE parts. In case other derating rules are used, justification for the rules shall be submitted
to Customer (Satellite System Integrator) for approval.
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All of the EEE parts shall be derated to establish derating levels, and analyses shall be
performed to demonstrate that each part meets the stress derating criteria in each phase of the
mission of the equipment in normal, transient and contingency operating modes.
The list of the parts exceeding the stress criteria with its respective parameters is presented in
the Part Stress Analysis document. Areas of noncompliance shall be identified with proposed
solutions or justifications for use.
Deviation from derating criteria shall be subjected as a RFD.
H.5. WORST CASE ANALYSIS
The Subcontractor shall provide an analysis of the effects on design performances as it is
influenced by part parametric variations, environmental effects, radiation effects, input and
output variations, part tolerance, aging, etc.
This analysis shall verify that within reasonable combinations of specification characteristics and
parts tolerance, the design meets specified performance in worst mission period.
A final assessment report shall include the functions on which analysis has been performed, the
supporting circuits, and compliance status.
H.6. TREND ANALYSIS
The critical parameters of the End Product that can be monitored during testing shall be
identified at Design Reviews and trends shall be tracked during testing.
The analysis results shall be included in the EIDP. Items with unusual or abnormal trends shall
be noticed to Customer (Satellite System Integrator).
H.7. CRITICAL ITEM LIST
Critical items shall be identified and maintained in a criti
cal items list throughout the product’s
life cycle. An item shall be considered critical when:
a. It is not a space qualified design or technology.
b. It has safety hazards for hardware or personnel.
c. Failure mode severity is assigned to category 1.
d. The relevant failure rate is not justified.
e. It is hardware which is sensitive to age or wear or requires special ground handling
conditions. This will be a Limited Life Item.
f. Parts are out of accepted derating conditions.
g. Parts or materials are not qualified.
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The critical item list document shall include the following information as a minimum:
a. Item description
b. Reason for criticality
c. Risk mitigation plan
All reliability critical items shall be incorporated in the risk management system for the criticality
mitigation process.
H.8. LIMITED LIFE ITEM
The End Product shall be designed considering operational life, storage life, and assembly,
integration and test life.
All parts of the End Product being procured shall be reviewed for wear or degradation during its
designed lifetime. Analytic or test data justification shall be developed showing that an adequate
life margin exists.
Limited life items are hardware subject to degradation due to age, operating time, or cycles and
thus require periodic replacement, refurbishment, retest, or operation to assure that its mission
performance will not be degraded beyond acceptable limits. These items shall be identified in
the Limited Life Item List with the accumulated time or cycle tracking and maintenance records.
If deliverable hardware requires maintenance activities during storage, assembly, and testing
period, the Subcontractor shall describe appropriate maintenance activities in the user’s manual
and agree with Customer (Satellite System Integrator) before unit shipment.
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APPENDIX I. 안전관리 (SAFETY)
I.1. GENERAL
The Subcontractor shall observe applicable safety laws or ordinances.
The Subcontractor shall implement a safety program that will ensure the identification and
control of hazards during fabrication, testing, transportation, ground activities, and launch
operations.
Hardware and software nonconformance that occur during the course of the verification
program shall be reviewed for their safety implications.
I.2. HAZARDOUS OPERATIONS
The Subcontractor safety engineer shall identify all potentially hazardous operations in the
Subcontractor’s facilities.
When the operation could result in hazardous effect on the personnel, an investigation shall be
performed to identify and adequately control the hazards.
A report of each investigation shall be available for review at the Subcontractor's facility.
I.3. COMPLIANCE TO SAFETY REQUIREMENTS
The Subcontractor shall demonstrate that the End Product is compliant with safety requirements
of the applicable launch site range. The demonstration of safety compliance shall be
accomplished by the appropriate analysis or test.
The Subcontractor shall submit a safety assessment report applicable to the phase of the
program at the time of design review. The contents of the safety assessment report shall be
consistent with the requirements of the applicable launch vehicle and launch site requirements.
The safety reports shall include, as a minimum, a description of the product design, safety
requirement compliance status, hazard analysis or test results, and other applicable safety
related information.
I.4. SUPPORT FOR SAFETY REVIEW
The Subcontractor shall provide technical support to Customer (Satellite System Integrator) for
applicable safety reviews.
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APPENDIX J. 자재/기계부품 및 공정 (MATERIAL, MECHANICAL
PART AND PROCESS)
J.1. GENERAL
The Subcontractor is required to observe the requirements of this PAR. The Subcontractor is
also fully responsible for selection, procurement, and application of the materials and processes.
The Subcontractor shall provide a materials and processes plan as a section of PAPP or as a
separate document. The document shall describe all activities implemented for conformance to
program requirements.
J.2. MATERIALS SELECTION
Materials shall be selected with full consideration of the effects of the space environment and
shall satisfy applicable requirements based on the criteria described herein.
Use of materials with a history of successful spacecraft applications and existing specifications
and databases will minimize verification efforts.
Materials used in a conventional process with successful flight heritage and which meet the
selection criteria within this PAR will be classified as compliant materials.
Noncompliant materials are any materials not defined as compliant. These will include the
materials which meet the requirements but are not used in conventional applications.
Off-the-shelf hardware for which a detailed materials list is not available and where the included
materials cannot be easily identified and/or changed shall be considered to be noncompliant.
Compliant materials shall be used in the fabrication of flight hardware to the maximum practical
extent.
Noncompliant materials shall be deemed critical, as defined in Section J.8.1 of this PAR, and
the Subcontractor shall prepare a RFA package, with adequate justification for its use, and
submit it for review and approval to Customer (Satellite
System Integrator)’s PMPCB.
J.2.1. Restricted Materials
Due to limited life, safety concerns, or known instability, the following materials are not
recommended:
a. Beryllium or selenium except internal to hermetically sealed devices.
b. Unalloyed electrodeposited tin unless subsequently fused or reflowed.
c. Corrosive solder fluxes unless detailed cleaning procedures are specified that include
verification methods to ensure removal of residual contaminants.
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d. Teflon, vinyl, polyvinyl chloride used as an insulator for electrical harness wire.
Fluorocarbon polyimide wire ‘Kapton®’ is to be controlled as a critical item.
e. Materials which exhibit or are known to exhibit natural radioactivity such as uranium,
potassium, radium, thorium or any alloys thereof.
f. Indium and indium solder
g. Magnesium
h. Lithium
Where the use of any of these materials is unavoidable, the application shall be evaluated on a
case-by-case basis and the Subcontractor shall prepare a RFA package, with adequate
justification for its use, and submit it for review and approval to Customer (Satellite System
Integrator)’s PMPCB.
J.2.2. Prohibited Materials
The use of pure mercury, cadmium, pure electrodeposited or hot dipped tin-plated surface
coatings, zinc and PVC is prohibited.
These materials can be used in the way that unit design mitigates material instability. The
Subcontractor shall prepare a RFA package, with adequate justification for its use, and submit it
for review and approval to Customer (Satellite
System Integrator)’s PMPCB.
J.3. MATERIALS REQUIREMENTS
J.3.1. Corrosion
Metallic materials selected for use in flight hardware shall be corrosion resistant or protected
from corrosive environments by finishing and prevention of moisture condensation on corrosion
susceptible hardware by environmental control or using seals and metallurgical joints.
Non-metallic parts shall not have a corrosion stimulating effect on other materials when exposed
for their specific useful life.
Incompatible couples defined by MIL-STD-889 shall be avoided. Such dissimilar metals may be
used in intimate contact, but only if the assembly is protected in a manner as to preclude
moisture.
J.3.2. Stress Corrosion
Metals and alloys shall not have a propensity towards stress corrosion cracking, as defined in
Table I of ECSS-Q-70-36A. Metals and alloys in Table II or III of ECSS-Q-70-36A may be used
with Customer (Satellite
System Integrator)’s PMPCB approval.
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Metals and alloys that are susceptible to stress corrosion cracking shall be avoided in sustained
tensile applications.
J.3.3. Hydrogen Embrittlement
Metals, particularly high strength steels and titanium alloy, which will be exposed to a hydrogen
rich environment or subjected to processes that can introduce hydrogen in the metal, shall be
evaluated for susceptibility to hydrogen embrittlement. Any resulting reduction in performance
will be highlighted and appropriate measures will be taken to eliminate the effect.
J.3.4. Magnetism
The use of magnetic materials is not permitted, if it can be avoided, and shall be avoided as far
as practicable to allow for a high degree of magnetic cleanliness for the spacecraft. All magnetic
materials are to be identified in the materials list and a justification for their use shall be
submitted for review and approval to Customer (Satellite
System Integrator)’s PMPCB.
J.3.5. Fluid Compatibility
Metallic and nonmetallic materials that will be in contact with an identified fluid shall be
compatible with that fluid. If compatibility data are not available, testing shall be performed
according to NASA-STD-(I)-6001A test number 15.
Metallic materials directly exposed to propellants shall not exhibit surface corrosion.
J.3.6. Vacuum Stability
Only materials that have TML and CVCM less than the requirements in Section 11 shall be used
in a vacuum environment.
J.3.7. Flammability
Major use organic materials for flight shall be nonflammable or self-extinguishing in air in the
application configuration.
J.3.8. Radiation Sensitivity
Exterior and exposed materials shall be capable of functioning as intended in an orbital charged
particle and UV radiation environment.
J.3.9. Electrostatic Discharge Protection
Materials used in areas sensitive to electrostatic discharge shall be selected to ensure that the
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maximum potential difference between any two points on the spacecraft is within the limits of
applicable ESD/EMC requirements.
J.4. MECHANICAL PARTS SELECTION
Mechanical parts shall be selected with full consideration of the effects of the space
environment and shall be selected on the basis of previous space heritage in an identical
application.
Mechanical parts which has successful flight heritage and will be procured to the ESA or MIL
specification will be classified as standard part.
Nonstandard parts are any mechanical parts not defined as standard. These will include the
standard parts used in alternative application.
Standard part shall be used in the flight hardware design to the maximum practical extent.
Where a mechanical part is not controlled by an ESA or MIL specification, current and fully
configured specifications applicable to the relevant Subcontractor should be used to ensure full
control over the procurement and performance of the mechanical part.
All materials that comprise a mechanical part must be individually assessed in accordance with
the requirements of this document and listed on the Materials Identification List.
Nonstandard parts shall be deemed critical, as defined in Section J.8.1 of this PAR, and the
Subcontractor shall prepare a RFA package, with adequate justification for its use, and submit it
for review and approval to Customer (Satellite System Integrator)’s PMPCB.
J.5. PROCESS SELECTION
All manufacturing and assembly processes used shall be carefully selected so that material
integrity is maintained and physical property changes are well understood and controlled.
Processes which has successful flight heritage with the use of compliant materials will be
classified as conventional process.
Nonconventional processes are any processes not defined as conventional. For the
nonconventional processes, process verification is required.
Conventional processes shall be used in the fabrication of flight hardware to the maximum
practical extent.
If a nonconventional process is applied, the Subcontractor shall verify for the desired process
application on the basis of tests, similarity, analyses, inspection, existing data, or a combination
of those methods.
Nonconventional process shall be deemed critical, as defined in Section J.8.1 of this PAR, and
the Subcontractor shall prepare a RFA package, with adequate justification for its use, and
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submit it for review and approval to Customer (Satellite
System Integrator)’s PMPCB.
J.6. SPECIFIC REQUIREMENTS
J.6.1. Pyrotechnic Parts
The selection, procurement and application of pyrotechnic devices shall conform to the
requirements of ECSS-E-30 Part 6A. All devices selected for use must be subject to the
qualification, acceptance and verification testing of this specification.
Primary and redundant devices must not be taken and installed from the same lot.
The pyrotechnic device subsystem must be subject to an end-to-end test prior to launch.
J.6.2. Shelf Life Materials
Materials with limited lifetime characteristics shall be subject to lot/batch acceptance tests, and
shall have the date of manufacture and shelf-life expiration date marked on each lot/batch.
Storage conditions must be controlled to avoid degradation of the material. Storage conditions
and shelf life should be stated in the procurement specification.
The material whose shelf life has expired shall be segregated from other conforming materials
and shall not be used on the FM fabrication unless the material is validated by means of
appropriate tests.
J.7. PROCUREMENT
The Subcontractor shall describe the procurement methods.
The procurement of materials shall be done by formal procurement document. These
procurement documents shal be approved by the Subcontractor’s MPCB.
J.8. MATERIALS AND PROCESS APPROVAL
J.8.1. Critical Materials and Processes
For the materials, mechanical parts, and processes identified as critical, the Subcontractor shall
prepare a RFA package, with adequate justification for its use, and submit it for review and
approval to Customer (Satellite
System Integrator)’s PMPCB.
The definition of a critical material, mechanical part or process is as followings:
a. Materials
- It is new, has no previous space use or is non-validated, in the application in question.
- Previous use has highlighted technical issues.
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b. Mechanical parts
- It is new, has no previous space use or is non-qualified, in the application in question.
- Previous use has highlighted technical issues.
- Failure of the mechanical part can adversely affect the performance or destroy a major part
or function of the spacecraft.
- The quality of the mechanical part cannot be assessed by simple tests.
c. Processes
- It is new, has no previous space use or is non-validated, in the application in question.
- Previous use has highlighted technical issues.
- Failure of the process can adversely affect the performance or destroy a major part or
function of the spacecraft.
- The Subcontractor has no prior application experience.
- The quality of the process cannot be assessed by examining the End Product.
All critical materials, mechanical parts, and processes shall be evaluated and qualified. The
qualification reports are to be approved by Customer (Satellite System Integrator). The
qualification of all critical materials, mechanical parts or processes shall be completed and
accepted by Customer (Satellite System Integrator) before the materials, mechanical parts or
processes are used on FM hardware.
RFA shall include all the contents defined in APPENDIX C.
J.8.2. Material and Process Control Board
The selection, application, and approval of materials and process shall be implemented through
the Subcontractor’s MPCB.
The major activit
ies of the Subcontractor’s MPCB are listed below:
a. Review and approve process specification, materials specification, and procurement
document.
b. Prepare verification plans for nonconventional processes.
c. Investigate materials and process related issues during the entire program life cycle.
d. Prepare material identification lists and process lists and submit them to Customer
(Satellite System Integrator).
e. Prepare RFA documents and submit them to Customer (Satellite
System Integrator)’s
PMPCB for approval.
J.9. MATERIALS, MECHANICAL PARTS AND PROCESSES LIST
The Subcontractor shall prepare a list of materials, mechanical parts, and processes identified
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in this program.
The lists shall cover all materials and processes used in the equipment, including those used at
lower tier Subcontractors level and all materials, mechanical parts and processes used during
the AIT phase.
The lists shall include all the contents defined in APPENDIX C.
J.10. SPECIFICATION
All of the materials and mechanical parts shall be procured in accordance with the standard
specification or customized specification designated for the material.
All of the Subcontractor’s processes shal be recorded and maintained in the form of process
specifications.
The specification shall contain all necessary physical, environmental, performance, and
qualification requirements.
Specification for the noncompliant materials and/or nonstandard parts shall be submitted with
the RFA document.
The process specifications shall be available to Customer (Satellite System Integrator) at the
Subcontractor’s facilities.
J.11. RECEIVING INSPECTION
Each material shall be submitted to a receiving inspection. The objective of the inspection is to
verify the compliance with the procurement specifications and the purchase order requirements.
Receiving inspections shall at least include data review and visual inspection. Characterization
tests shall be performed if required.
J.12. TREACEABILITY
The Subcontractor shall ensure that it is possible to reconstitute the
material or part’s history,
either individually or by the manufacturing lot.
The Subcontractor shall ensure that the full traceability of materials and parts is maintained and
recorded throughout the mission life of the End Product.
J.13. PROPRIETARY INFORMATION
Where materials, mechanical parts, or processes are considered proprietary by the
Subcontractor and/or Supplier, Customer (Satellite System Integrator) will respect the right of
the third party to withhold certain details. However sufficient information must be made available
to Customer (Satellite System Integrator) to allow a full evaluation of the material, mechanical
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part, or process with respect to the mission environment and lifetime requirements and to allow
a full risk assessment to be carried out. The level of information exchange will be defined on a
case-by-case basis dependent on the sensitivity of the requested information.
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APPENDIX K. 전기전자부품 (EEE PARTS)
K.1. GENERAL
EEE parts for qualification models shall be from the same design type (Form, Fit, Function) and
manufacturer as the ones intended to be used on FMs.
The Subcontractor shall ensure that all parts requirements are flowed-down to all his
Subcontractors and ensure that all his Subcontractors are compliant to these parts requirements.
K.2. PARTS SELECTION
The Subcontractor shall ensure that the selected parts meet the operating, environmental,
radiation, material, safety, quality and reliability conditions defined for the program.
[QUALITY REQUIREMENT FOR EEE PARTS FOR GEO]
EEE parts listed in the EPPL part I, ESCC QPL parts, NPSL level 1 parts (with disposition of the
associated application note), GSFC EEE-INST-002 level 1 parts (with disposition of the
associated application note), and MIL QPL/QML parts (a quality level is based on the NPSL
level 1) shall be used as the primary basis for parts selection.
[QUALITY REQUIREMENT FOR EEE PARTS FOR LEO]
EEE parts listed in the EPPL part I and II, ESCC QPL parts, NPSL level 1 and 2 parts (the
associated application note shall apply), GSFC EEE-INST-002 level 1 and 2 parts (the
associated application note shall apply), and MIL QPL/QML parts (a quality level is based on the
NPSL level 1 or 2) shall be used as the primary basis for standard parts selection.
EEE parts which satisfy the screening requirement of Section K.3 and APPENDIX K will be
classified as program standard parts. Nonstandard parts are any parts not defined as standard
parts.
Standard parts shall be used in the flight hardware design to the maximum practical extent.
When equipment development and qualification conditions or technical issues do not allow use
of the above standard level, the next available level in the above ESCC or US MIL systems shall
be considered.
In the case that a valid and acceptable status cannot be demonstrated, an adequate evaluation
program shall be implemented to comply with the requirements specified for the program.
If nonstandard parts are used in the flight hardware, the Subcontractor shall prepare a PAD
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package, with adequate justification for its use and supplementary test, and submit it for review
and approval to Customer (Satellite
System Integrator)’s PMPCB.
K.2.1. Radiation Hardness
All the parts used in the end product shall be selected to meet their mission application for the
specified, predicted radiation environment. These requirements are established for all kinds of
radiation including cosmic, trapped and solar flares.
The Subcontractor shall implement radiation hardness assurance programs which assess actual
radiation tolerance of the selected components for compliance with the KOMPSAT or
GEOKOMPSAT radiation requirements in term of Total Dose, displacement damages, and
single events effects.
The Subcontractor shall issue a radiation assessment report identifying all sensitive
components with respect to the relevant radiation effects, their impact and giving an adequate
design solution for the equipment. The radiation assessment report shall be submitted to
Customer (Satellite System Integrator).
a. Total Ionizing Dose (TID) : In order to reduce the Total Dose risk, parts can be shielded or
replaced. Any other solutions may be used as appropriate.
- 2 x Received Dose Level < TID Sensitivity of the parts : FM lot is accepted as is.
- 1.3 x Received Dose Level < TID Sensitivity of the parts < 2 x Received Dose Level :
Radiation lot acceptance test is required. If FM lot parametric and functional hardness is
larger than 1.3 times the dose level, the FM lot is accepted.
- TID Sensitivity of the parts < 1.3 x Received Dose Level : The part is not acceptable as is.
Shielding of parts, replacement, or any other solutions shall be found.
b. Displacement Damage: In order to reduce the displacement damage risk, parts can be
shielded or replaced. Any other solutions may be used as appropriate.
- 2 x Received DDEF Level < DDSF of the parts : FM lot is accepted as is.
- 1.3 x Received DDEF Level < DDSF of the parts < 2 x Received DDEF Level : Radiation lot
acceptance test are required. If FM lot parametric and functional hardness is larger than 1.3
times the DDSF level, the FM lot is accepted.
- DDSF of the parts < 1.3 x Received DDEF Level : The part is not acceptable as is. Shielding
of parts, replacement, or any other solutions shall be found.
c. Single Event Phenomenon (SEP) : Evaluation of SEP shall be performed according to the
following criteria. LETth(SEP) means threshold LET for a specific kind of SEP. The source of
part radiation data will be considered when evaluation of SEP.
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-
60 MeV∙cm2/mg < LETth(SEP) : Part is considered as not sensitive to the specific SEP. FM
lot is accepted as is.
-
15 MeV∙cm2/mg < LETth(SEP) < 60 MeV∙cm2/mg : Part is sensitive to heavy ion induced
SEP but not sensitive to proton induced SEP. Heavy ion induced SEP rate and their effects
shall be analyzed to identify the effects and criticality. Risk reduction actions required if the
mitigation is necessary from the analysis. Final decision will be taken at Customer PMPCB.
-
LETth(SEP) < 15 MeV∙cm2/mg : Part is sensitive to heavy ion and proton induced SEP.
Heavy ion and proton induced SEP rate and their effects shall be analyzed to identify the
effects and criticality. Risk reduction actions required if the mitigation is necessary from the
analysis.
The use of part, which is not acceptable as is, shall be reviewed and approved by Customer
PMPCB.
K.2.2. Restricted Parts
The Subcontractor shall ensure that materials which are not hermetically sealed within
components meet the requirements of Section 10 regarding outgassing, flammability, toxicity,
and criteria required for the intended use.
The Subcontractor shall insure that EEE part does not contain health and safety hazard
materials such as beryllium oxide, cadmium, lithium, magnesium, mercury, or radioactive
material.
The Subcontractor shall also evaluate the robustness of selected EEE components to the
stresses induced during assembly process.
For limited life, known instability, safety hazard or reliability risk reasons, the use of EEE parts
listed below shall be prohibited:
a. Component using pure tin material plating
b. Hollow core resistors
c. Potentiometers (except for mechanism position monitoring)
d. Non-metallurgically bonded diodes
e. Semiconductor dice without passivation or glassivation over exposed active area
f. Wet slug tantalum capacitors other than capacitor construction using double seals and a
tantalum case
g. TO5 relays without double welding of the mechanism to the header or with any type of
integrated diodes inside
h. Wire-link fuses < 5A
i. RNC90 resistors above 100 kΩ (for new design)
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j. TO3 and DO4/DO5 packages (for new design)
K.3. PROCUREMENT
The Subcontractor shall describe the procurement scheme in the parts control plan.
The procurement of materials shall be done by formal procurement document. These
procurement documents shal be controlled by Subcontractor’s responsibility.
To reduce the risk of procuring counterfeit parts, when parts are not directly procured from the
manufacturer, the supplier shall procure parts only from distributors duly franchised by the parts
manufacturer.
K.3.1. Quality Level
All EEE parts to be incorporated into flight hardware shall be subjected to screening tests.
These screening tests shall be designed so that accumulated stress will not jeopardize the part
reliability.
The baseline of quality level used to procure or to up-screen EEE parts is described in
APPENDIX K.10
K.3.2. Procurement Specification
Any EEE part intended for use in flight hardware shall be procured to controlled specifications.
International specifications systems such as ESCC or MIL, recognized as suitable for space
applications, shall be used by the Subcontractor.
This document shall be configuration controlled by the Subcontractor, and submitted to
Customer (Satellite System Integrator) PMPCB for approval through the PAD process.
The EEE parts procurement responsible is requested to ask the manufacturer to give
notification of any product change affecting qualification, performance, quality, reliability and
interchangeability and to communicate this information to the Subcontractor (if applicable).
The issue and revision of the detail procurement specifications shall be specified in the Part
Identification List.
K.3.3. Lot Acceptance Test and Quality Conformance Inspection
Any lot of EEE parts shall be submitted to a LAT (ESCC system) or QCI/TCI (MIL system)
procedure according to the following rules:
a. ESA qualified parts : For ESA qualified parts, LAT is implemented in accordance with the
ESA specifications.
b. MIL qualified parts : For MIL qualified parts, QCI/TCI is implemented in accordance with the
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quality level of the MIL specification.
c. Non-qualified parts : For non-qualified parts purchased to source control drawing, LAT or
QCI shall be performed in accordance with the closest applicable ESA or MIL specification.
The content of the lot acceptance is ESCC level LAT1 or level LAT2 or LVT(subgroups 1, 2,
and 3) or comparable QCI. Customer (Satellite System Integrator) will approve the proposed
level during PMPCB, through the PAD provided by the Subcontractor.
When a lot built with different sub lots is submitted to LAT/QCI, the distribution of these sub lots
shall be identified and the LAT/QCI sampling shall be representative of this distribution.
A failure analysis shall be performed on any part which failed during the LAT/QCI/TCI. Analysis
result shall be available for review by Customer (Satellite System Integrator), on request.
EEE parts used during life test of LAT/QCI /TCI are prohibited to be used as flight parts.
K.3.4. Destructive Physical Analysis
The DPA shall be performed on 3 samples per lot for nonstandard parts belonging to the
following categories:
a. Hybrid circuits,
b. Microcircuits,
c. Discrete semiconductors,
d. Relays and switches,
e. Crystals and Oscillators,
f. Passive microwave devices,
g. Capacitors (ceramic, tantalum, and variable),
h. Filters
Either standard or not, the DPA shall be performed on 3 samples per lot on relays, oscillators,
and hybrids. The DPA sample size may be reduced in some cases which shall be submitted to
Customer (Satellite System Integrator) for approval through the PAD process.
The Subcontractor shall verify that the outcome of the DPA is satisfactory prior to the installation
of the components into flight hardware.
The DPA procedure and reports, which includes photos, shall be provided to Customer (Satellite
System Integrator) for review on request.
K.3.5. Radiation Hardness Verification
Radiation sensitive parts, as defined in K.2.1, and for which applicable existing test data is
insufficient shall be subjected to RVT.
RVT shall be performed in accordance with internationally recognized standards, such as ESCC
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Basic Specifications No. 22900 and No 25100, MIL-STD-750 Test Method 1080, MIL-STD-883
Test Method 1019, or JEDEC JESD57.
The results of RVT shall be documented by a report and shall be provided to Customer (Satellite
System Integrator) for review on request.
K.4. SPECIFIC PARTS REQUIREMENTS
K.4.1. Application Specific Integrated Circuits (ASIC)
ECSS-Q-ST-60-02 or equivalent MIL specification shall apply for the design development of
ASICs.
K.4.2. One Time Programmable Devices
For FPGA, ECSS-Q-ST-60-02 or equivalent MIL specification, shall apply for the design
development. The Subcontractor shall submit a post-programming procedure, depending on
part types (including, when necessary, electrical tests, programming conditions and equipment,
burn-in conditions, additional screening tests and specific marking after programming) to
Customer (Satellite System Integrator) for approval.
K.4.3. Hybrids Devices
The Subcontractor shall manufacture Hybrids in accordance with the requirements of MIL-PRF-
38534 Class K or ECSS-Q-ST-60-05 shall apply.
K.4.4. Electromagnetic Devices
The in-house magnetic parts shall be designed and screened using MIL-STD-981 as a guide
line.
K.4.5. Microwave Monolithic Integrated Circuits
ECSS-Q-ST-60-12 or equivalent MIL specification shall be applied.
K.5. PARTS EVALUATION PROGRAM
The Subcontractor shall implement a part evaluation and approval testing program in absence
of an approved demonstration that a part has the ability to conform to the requirements for
performance, quality, reliability, and environmental resistance as required for the program.
The evaluation program, documented by an evaluation plan, shall identify the manufacturing
baseline in order to ensure that the flight parts shall be built according to the same technology
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and manufacturing processes as the evaluated components.
In the case that a change affects the qualification status, a new qualification or a delta
qualification shall be undertaken.
For commercial parts, the Subcontractor is encouraged to perform a single procurement for
evaluation and flight parts in order to ensure that the evaluation results are representative of the
flight parts.
The evaluation plan is based on the following elements:
a. Constructional analysis
b. Manufacturer assessment
c. Evaluation testing (according to the Qualification or LAT/QCI of the ESCC/MIL standard
parts depending on the part consideration)
d. Radiation testing (if applicable, depending on the component sensitivity and the program
requirements)
Reduction or omission of any element of the evaluation requirements shall be justified on the
basis of documentary evidence provided by the responsible of the evaluation program.
The evaluation plan shall be submitted to Customer (Satellite System Integrator) for approval, in
the frame of PAD process. The evaluation results, documented by an evaluation report, shall be
submitted to Customer (Satellite System Integrator) for approval.
The preliminary PAD approval does not prejudge its final acceptance. The final approval shall be
definitely pronounced when the evaluation is successfully completed.
Failure analysis shall be conducted on any part which failed during this evaluation program, in
order to determine the reason for failure and to react at procurement level or at part selection
level.
K.6. PART IDENTIFICATION LIST
The Subcontractor shall issue a Part Identification List, identifying all EEE parts used for each
unit. The Subcontractor Part Identification List shall include Lower Tier Subcontractor's or
Supplier's Part Identification List. The subcontractor shall issue the Part Identification List and
the As-built Part Identification List in editable and sortable electronic format.
K.7. RECEIVING INSPECTION
Each part shall be submitted to an incoming inspection. The objective of the inspection is to
verify the compliance with the procurement specification and the purchase order requirements.
The receiving inspection shall at least include following verifications:
a. Compliance with the purchase order requirements
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b. Manufacturer Certificate of Conformance (COC)
c. Integrity of the parts by visual inspection
d. Packaging of the components
e. Review of delivered documentations
f. Quantity
K.8. HANDLING AND STORAGE
The Subcontractor shall establish and implement procedures for handling and storage of EEE
parts in order to prevent any degradation, taking into account the possible use of plastic
packages.
As a minimum the following areas shall be covered:
a. Control of storage environment such as temperature (22±5°C), humidity (45% < RH < 65%
max), cleanliness
b. Appropriate measures and facilities for segregating and protecting parts during incoming
inspection, storage and delivery to manufacturing
c. Control measures to ensure that parts susceptible to ESD are identified and handled only by
properly trained personnel using antistatic packaging, tools and other means, including
procedures
For PEM Devices, specific requirements for handling, storage, and bake-out before mounting
shall be applied.
K.9. NONCONFORMANCE
Any observed deviation of EEE parts from requirements of applicable specifications, procedures
and drawings shall be controlled by the nonconformance control system.
The nonconformance control system shall handle all nonconformances occurring on EEE parts
during:
a. Manufacturing (if available), screening and acceptance tests,
b. Incoming inspection,
c. Integration and test of equipment,
d. Storage and handling.
K.10. QUALITY REQUIREMENT
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TABLE K-1. QUALITY REQUIREMENT FOR EEE PARTS FOR LEO
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TABLE K-2. QUALITY REQUIREMENT FOR EEE PARTS FOR GEO
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APPENDIX
L.
청정도
및
오염관리
(CLEANLINESS
&
CONTAMINATION CONTROL)
L.1. GENERAL
The Subcontractor shall maintain a contamination control program applicable to the End
Product. The program shall consist in defining the specific cleanliness requirements and setting
forth the approaches to meeting them, and then in implementing the control and monitoring
activities.
The contamination sensitive components shall be identified and shall be controlled specially.
Contaminants include all materials of molecular or of particulate nature whose presence
degrades hardware performance. The source of the contaminant materials may be the
hardware itself, the test facilities, and the environments to which the hardware is exposed.
All hardware and support equipment shall be received by Customer (Satellite System Integrator)
in visibly clean condition.
L.2. CONTAMINATION CONTROL
The Subcontractor shall define a contamination allowance for performance degradation of
contamination sensitive hardware such that, even in the degraded state, the hardware will meet
its mission objectives. The contamination allowable shall be assessed in a timely manner such
that results can be used to assess the adequacy of and, if necessary, to modify the design of
the hardware.
In case the Subcontractor develops contamination sensitive equipment, he shall provide
contamination control plan. This plan shall describe methods for controlling contamination and
for ensuring that the contamination allowance is not exceeded. It shall identify the controls,
inspections, tests, analyses, and documentation necessary for measuring and maintaining the
levels of cleanliness required during the various phases of the hardware lifetime including the
spacecraft system AIT and Launch preparation period.
In case the Subcontractor develops contamination sensitive equipment, contamination analysis
shall be performed and its result shall be submitted to Customer (Satellite System Integrator) for
review. This analysis will show Procedures, standards, and specifications referenced in the
contamination control plan shall be available for review at the Subcontractor's facilities.
L.3. EQUIPMENT CLEANLINESS REQUIREMENTS
The Subcontractor shall define specific cleanliness criteria suitable for his process and the End
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Product. General rules are listed below:
a. Selection of materials will be based on TML and CVCM parameters. The outgassing criteria
shall be TML < 1% or CVCM < 0.1 %.
b. Elements with organic material shall be baked out during 48 hours at 65 °C or equivalent
conditions according to the material characteristics.
c. Airborne cleanliness class for Integration or assembly operation shall be better than 100,000
class and shall be defined to ensure that the contamination allowance is not exceeded and it
shall be specified in the contamination control plan.
d. The Subcontractor shall monitor molecular contamination and particular contamination. The
contamination budget at delivery shall satisfy the criteria defined by Contamination Analysis
results.
e. For the cleanliness critical hardware, particulate cleaning shall be done by vacuum cleaning
only. Molecular cleaning may be done with an approved procedure.
L.4. CLEANLINESS REQUIREMENTS FOR TRANSPORTATION
The End Product shall be double packed within sealed plastic bags for the transportation or
storage phases:
a. The inner bag shall be sealed with cleaned equipment inside and with no loose parts which
could damage the equipment.
c. The outer bag shall be sealed with the inner bag inside and desiccant bags. Even if the
desiccant bag is damaged, the hardware shall not come in contact with loose desiccants.
c. The materials used for equipment packaging, such as plastic bags and foam, shall be
designed with materials presenting no free particles and no organic materials outgassing.
d. If special packing requirements are required by the nature of hardware, those are described
in the contamination control plan.
L.5. VACUUM BAKE OUT
Materials which are considered as contamination critical shall be submitted to vacuum bake out.
The bake out parameters shall be agreed with Customer (Satellite System Integrator) on a
case-by-case basis. These parameters must be identified in the Material List.
An outgassing test must be performed on the materials after vacuum bake out to demonstrate
compliance with the requirements of Section L.3. In all instances, a test reference from an ESA
or NASA approved source must be provided to assure the accuracy of the data.
All of the deliverable flight items shall undergo vacuum environment before delivery.
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APPENDIX M. 소프트웨어 품질보증 (SOFTWARE QUALITY
ASSURANCE)
M.1. GENERAL
The Subcontractor shall establish a Software Assurance Program which includes the entire
software development processes and the methods used to ensure software quality.
The Software Assurance Program shall include the processes such as requirements definition,
software design, coding, code review, software configuration management, testing, release
management, and product integration.
The Software Assurance Plan shall include the followings:
a. The software development cycles (milestones, input, output, etc.) the types of activities
(verification, validation, tests, etc.) on each development phase
b. The methods, tools, and rules to be applied
c. Development environment implemented
d. Dedicated actions to inspect Lower Tier Subcontractor
e. Quality arrangements for the warranty phase
M.2. LIST OF SOFTWARE
The Subcontractor shall prepare list and keep up to date a list of all software components which
are part of the End Product under his responsibility. The list shall include:
a. Name and identification in the product tree structure
b. Reference of the associated requirement specification
c. Name of the provider
d. Criticality of the software component
e. Programming language and the volumes of associated code specifying the method or tool
for calculation of these volumes
f. For re-use software, the overall rate of re-use
g. Development machine and its operating system
h. Target machine and its operating system
A set of milestones shall be defined for each software component to be consistent with the
product development cycle and criticality.
M.3. MANAGEMENT OF RESOURCES
The Subcontractor shall perform performance budget evaluations during design for memory
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occupation and CPU load during execution.
Budget analysis results of resources for on-board software shall be provided to Customer
(Satellite System Integrator) during Design Review.
M.4. SOFTWARE CONFIGURATION
Software configuration document is a living document. It remains available at project milestone
and is delivered with any software for validation or acceptance. The configuration document
shall explicitly identify the differences between the version delivered and the previous delivered
version. It shall be supported by an information technology tool.
The component of a deliverable software product shall be identified and marked when
configured for delivery with a non-removable label on each physical medium. It shall include at
least the name of the software, its version number, and its configuration document reference.
M.5. DOCUMENT MANAGEMENT
The following documents shall be managed in parallel with related software components:
a. Documents describing development or quality procedures to be implemented during the
software life cycle
b. Documents derived from software product development, including the documentation
intended for operators and users of the software system.
M.6. SOFTWARE SPECIFICATION
The software specifications shall define all topics necessary to satisfy applicable requirements.
Each requirement in the specification shall be identified by a unique reference.
M.7. DESIGN
The design description shall cover the hierarchy, dependency, interfaces of the software
components, dynamic sequencing of components, and data flow checks.
Software design shall minimize dependencies with respect to the operating system and the
hardware in order to contribute to software maintainability and portability.
M.8. CODING
Programming language adapted to the software product and to the design method shall be used.
Coding rules and conventions for consistent naming shall be defined for each programming
language. Dedicated coding rules shall be defined to avoid using risky instructions and use the
real time executive retained to best effect. In particular, the following shall be prohibited:
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a. Dynamic memory allocation
b. Use of generic characteristics.
The source code shall subject to configuration management.
M.9. TESTS
The test strategy shall define test level, types of test, and test coverage. For on-board software,
the test strategy shall define:
a. The target processor environment which shall be simulated or shall be executed really on
the development chain
b. The tests that will be performed on the development processor and those performed on the
real target processor (validation shall include central flight software coupling with the target
processor)
c. How are handling tests of software integrated in an equipment
d. How are handling re-used software
When requirements are not covered by test, verification activities such as simulations,
inspection, or analysis shall be performed.
After validation, the areas affected by changes or corrections shall be identified and subject to
re-testing. In the event of re-testing, any documentation related to tests (test case specification,
procedures, report, etc.) shall be updated.
M.10. DELIVERY, INSTALLATION, AND ACCEPTANCE
Before the software is presented to Customer (Satellite System Integrator) for acceptance, the
Subcontractor shall ensure that:
a. The source and object codes supplied
b. All agreed changes have been implemented
c. All nonconformances have been declared and resolved
d. All necessary facilities are available
Once acceptance tests have been performed, the Subcontractor shall prepare a report which
ensure conformance with software requirements and establish the conclusion concerning the
test result for the software product subjected to such tests accepted, accepted on condition, or
rejected.
M.11. MAINTENANCE PREPARATION
Maintenance plans and procedures shall deal with maintenance in terms of correction and
adaptation. Any adaptation or correction to the software product shall be covered by non-
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regression tests. Any adaptation or correction to the software shall be documented in
compliance with the documentation management and product configuration management
procedures.
M.12. PROCURED SOFTWARE
The term ‘Procured Software’ covers both software bought off-the-shelf and software used after
having been developed outside the contract to which the present requirements apply.
The choice of Procured Software shall be described and proposed to Customer (Satellite
System Integrator) in the form of a list of software components. The list of software components
shall include as a minimum:
a. Order criteria (version, options, extensions, etc.)
b. Intellectual ownership constraints
c. Acceptance inspection criteria (qualification, documentation, etc.),
d. Maintenance organization
e. Standby solutions if the product were unavailable
Any software procured to be used in a software product shall be identified and registered by
configuration management for that product, as for developed software.
- 23 -
붙임#4. EMC 시험규격
- 별도문서 : “ECSS-E-ST-20-07C Rev.1 EMC Spec.pdf”
ECSS-E-ST-20-07C Rev. 1
7 February 2012
Space engineering
Electromagnetic compatibility
ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
ECSS‐E‐ST‐20‐07C Rev. 1
7 February 2012
2
Foreword
This Standard is one of the series of ECSS Standards intended to be applied together for the
management, engineering and product assurance in space projects and applications. ECSS is a
cooperative effort of the European Space Agency, national space agencies and European industry
associations for the purpose of developing and maintaining common standards. Requirements in this
Standard are defined in terms of what shall be accomplished, rather than in terms of how to organize
and perform the necessary work. This allows existing organizational structures and methods to be
applied where they are effective, and for the structures and methods to evolve as necessary without
rewriting the standards.
This Standard has been prepared by the ECSS‐E‐ST‐20‐07 Working Group, reviewed by the ECSS
Executive Secretariat and approved by the ECSS Technical Authority.
Disclaimer
ECSS does not provide any warranty whatsoever, whether expressed, implied, or statutory, including,
but not limited to, any warranty of merchantability or fitness for a particular purpose or any warranty
that the contents of the item are error‐free. In no respect shall ECSS incur any liability for any
damages, including, but not limited to, direct, indirect, special, or consequential damages arising out
of, resulting from, or in any way connected to the use of this Standard, whether or not based upon
warranty, business agreement , tort, or otherwise; whether or not injury was sustained by persons or
property or otherwise; and whether or not loss was sustained from, or arose out of, the results of, the
item, or any services that may be provided by ECSS.
Published by:
ESA Requirements and Standards Division
ESTEC, P.O. Box 299,
2200 AG Noordwijk
The Netherlands
Copyright:
2012 © by the European Space Agency for the members of ECSS
ECSS‐E‐ST‐20‐07C Rev. 1
7 February 2012
3
Change log
ECSS‐E‐ST‐20‐07A
Never issued
ECSS‐E‐ST‐20‐07B
Never issued
ECSS‐E‐ST‐20‐07C
31 July 2008
First issue
ECSS‐E‐ST‐20‐07C
Rev. 1
7 February 2012
First issue Revision 1
Changes with respect to ECSS‐E‐ST‐020‐07C (31 July 2008) are identified with
revision tracking.
Requirements modified:
• 4.2.5.1a.: corrected cross‐reference in Note to 5.4.5.
• 4.2.11.2e.: Note with example deleted
• 4.2.11.2g: modified
• 5.2.1a.1. and 5. modified
• 5.3.3a. to d. modified
• 5.3.4a.: Note 2 deleted and quote sign in text corrected
• 5.4.3.3a.3.(a):added to requirement ʺ for differential mode testing and
Figure 5‐9 for common mode testingʺ
• 5.4.4.4a.3.(b): corrected in requirement reference to EUT switch to read
ʺFigure 5‐11.bʺ
• 5.4.9.2a.2ʺ.: changed bandwidth from ʺ10 MHzʺ to ʺ50 MHzʺ
• 5.4.11.3e.2.: corrected reference to Figure to read ʺFigure 5‐27ʺ
Editorial corrections in requirements:
• The possessive case‐like notation ” ‘s ” used to mean plural after
acronyms have been corrected, e.g. “EEDʹs“ and “LISNʹs“ has been
changed into “EEDs“ respectively “LISNs“when it means plural in
4.2.2.2c, 5.2.4a, 5.2.4b, 5.2.4c, 5.2.6.3a, 5.2.6.5a, 5.2.6.6.3.c, 5.2.6.6.3.d,
5.2.6.6.3.f, 5.3.2b, 5.4.3.2.a.9
• Corrected in 5.3.4a the incorrect “unquote“ sign.
• 5.4.4.5b NOTE: Corrected typo in word ʺTypicalʺ
Modifications in informative parts:
• 4.2.11.1: added reference to clause 4.2.11.2 and Figure 4‐1 (Figure was
moved from 4.2.11.3), corrected style of paragraph from ʺrequirementʺ to
ʺinformative textʺ. Text of Note modified.
ECSS‐E‐ST‐20‐07C Rev. 1
7 February 2012
4
• Figure 4‐1 modified and moved to clause 4.2.11.1.
• 5.4.1: corrected reference from ʺ5.4.11.4ʺ to read ʺ5.4.12ʺ
• Table 5‐3: cross‐ references in last column corrected.
• Annex A.2: corrected in 3rd bullet ʺICEʺ to read ʺICEʺ, ʺmeasurementʺ to
read ʺmeasurementsʺʺ and reference to read ʺFigure A‐1ʺ
• Figure A‐1: Caption of Figure modified
• Figure A‐2 moved from A.2 to A.4
• A.4: corrected in 2nd bullet reference to read ʺFigure A‐2ʺ
• Figure A‐3 moved to A.9
• A.6.2: Formula corrected
• A.9: corrected in 2nd and 4th bullet reference to read ʺFigure A‐3ʺ
• Figure A‐4 moved to A.10
• A.10: corrected in first paragraph reference to read ʺ5.4.7ʺ
• A.10: corrected in 1st bullet reference to read ʺFigure A‐4ʺ
• A.11: corrected in first paragraph reference to read ʺ5.4.8ʺ
• A.13: corrected in first paragraph reference to read ʺ5.4.10ʺ
• A.14: corrected in first paragraph reference to read ʺ5.4.11ʺ
• A.15: corrected in first paragraph reference to read ʺ5.4.12ʺ
ECSS‐E‐ST‐20‐07C Rev. 1
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5
Table of contents
EMC with the launch system ...................................................................... 17
Spacecraft charging and effects ................................................................. 18
Spacecraft DC magnetic emission ............................................................. 19
Hazards of electromagnetic radiation ......................................................... 20
EMC with ground equipment ...................................................................... 21
Electrical bonding requirements ................................................................. 22
Shielding (excepted wires and cables) ....................................................... 23
Wiring (including wires and cables shielding)............................................. 23
Electromagnetic effects verification plan .................................................... 25
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Electromagnetic effects verification report.................................................. 25
Use of measurement equipment ................................................................ 34
Calibration of measuring equipment........................................................... 38
Safety margin demonstration for critical or EED circuits ............................ 39
EMC with the launch system ...................................................................... 39
Spacecraft DC magnetic field emission...................................................... 40
Intra–system electromagnetic compatibility................................................ 40
CE, power leads, differential mode, 30 Hz to 100 kHz ............................... 42
CE, power and signal leads, 100 kHz to 100 MHz ..................................... 44
CE, power leads, inrush current ................................................................. 47
DC Magnetic field emission, magnetic moment ......................................... 49
RE, electric field, 30 MHz to 18 GHz .......................................................... 52
CS, power leads, 30 Hz to 100 kHz............................................................ 56
CS, bulk cable injection, 50 kHz to 100 MHz.............................................. 58
RS, magnetic field, 30 Hz to 100 kHz......................................................... 65
RS, electric field, 30 MHz to 18 GHz .......................................................... 68
ECSS‐E‐ST‐20‐07C Rev. 1
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Susceptibility to electrostatic discharges .................................................... 74
Annex A (informative) Subsystem and equipment limits.....................................79
CE on power leads, differential mode, 30 Hz to 100 MHz........................................ 79
CE on power and signal leads, common mode, 100 kHz to 100 MHz ..................... 81
CS, power and signal leads, common mode, 50 kHz to 100 MHz ........................... 87
Figures
Figure 5-5: Conducted emission, 30 Hz to 100 kHz, measurement system check ................ 44
Figure 5-6: Conducted emission, 30 Hz to 100 kHz, measurement setup ............................. 44
Figure 5-9: Conducted emission, measurement setup in common mode .............................. 46
ECSS‐E‐ST‐20‐07C Rev. 1
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Figure 5-24: Measurement system check configuration of the radiating system ................... 66
Tables
ECSS‐E‐ST‐20‐07C Rev. 1
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9
Introduction
Electromagnetic compatibility (EMC) of a space system or equipment is the
ability to function satisfactorily in its electromagnetic environment without
introducing intolerable electromagnetic disturbances to anything in that
environment.
The space system is designed to be compatible with its external natural,
induced, or man‐made electromagnetic environment. Natural components are
lightning for launchers, the terrestrial magnetic field for space vehicles.
Spacecraft charging is defined as voltage building‐up of a space vehicle or
spacecraft units when immerged in plasma. Electrostatic discharges result from
spacecraft charging with possible detrimental effects. External man‐made
interference, intentional or not, are caused by radar or telecommunication
beams during ground operations and the launching sequence. Intersystem EMC
also applies between the launcher and its payload or between space vehicles.
Intrasystem EMC is defined between all electrical, electronic, electromagnetic,
and electromechanical equipment within the space vehicle and by the presence
of its self‐induced electromagnetic environment. It comprises the intentional
radiated electromagnetic fields and parasitic emission from on‐board
equipment. Both conducted and radiated emissions are concerned. An
electromagnetic interference safety margin is defined at system critical points
by comparison of noise level and susceptibility at these points.
ECSS‐E‐ST‐20‐07C Rev. 1
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1
Scope
EMC policy and general system requirements are specified in ECSS‐E‐ST‐20.
This ECSS‐E‐ST‐20‐07 Standard addresses detailed system requirements
(Clause 4), general test conditions, verification requirements at system level,
and test methods at subsystem and equipment level (Clause 5) as well as
informative limits (Annex A).
Associated to this standard is ECSS‐E‐ST‐20‐06 “Spacecraft charging”, which
addresses charging control and risks arising from environmental and vehicle‐
induced spacecraft charging when ECSS‐E‐ST‐20‐07 addresses electromagnetic
effects of electrostatic discharges.
Annexes A to C of ECSS‐E‐ST‐20 document EMC activities related to
ECSS‐E‐ST‐20‐07: the EMC Control Plan (Annex A) defines the approach,
methods, procedures, resources, and organization, the Electromagnetic Effects
Verification Plan (Annex B) defines and specifies the verification processes,
analyses and tests, and the Electromagnetic Effects Verification Report
(Annex C) document verification results. The EMEVP and the EMEVR are the
vehicles for tailoring this standard.
This standard may be tailored for the specific characteristic and constrains of a
space project in conformance with ECSS‐S‐ST‐00.
ECSS‐E‐ST‐20‐07C Rev. 1
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11
2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply, However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.
ECSS‐S‐ST‐00‐01
ECSS system ‐ Glossary of terms
ECSS‐E‐ST‐20
Space engineering ‐ Electrical and electronic
ECSS‐E‐ST‐20‐06
Space engineering ‐ Spacecraft charging
ECSS‐E‐ST‐33‐11
Space engineering ‐ Explosive systems and devices
ECSS‐E‐ST‐50‐14
Space engineering – Spacecraft discrete interfaces
IEC 61000‐4‐2
(Edition 1.2)
Electromagnetic compatibility (EMC) ‐ Part 4‐2:
Testing and measurement techniques ‐ Electrostatic
discharge immunity test
ECSS‐E‐ST‐20‐07C Rev. 1
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3
Terms, definitions and abbreviated terms
3.1
Terms from other standards
For the purpose of this Standard, the terms and definitions from
ECSS‐S‐ST‐00‐01 apply, in particular for the following terms:
critical item
customer
equipment
item
launcher, launch vehicle
mission
requirement
safety critical function
supplier
spacecraft, space vehicle
subsystem
system
test
verification
For the purposes of this Standard, the following terms have a specific definition
contained in ECSS‐E‐ST‐20:
conducted emission
electromagnetic compatibility
electromagnetic compatibility control
electromagnetic interference
electromagnetic interference safety margin
emission
high‐voltage
lightning indirect effects
ECSS‐E‐ST‐20‐07C Rev. 1
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radiated emission
radiofrequency
susceptibility
susceptibility threshold
For the purposes of this document, the following terms have a specific
definition contained in ECSS‐E‐ST‐20‐06:
electrostatic discharge (ESD)
secondary arc
For the purposes of this document, the following term has a specific definition
contained in ECSS‐E‐ST‐33‐11:
electro‐explosive device (EED)
3.2
Terms specific to the present standard
3.2.1 ambient
level
level of radiated and conducted signal, and noise that exist at the specified test
location and time when the equipment under test is not operating
NOTE
E.g. atmospherics, interference from other sources,
and circuit noise or other interference generated
within the measuring set compose the “ambient
level”.
3.2.2 antenna
factor
factor that, when properly applied to the voltage at the input terminals of the
measuring instrument, yields the electric or magnetic field strength
NOTE 1 This factor includes the effects of antenna effective
length, mismatch, and transmission losses.
NOTE 2 The electric field strength is normally expressed in
V/m and the magnetic field strength in A/m or T.
3.2.3
common mode voltage
voltage difference between source and receiver ground references
3.2.4
contact discharge method
method of testing in which the electrode of the high‐voltage test generator is
held in contact with the discharge circuit, and the discharge actuated by a
discharge switch
ECSS‐E‐ST‐20‐07C Rev. 1
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3.2.5
electromagnetic environmental effects
impact of the electromagnetic environment upon equipment, systems, and
platforms
NOTE
It encompasses all electromagnetic disciplines,
including
electromagnetic
compatibility;
electromagnetic
interference,
electromagnetic
vulnerability, hazards of electromagnetic radiation
to personnel, electro‐explosive devices, volatile
materials, and natural phenomena effects.
3.2.6 field
strength
resultant of the radiation, induction and quasi‐static components of the electric
or magnetic field
NOTE
The term “electric field strength” or “magnetic
field strength” is used, according to whether the
resultant, electric or magnetic field, respectively, is
measured.
3.2.7 ground
plane
metal sheet or plate used as a common reference point for circuit returns and
electrical or signal potentials
3.2.8 improper
response
subsystem or equipment response which can be either inadvertent or
unacceptable
3.2.9 inadvertent
response
proper subsystem functional response (within normal range of limits) actuated
by electromagnetic interference, but occurring at other than the normal
operational cycle, which in turn causes improper response to the total space
system
3.2.10
line impedance stabilization network (LISN)
network inserted in the supply leads of an apparatus to be tested which
provides, in a given frequency range, a specified source impedance for the
measurement of disturbance currents and voltages and which can isolate the
apparatus from the supply mains in that frequency range
3.2.11 not
operating
condition wherein no power is applied to the equipment
3.2.12 overshield
shield surrounding a bundle or a shielded cable
3.2.13
passive intermodulation product
generation of a signal at frequency f = n*f1 + m*f2 from two signals at
frequencies f1 and f2, where n and m are positive or negative integers, by a
passive device, usually an electrical contact
ECSS‐E‐ST‐20‐07C Rev. 1
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15
3.2.14 port
place of access to a device or network where energy can be supplied or
withdrawn, or where the device or network variables can be observed or
measured
3.2.15
power quality requirements
requirements which define the conducted voltage noise or impedance the
power user can expect
NOTE
Noise e.g. from load regulation, spikes, and sags.
3.2.16
soft magnetic material
ferromagnetic material with a coercivity smaller than 100 A/m
3.2.17 spurious
emission
electromagnetic emission from the intended output terminal of an electronic
device, but outside of the designed emission bandwidth
3.2.18 test
antenna
antenna of specified characteristics designated for use under specified
conditions in conducting tests
3.2.19 unit
equipment that is viewed as an entity for purposes of analysis, manufacturing,
maintenance, or record keeping
NOTE
E.g. hydraulic actuators, valves, batteries, and
individual electronic boxes such as on‐board
computer, inertial measurement unit, reaction
wheel, star tracker, power conditioning unit,
transmitters, receivers, or multiplexers.
3.3
Abbreviated terms
For the purpose of this standard, the abbreviated terms of ECSS‐S‐ST‐00‐01 and
the following apply:
Abbreviation
Meaning
AC
alternating current
ACS
attitude control system
AM
amplitude modulation
AWG
American wire gauge
BCI
bulk cable injection
CE
conducted emission
CS
conducted susceptibility
CW
continuous wave
DC
direct current
ECSS‐E‐ST‐20‐07C Rev. 1
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EED
electro‐explosive device
EGSE
electrical ground support equipment
EHF
extremely high frequency (30 GHz‐300 GHz)
EMC
electromagnetic compatibility
EMCAB
electromagnetic compatibility advisory board
EMCCP
electromagnetic compatibility control plan
EMEVP
electromagnetic effects verification plan
EMEVR
electromagnetic effects verification report
EMI
electromagnetic interference
EMISM
electromagnetic interference safety margin
ESD
electrostatic discharge
EUT
equipment under test
HV
high voltage
ICD
interface control document
LEO
low Earth orbit
LF
low frequency
LISN
line impedance stabilization network
MGSE
mechanical ground support equipment
PAM
pulse amplitude modulation
PCM
pulse coded modulation
RE
radiated emission
RF
radio frequency
r.m.s.
root‐mean‐square
RS
radiated susceptibility
SHF
super‐high frequency (3 GHz‐30 GHz)
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4
Requirements
4.1
General system requirements
EMC policy and general system requirements, and the spacecraft charging
protection program are specified in ECSS‐E‐ST‐20 Electromagnetic
Compatibility clause and EMC Plan DRD.
4.2
Detailed system requirements
4.2.1
Overview
This clause 4.2 defines the requirements for design and realization at system
level. They are the basis for definition of activities of the EMC programme to
ensure space‐system‐level compatibility with minimum impact to programme,
cost, schedule, and operational capabilities.
4.2.2
EMC with the launch system
4.2.2.1
Overview
General system requirements for “EMC with the launch system” are defined in
ECSS‐E‐ST‐20.
4.2.2.2
Detailed system requirements
a.
Overload capability of the spacecraft RF receivers during the pre‐launch
and launch phases with or without fairing, shall be demonstrated by the
spacecraft supplier.
NOTE 1 It is expected the electromagnetic environment
generated by companion payloads is assessed by
the launching company and addressed in the
User’s Manual.
NOTE 2 A conductive fairing is likely to cause resonances
and cavity effects.
b.
Spacecraft equipment shall not exhibit any malfunction, degradation of
performance or deviation beyond the tolerance indicated in its individual
ECSS‐E‐ST‐20‐07C Rev. 1
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specification after being exposed, even not operating, to the
electromagnetic environment from the launcher and launch site.
NOTE
Most of spacecraft equipment is not operating
during launch. During the launching sequence
spacecraft transmitters and receivers (platform and
payload) can be either in OFF‐ or ON‐state
depending on the launch vehicle.
c.
The electromagnetic interference safety margin (EMISM) of safety critical
equipment shall be applied to equipment in ON‐state during prelaunch
and launch phase and to EEDs.
4.2.3
Lightning environment
4.2.3.1
Overview
Protection of the space system against both direct and indirect effects of
lightning can be a combination of operational avoidance of the lightning
environment and electrical overstress design techniques.
4.2.3.2
Requirements to the space system
a.
Assessment of risk, on the launch pad inside the protected area, for the
space system and its equipment against direct and indirect effects of
lightning before lift‐off, shall be performed.
b.
The spacecraft supplier shall obtain from the launching company the
electromagnetic environment imposed on the launcher payloads in case
of lightning.
4.2.4
Spacecraft charging and effects
4.2.4.1
Overview
Mitigation of risks related to spacecraft charging results of a combination of
rules and methods preventing voltage build‐up and so minimizing the
occurrence of ESD, and techniques for controlling EMI from residual ESD.
ECSS‐E‐ST‐20 addresses management of spacecraft charging protection and
system‐level performance under effects of spacecraft charging and related ESD
or secondary arcs.
ECSS‐E‐ST‐20‐06 addresses charging control and risks arising from spacecraft
charging and other environmental effects on the spacecraft’s electrical
behaviour.
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4.2.4.2
EMI control requirements to system and equipment
in relation with ESD
a.
Analysis or tests at system level shall be performed for assessing the
threat at subsystem or equipment level.
NOTE
Analysis or tests can be defined in the time or
frequency domain. They are expected to evaluate
the coupling level from the ESD source to critical
points.
b.
EMI control from residual ESD shall be performed by a combination of
shielding and passive or active filtering techniques, implemented on the
main structure, at subsystem level or inside equipment.
c.
EMI control efficiency shall be verified by test at subsystem or equipment
level.
4.2.5
Spacecraft DC magnetic emission
4.2.5.1
Spacecraft with susceptible payload
a.
As part of the EMCCP, a magnetic cleanliness control plan shall
document:
1.
magnetic control guidelines
2.
emission limits to magnetic sources
3.
a magnetic budget
4.
specific test methods applied to equipments for emission
measurement and characterization
NOTE
The test method described in 5.4.5 providing a
dipole model can be inadequate and replaced by a
multiple dipole model or a spherical harmonics
model.
4.2.5.2
Attitude control system (ACS)
a.
As part of the EMCCP, a magnetic budget shall be maintained providing:
1.
Three‐axes components of the space vehicle magnetic dipole
(component decreasing with the inverse cube law with distance).
NOTE
Typical values lie in the range 1 Am2 or less for
small spacecraft to much more than 10 Am2 for
large spacecraft.
2.
If the solar array is rotating in the space vehicle axes, separate
evaluation for the main body and the solar array.
3.
When the space vehicle is using a magnetic sensor as part of the
ACS, evaluation of the magnetic induction at its location.
NOTE
The angular deviation is the basic requirement;
however, the requirement is generally expressed in
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terms of modification of the natural field strength
at the sensor location. For LEO spacecraft if the
error on each axis is less than 1 μT, the
modification of the direction is kept less than
20 milliradians.
b.
The specified maximum magnetic field value shall comprise the
remanent magnetization (magnets, electro‐magnets in off‐state, or
residual perm‐up due to hysteresis of soft materials), the induced
magnetization of soft materials by the geomagnetic field, and the
momentum of current loops.
4.2.6
Radiofrequency compatibility
a.
Spurious emissions requirements at antenna ports shall be specified for
RF compatibility purpose by the spacecraft supplier.
b.
When specifying limits and frequency ranges, the following issues shall
be included:
1.
sensitivity of possible victim receiver subsystems including out‐of‐
band response,
2.
no limits apply to transmit frequencies and information carrying
modulation bandwidths,
3.
highest and lowest intentional frequency used by space system
receivers,
4.
antenna port attachments, gain/loss characteristics.
4.2.7
Hazards of electromagnetic radiation
Assessment of hazards to electromagnetic radiation is a part of the process
specified in ECSS‐Q‐ST‐40‐02 “Hazard analysis”, clause “Hazard analysis
requirements”.
4.2.8
Intrasystem EMC
a.
Intrasystem EMC shall be achieved by:
1.
allocation of equipment‐level EMI requirements documented in
the EMCCP, including:
(a)
limits on conducted and radiated emission,
(b)
susceptibility thresholds.
NOTE
Recommended data is defined in Annex A for
equipment and subsystems.
b.
control of conducted and radiated propagation paths methods defined by
clauses 4.2.10 to 4.2.13.
ECSS‐E‐ST‐20‐07C Rev. 1
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4.2.9
EMC with ground equipment
a.
The EGSE and MGSE used for spacecraft integration and ground testing
shall:
1.
Not degrade the EMC performance of the spacecraft;
2.
Have no impact on grounding or isolation.
b.
The EGSE shall be immune to signals used for spacecraft susceptibility
tests.
4.2.10
Grounding
4.2.10.1 Overview
As specified in ECSS‐E‐ST‐20, a controlled ground reference concept is defined
for the space system. Structural elements, antenna and RF reference grounds,
power and signal returns, shields and cable shields, safety grounds, EGSE
grounds are considered.
4.2.10.2 Requirements
a.
A system‐level grounding diagram shall be established including the
EGSE.
b.
A ground reference shall be identified for each power, signal, or RF
source or receiver.
c.
An upper value of common mode voltage shall be specified considering:
1.
power quality requirements defined in ECSS‐E‐ST‐20 for
“Spacecraft bus”,
2.
type of detectors and sensitivity,
3.
characteristics of analogue signal monitor receiver circuit, in
accordance with ECSS‐E‐ST‐50‐14, Table 5‐2 d,
4.
characteristics of bi‐level signal monitor receiver circuit, in
accordance with ECSS‐E‐ST‐50‐14, clause Table 6‐2 e,
5.
hazards due to fault currents internal to the space vehicle or
between the space vehicle and its EGSE.
d.
When power and signal share common paths (wire or structure), the
magnitude of ground impedance shall be limited over the affected signal
spectrum.
NOTE
Non‐exclusive techniques for reducing the
impedance are decrease of common path length,
decrease of wire and ground impedance, filters on
common paths.
ECSS‐E‐ST‐20‐07C Rev. 1
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4.2.11
Electrical bonding requirements
4.2.11.1 Overview
Bonding requirements are a mean for fulfilling grounding requirements.
Normative provisions are specified in clause 4.2.11.2 and illustrated in Figure 4‐1.
NOTE
Bonding requirements for charging control are
specified
in
ECSS‐E‐ST‐20‐06
“Electrical
continuity”, including surfaces and structural and
mechanical parts.
Main frame
Vehicle structure
Nearby structure
grounding
Bonding strap
< 20 m
Vehicle‐bonding
attachment point
Ground reference point
at system level
< 2,5 m
Equipment
housing
Connector
Equipment
bonding stud
< 10 m
Figure 4‐1: Bonding requirements
4.2.11.2 Normative provisions
a.
A vehicle bonding attachment point connected to the vehicle structure
shall be provided as a ground reference point at system level.
b.
An equipment bonding stud connected to the unit housing shall be
provided as a ground reference at equipment level.
c.
Each unit housing shall be bonded to the nearby spacecraft structure
from the equipment bonding stud.
d.
The DC resistance between the equipment bonding stud and the nearby
spacecraft structure shall be less than 2,5 m.
e.
The inductance between the equipment bonding stud and the nearby
spacecraft structure shall be less than 30 nH.
f.
The DC resistance between the unit housing and the vehicle bonding
attachment point shall be less than 20 m
g.
The DC resistance between the equipment bonding stud and each
connector housing shall be less than 10 mΩ.
h.
Bonds shall be capable to carry the fault currents determined by analysis
at system level, without fusing, burning, or arcing.
ECSS‐E‐ST‐20‐07C Rev. 1
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i.
If the structure is used as the return current path, bonding provisions
shall be such that DC and AC voltage drops along power paths comply
with clause 4.2.10.2c.
4.2.11.3 External grounds
a.
The functionality of connecting grounding cables for charge equalization
shall be provided on space systems.
NOTE
Charge
equalization
is
needed
prior
to
implementing other procedures or the application
of power across the interface.
4.2.12
Shielding (excepted wires and cables)
4.2.12.1 Overview
When shielding is used to control EMC with the environment, it can be
provided by the basic space vehicle structure designed as a “Faraday cage”, by
enclosures of electronics boxes, or by cable or bundle overshields.
4.2.12.2 Requirement
a.
Electronics units and cables external to the basic space vehicle structure
shall have individual shields providing attenuation to EMI.
NOTE
It is important to consider apertures used for
pressure drop during ascent and for outgassing.
4.2.13
Wiring (including wires and cables
shielding)
4.2.13.1 Classification of cables
a.
Categorisation of harness and separate routings for wires of different
categories shall be defined as follows:
1.
applicable to critical lines as defined in ECSS‐E‐ST‐20, Clause
“Electromagnetic interference safety margin”.
2.
made on the basis of the characteristics of the signals on the wire
(and hence the interference generated), and on the susceptibility of
the circuit to EMI.
b.
Wires falling into one category shall be assembled into a same bundle.
c.
Bundles of different categories shall be separated either by a separation
distance of 5 cm from the outer circumference or by a metallic screen
when they are routed on parallel paths.
NOTE
Overshields or spacecraft walls can be used to
fulfil the requirement.
ECSS‐E‐ST‐20‐07C Rev. 1
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d.
Wires and cables shall be marked in such a manner that personnel can
visually identify the EMC category for each wire or cable.
4.2.13.2 Cable shields
a.
Cable shields shall not be used as an intentional current carrying
conductor, except coaxial cables in radiofrequency circuits and high‐
speed data links using coaxial cables.
b.
Cable shields, other than overshields, shall have an insulated sheath to
prevent uncontrolled grounding.
c.
Connectors used to carry shielded wires shall
1.
not use a nonconductive finish,
2.
provide contact to the equipment housing with a resistance less
than 10 m through the equipment connector body as shown.
d.
Bonding of cable shields shall be as following:
1.
Bonding to chassis ground is performed at both ends:
(a)
through the equipment connector body,
(b)
using a backshell that provides for circumferential bonding
of shields, or using a halo‐ring.
NOTE
No grounding inside the equipment through a
connector ground pin in order to prevent any
perturbation inside the equipment.
2.
Connection to electrical reference is performed through dedicated
pins.
NOTE
This case typically appears in the design of
detection chains.
e.
Overshields shall be bonded to chassis ground:
1.
at both ends,
2.
using a 360° direct contact or a bond strap of less than 30 nH
NOTE
See NOTE of clause 4.2.11.2e.
f.
Overshields should be bonded to chassis ground at intermediary points
with a separation distance less than 1m between two grounding points.
ECSS‐E‐ST‐20‐07C Rev. 1
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5
Verification
5.1
Overview
5.1.1
Introduction
This Clause specifies general conditions for EMC testing, requirements for
verification at system level and detailed procedures for unit and subsystem
level testing.
5.1.2
Electromagnetic effects verification plan
The electromagnetic effects verification plan (EMEVP) provides the instruction
for conducting all activities needed to verify electromagnetic effects
requirements. This document defines the approach, methods, procedures, and
specific test conditions. The content is specified in the EMEVP DRD of
ECSS‐E‐ST‐20. The EMEVP is the vehicle for tailoring procedures and test
conditions.
5.1.3
Electromagnetic effects verification report
The electromagnetic effects verification report (EMEVR) documents activities
and report analysis or test results in relation with the verification of the
electromagnetic effects. It is established based on the electromagnetic effects
verification plan (EMEVP). The content of the EMEVR is defined in the EMEVR
DRD of ECSS‐E‐ST‐20 supplemented by specific requirements defined hereafter
in 5.3 and 5.4.
5.2
Test conditions
5.2.1
Measurement tolerances
a.
The tolerance for EMC testing shall be as follows:
1.
Distance: ±5 %
2.
Frequency: ±2 %
3.
Amplitude, measurement receiver: ±2 dB
ECSS‐E‐ST‐20‐07C Rev. 1
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4.
Amplitude,
measurement
system
(includes
measurement
receivers, transducers, cables, connectors): ±3 dB
5.
Time (waveforms): ±5 %
6.
Resistors: ±5 %
7.
Capacitors: ±20 %
5.2.2
Test site
5.2.2.1
Overview
Shielded enclosures or unshielded sites are used for testing.
Shielded enclosures prevent external environment signals from contaminating
emission measurements and susceptibility test signals from interfering with
electrical and electronic items near the test facility.
In unshielded sites, the tests are performed during times and conditions when
the electromagnetic ambient is at its lowest level.
5.2.2.2
Shielded enclosures
a.
The enclosures shall be large such that the EUT arrangement
requirements of 5.2.6 and antenna positioning requirements described in
the individual test procedures are satisfied.
b.
RF absorber material shall be used when performing electric field
radiated emissions or radiated susceptibility testing to reduce reflections
of electromagnetic energy and to improve accuracy and repeatability.
NOTE
Example of RF absorber material are carbon
impregnated foam pyramids, and ferrite tiles.
c.
The RF absorber shall be placed above, behind, and on both sides of the
EUT, and behind the radiating or receiving antenna as shown in Figure
5‐1.
d.
Minimum performance of the material shall be as specified in Table 5‐1.
NOTE
The manufacturer’s specification of their RF
absorber material (basic material only, not
installed) can be used.
ECSS‐E‐ST‐20‐07C Rev. 1
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> 1 m
> 30 cm
> 30 cm
> 50 cm
> 30 cm
RF absorber placed
behind the test antenna
from ceiling to floor
Test antenna
EUT
RF absorber placed above,
behind and on both sides of
EUT from ceiling to ground
Figure 5‐1: RF absorber loading diagram
Table 5‐1: Absorption at normal incidence
Frequency
Minimum absorption
80 MHz – 250 MHz
6 dB
above 250 MHz
10 dB
5.2.2.3
Ambient electromagnetic level
a.
The ambient electromagnetic level shall be measured with the EUT not
operating and all auxiliary equipment turned on.
b.
During testing, at least one of the following conditions shall be met:
1.
the ambient is at least 6 dB below the individual test limits,
2.
the EUT complies with the individual test limits,
3.
it is shown that recorded data exceeding the limits cannot be
generated by the EUT (emission tests) or cannot sensitize the EUT
(susceptibility tests).
c.
Background plots shall be reported for each test configuration unless all
recorded data is at least 6 dB below the individual test limits.
5.2.2.4
Ambient conducted level
a.
Ambient conducted levels on power leads shall be measured with the
leads disconnected from the EUT and connected to a resistive load that
draws the same rated current as the EUT.
ECSS‐E‐ST‐20‐07C Rev. 1
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5.2.3
Ground plane
5.2.3.1
General
a.
If the actual installation is known, the EUT shall be installed on a ground
plane that simulates the actual installation.
b.
If the actual installation is unknown or multiple installations are
expected, then the EUT shall be installed on a metallic ground plane.
c.
Ground planes shall be 2 m² or larger in area with the smaller side no less
than 75 cm.
d.
When a ground plane is not present in the actual EUT installation, the
EUT shall be placed on a non‐conductive table.
NOTE
In such a case, test methods are specific and are
likely to differ from the ones in the present
standard.
5.2.3.2
Metallic ground plane
a.
When the EUT is installed on a metallic ground plane, the ground plane
shall have a DC surface resistance not larger than 0,1 m per square.
b.
The DC resistance between metallic ground planes and the shielded
enclosure shall be 2,5 m or less.
c.
The metallic ground planes shall be electrically bonded to the floor or
wall of the basic shielded room structure at least once every 1 m.
d.
The metallic bond straps shall be solid and maintain a five‐to‐one ratio or
less in length to width.
e.
Metallic ground planes used outside a shielded enclosure shall extend at
least 1,5 m beyond the test setup boundary in each direction.
5.2.3.3
Composite ground plane
a.
When the EUT is installed on a conductive composite ground plane, the
surface resistivity of the actual installation shall be used.
b.
Composite ground planes shall be electrically bonded to the enclosure
with means suitable to the material.
5.2.4
Power source impedance
a.
The impedance of power sources providing input power to the EUT shall
be controlled by Line Impedance Stabilization Networks (LISNs) for all
measurement.
b.
LISNs shall not be used on output power leads.
c.
The LISNs shall be located at the power source end of the exposed length
of power leads specified in 5.2.6.6.
d.
The LISN circuit shown in Figure 5‐2 shall be used.
ECSS‐E‐ST‐20‐07C Rev. 1
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NOTE 1 The LISN can be split in several cases, one per
power lead.
NOTE 2 The series inductances represent the inductances of
the wiring; the series resistances represent the
resistances of the wiring and of the central
protections.
NOTE 3 The 50 resistors result in 100 at high
frequency, similar to the characteristic impedance
of the line.
NOTE 4 The feed‐through capacitors provide a short‐circuit
at high frequency and make the LISN symmetrical
NOTE 5 Connecting the regulation wires of the laboratory
supply at the LISN input in order to provide
sufficiently low impedance at low frequency is an
appropriate method. The source impedance is then
dominated by the series resistances in the LISN.
Alternatively, a large capacitor (between 1 mF and
10 mF) will be used.
+
─
x
H
x
H
50
To EUT
To Power
Source
+
─
y m
50
y m
Bonding stud
470nF
to 10µF
470nF
to 10µF
Metal
enclosure
100 kΩ
100 kΩ
Optional
1 to 10mF
Regulation wires
+
─
x
H
x
H
50
To EUT
To Power
Source
+
─
y m
50
y m
Bonding stud
470nF
to 10µF
470nF
to 10µF
Metal
enclosur
100 kΩ
100 kΩ
Optional
1 to 10mF
Regulation wires
Figure 5‐2: Line impedance stabilization network schematic
e.
If no value is specified x = 2 μH and y = 0,1 shall be used.
NOTE
The x and y values, respectively the inductance
and the resistance inserted in each lead are
expected in the EMEVP.
f.
Magnetic coupling between inductors shall be avoided.
g.
If the return line is grounded at the power source in the actual
installation (star distribution), the return line of the LISN shall be
grounded on the power source side.
h.
If the return line(s) of the actual installation is locally grounded (chassis
return), the return line of the LISN need not be provided, and the tests
shall be performed with the return(s) tied to case.
ECSS‐E‐ST‐20‐07C Rev. 1
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i.
The LISN impedance shall be measured at least annually under the
following conditions:
1.
the impedance, measured between the power output lead on the
EUT side of the LISN and the metal enclosure of the LISN,
2.
an unterminated power input terminal on the power source side of
the LISN.
5.2.5
General test precautions
5.2.5.1
Safety
a.
Clause 4.2.7 shall apply for tests involving high electromagnetic power or
high voltage test equipment.
5.2.5.2
Excess personnel and equipment
a.
Only the equipment and the personnel used to perform the test shall be
present in the test area or enclosure.
5.2.5.3
Overload precautions
a.
Checks shall be performed to assure that an overload condition does not
exist.
NOTE
Measurement receivers and transducers are subject
to
overload,
especially
receivers
without
preselectors and active transducers.
b.
Overload condition shall be corrected.
NOTE
This can be done by instrumentation changes.
5.2.6
EUT test configurations
5.2.6.1
General
a.
The EUT shall be configured as shown in the general test setup of Figure
5‐3 and maintained during all testing.
NOTE
For radiated tests, it may be desirable to have the
LISN outside of the shielded room.
ECSS‐E‐ST‐20‐07C Rev. 1
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1
1
2
3
4
5
6
7
7
7
7
2m
5cm
10cm
8
9
7
1: EUT
2: LISN
3: Power source
4: Access panel
5: Interconnecting cable
6: Power lead
7: Bonding strap
8: Non conductive standoff
9: Grounding plane
1
1
2
3
4
5
6
7
7
7
7
2m
5cm
10cm
8
9
7
1: EUT
2: LISN
3: Power source
4: Access panel
5: Interconnecting cable
6: Power lead
7: Bonding strap
8: Non conductive standof
9: Grounding plane
-
Figure 5‐3: General test setup
5.2.6.2
Bonding of EUT
a.
Only the provisions included in the design of the EUT shall be used to
bond units.
5.2.6.3
Shock and vibration isolators
a.
EUTs shall be secured to mounting bases having shock or vibration
isolators if such mounting bases are used in the actual installation
b.
The bonding straps furnished with the mounting base shall be connected
to the ground plane.
c.
When mounting bases do not have bonding straps, bonding straps shall
not be used in the test setup.
5.2.6.4
Safety grounds
a.
When external terminals, connector pins, or equipment grounding
conductors are available for safety ground connections and are used in
the actual installation, they shall be connected to the ground plane.
NOTE
Arrangement and length are specified in 5.2.6.6.
5.2.6.5
Orientation of EUTs
a.
EUTs shall be oriented such that surfaces that produce maximum
radiated emissions and respond most readily to radiated signals face the
measurement antennas.
b.
Bench mounted EUTs comprising interconnecting cables shall be located
(10 ± 2) cm from the front edge of the ground plane.
ECSS‐E‐ST‐20‐07C Rev. 1
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5.2.6.6
Construction and arrangement of EUT cables
5.2.6.6.1
General
a.
Electrical cable assemblies shall simulate actual installation and usage.
NOTE 1 Proper construction techniques such as use of
twisted pairs, shielding, and shield terminations
are determinant features.
NOTE 2 Details on the cable construction used for testing
are defined in the EMEVP DRD of ECSS‐E‐ST‐20,
and maintained in the EMEVR DRD of
ECSS‐E‐ST‐20.
b.
Shielded cables or shielded leads (including power leads and wire
grounds) within cables shall be used only if they have been specified in
installation requirements.
5.2.6.6.2
Interconnecting leads and cables
a.
Individual leads shall be grouped into cables in the same manner as in
the actual installation.
b.
Up to 10 m, interconnecting cable lengths in the setup shall be the same
as in the actual installation.
c.
If a cable is longer than 10 m in the actual installation, the cable length in
the set up shall be between 10 m and the actual length.
d.
The cable arrangement shall be such that it satisfies the following
conditions:
1.
At least the first 2 m (except for cables that are shorter in the actual
installation) of each interconnecting cable associated with each
enclosure of the EUT are run parallel to the front boundary of the
setup.
2.
Remaining cable lengths are routed to the back of the setup and
placed in a zigzagged arrangement.
e.
When the setup includes more than one cable, individual cables shall be
separated by 2 cm measured from their outer circumference.
f.
For bench top setups using ground planes, the cable closest to the front
boundary shall be placed 10 cm from the front edge of the ground plane.
g.
All cables shall be supported 5 cm above the ground plane (except for
interconnecting cables between enclosures of the EUT that are higher in
the actual installation).
5.2.6.6.3
Input power leads
a.
Two metres of input power leads (including neutrals and returns) shall
be routed parallel to the front edge of the setup in the same manner as
the interconnecting leads.
b.
Each input power lead, including neutrals and returns, shall be
connected to a LISN.
ECSS‐E‐ST‐20‐07C Rev. 1
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c.
Power leads that are bundled, as part of an interconnecting cable in the
actual installation, shall be configured in the same fashion for the 2 m
exposed length and then shall be separated from the bundle and routed
to the LISNs.
d.
After the 2 m exposed length, the power leads shall be terminated at the
LISNs in such a manner that the total length of power lead from the EUT
electrical connector to the LISNs shall not exceed 2,5 m.
e.
All power leads shall be supported 5 cm above the ground plane.
f.
If the power leads are twisted in the actual installation, they shall be
twisted up to the LISNs.
5.2.6.7
Electrical and mechanical interfaces
a.
Either the actual equipment from the platform installation or loads that
simulate the electrical properties present in the actual installation shall
terminate electrical input or output interfaces.
NOTE
Example of these electrical properties are
impedance, grounding and balance.
b.
Signal inputs shall be applied to the electrical interfaces to exercise EUT
circuitry.
c.
EUT with mechanical outputs shall be loaded under expected conditions.
d.
When variable electrical or mechanical loading is present in the actual
installation, testing shall be performed under expected worst‐case
conditions.
e.
When active electrical loading is used, it shall be ensured that the active
load meets the ambient requirements of 5.2.2 when connected to the
setup, and that the active load does not respond to susceptibility signals.
NOTE
Example of active electrical loading is the test set.
f.
Antenna ports on the EUT shall be terminated with shielded, matched
loads if the RF link is not used during the test.
5.2.7
Operation of EUT
5.2.7.1
General
a.
During emission measurements, the EUT shall be placed in the operating
mode, which produces maximum emissions.
b.
During susceptibility testing, the EUT shall be placed in its most
susceptible operating mode.
c.
When the EUT has several available modes (including software
controlled operational modes), the number of modes to be tested for
emission and susceptibility shall be such that all circuitry is evaluated.
NOTE
It is expected that the customer defines or agrees
operating modes.
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5.2.7.2
Operating frequencies for tuneable RF equipment
a.
Measurements shall be performed with the EUT tuned to not less than
three frequencies within each tuning band, tuning unit, or range of fixed
channels, consisting of one mid‐band frequency and a frequency within
±5% from each end of each band or range of channels.
5.2.7.3
Operating frequencies for spread spectrum
equipment
a.
Operating frequency requirements for two major types of spread
spectrum equipment shall be as follows:
1.
frequency hopping: measurements are performed with the EUT
utilizing a hop set which contains a minimum of 30 % of the total
possible frequencies, and the hop set is divided equally into three
segments at the low, mid, and high end of the EUT operational
frequency range,
2.
direct sequence: measurements are performed with the EUT
processing data at the highest possible data transfer rate.
5.2.7.4
Susceptibility monitoring
a.
The EUT shall be monitored during susceptibility testing for indications
of degradation or malfunction.
NOTE
This monitoring is normally accomplished using
built‐in‐test, visual displays, aural outputs, and
other measurements of signal outputs and
interfaces.
b.
If EUT performance is monitored through installation of special circuitry
in the EUT, the modifications shall not influence test results.
5.2.8
Use of measurement equipment
5.2.8.1
Overview
Any frequency selective measurement receiver can be used for performing the
testing described in this standard if the receiver characteristics (that is
sensitivity, selection of bandwidths, detector functions, dynamic range, and
frequency of operation) meet the constraints specified in this standard and are
sufficient to demonstrate compliance with the applicable limits.
5.2.8.2
Detector
a.
A peak detector shall be used for all frequency domain emission and
susceptibility measurements.
NOTE
This device detects the peak value of the
modulation envelope in the receiver pass band.
Measurement receivers are calibrated in terms of
ECSS‐E‐ST‐20‐07C Rev. 1
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an equivalent root mean square value of a sine
wave that produces the same peak value.
b.
When measurement devices other than peak detector are used for
susceptibility testing, correction factors shall be determined and applied
for test signals to adjust the reading to equivalent r.m.s. values under the
peak of the modulation envelope.
NOTE
Example of such measurement devices are
oscilloscopes, non‐selective voltmeters, and field
strength sensors.
5.2.8.3
Calibration fixture (jig)
a.
When current measurements are performed on the central line of a
coaxial transmission line a transmission line with 50 characteristic
impedance, coaxial connections on both ends, and space for an injection
probe around the centre conductor shall be used for calibration.
NOTE
Figure 5‐4 represents an arrangement described in
MIL‐STD‐461E.
Figure 5‐4: Typical calibration fixture
5.2.9
Emission testing
5.2.9.1
Bandwidths
a.
The measurement receiver bandwidths listed in Table 5‐2 shall be used
for emission testing.
NOTE
These bandwidths are specified at the 6 dB down
points for the overall selectivity curve of the
receivers.
b.
Video filtering shall not be used to bandwidth limit the receiver response.
ECSS‐E‐ST‐20‐07C Rev. 1
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c.
If a controlled video bandwidth is available on the measurement receiver,
it shall be set to its greatest value.
d.
If receiver bandwidths larger that those in Table 5‐2 are used, no
bandwidth correction factors shall be applied to test data due to the use
of larger bandwidths.
NOTE
Larger bandwidths can result in higher measured
emission levels.
Table 5‐2: Bandwidth and measurement time
Frequency Range
6 dB
bandwidth
Dwell time
Minimum measurement time
(analogue measurement receiver)
30 Hz ‐ 1 kHz
10 Hz
0,15 s
0,015 s/Hz
1 kHz ‐ 10 kHz
100 Hz
0,015 s
0,15 s/kHz
10 kHz ‐ 150 kHz
1 kHz
0,015 s
0,015 s/kHz
150 kHz ‐ 30 MHz
10 kHz
0,015 s
1,5 s/MHz
30 MHz ‐ 1 GHz
100 kHz
0,015 s
0,15 s/MHz
Above 1 GHz
1 MHz
0,015 s
15 s/GHz
5.2.9.2
Emission identification
a.
All emissions regardless of characteristics shall be measured with the
measurement receiver bandwidths specified in Table 5‐2.
5.2.9.3
Frequency scanning
a.
For emission measurements, the entire frequency range for each test shall
be scanned.
b.
Minimum measurement time for analogue measurement receivers
during emission testing shall be as specified in Table 5‐2.
c.
Synthesized measurement receivers shall step in one‐half bandwidth
increments or less, and the measurement dwell time shall be as specified
in Table 5‐2.
d.
For equipment that operates, such that potential emissions are produced
at only infrequent intervals, times for frequency scanning shall be
increased such than any emission is captured.
5.2.9.4
Emission data presentation
a.
Amplitude versus frequency profiles of emission data shall be
automatically generated and displayed at the time of the test.
b.
Except for verification of the validity of the output, data shall not be
gathered manually.
c.
The information shall be displayed after application of correction factors,
including transducers, attenuators, and cable loss.
ECSS‐E‐ST‐20‐07C Rev. 1
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d.
Data output of the EUT test result shall be in the form of amplitude over
time (for the time domain plots) and amplitude over frequency (for
frequency domain plots), superimposed with the EMI test limit.
e.
Units of measurement for frequency domain emissions measurements
shall be reported in units of dB referenced to 1 μV, 1 μA, 1 μV/m, 1 pT
depending on the unit defined in the test limit.
f.
For time domain measurements, oscilloscope plots shall include the
amplitude physical unit (V or A) conversion factors V into A if not done
automatically by the oscilloscope, and the oscilloscope sensitivity, time
base settings and measurement bandwidth.
g.
For frequency domain plots, emission data shall be reported in graphic
form with frequency resolution of 1 %, or twice the measurement receiver
bandwidth, whichever is less stringent.
h.
In the event of any emissions test result over the emission test limit above
100 MHz, greater accuracy of its frequency shall be reported with
resolution better than or equal to twice the measurement bandwidth.
i.
Each plot of emission data shall be reported with a minimum amplitude
resolution of 1 dB.
5.2.10
Susceptibility testing
5.2.10.1 Frequency stepping
a.
For susceptibility measurements, the entire frequency range for each
applicable test shall be scanned.
NOTE
Stepped scans refer to signal sources that are
sequentially tuned to discrete frequencies.
b.
Stepped scans shall dwell at each tuned frequency for the greatest of
three seconds or the EUT response time.
NOTE
Ten frequency steps per decade can be used as a
basis.
c.
Step sizes shall be decreased such to permit observation of a response.
NOTE
For receivers, it can make use of the frequency
plan to adjust the number of points.
5.2.10.2 Modulation of susceptibility signals
a.
Susceptibility test signals shall be pulse modulated (on/off ratio of 40 dB
minimum) at a 1 kHz rate with a 50 % duty cycle for susceptibility signals
at a frequency larger than 100 kHz.
b.
CW test signals shall be used for susceptibility signals at a frequency
smaller than 100 kHz.
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5.2.10.3 Thresholds of susceptibility
a.
When susceptibility indications are noted in EUT operation, a threshold
level shall be determined as follows where the susceptible condition is no
longer present:
1.
When a susceptibility condition is detected, reduce the interference
signal until the EUT recovers.
2.
Reduce the interference signal by an additional 6 dB.
3.
Gradually increase the interference signal until the susceptibility
condition reoccurs; the resulting level is the threshold of
susceptibility.
4.
Record this level, frequency range of occurrence, frequency and
level of greatest susceptibility, and the other test parameters.
5.2.10.4 Susceptibility data presentation
a.
The susceptibility criteria defined in the EMI test procedure shall be
repeated in the test report, or the “as run” EMI test procedure shall be an
annex to the EMI test report.
b.
Data showing the frequencies and amplitudes at which the test was
conducted shall be provided in graphical or tabular form.
c.
Indications of compliance with the requirements shall be provided.
NOTE
Such indications can be provision of oscilloscope
plots of injected waveforms with test data.
d.
Information shall be displayed after application of correction factors,
including transducers, attenuators, and cable loss.
e.
Data shall be reported with frequency resolution of 1 %.
f.
Data shall be provided with a minimum amplitude resolution of 1 dB for
each plot.
g.
If susceptibility is observed, determined levels of susceptibility shall be
recorded in the test report.
5.2.11
Calibration of measuring equipment
5.2.11.1 General
a.
Measurement antennas, current probes, field sensors, and other devices
used in the measurement loop shall be calibrated at least every two years
or when damaged.
5.2.11.2 Measurement system test
a.
At the start of each emission test, the complete test system (including
measurement receivers, cables, attenuators, couplers, and so forth) shall
be verified by injecting a known signal (as stated in the individual test
procedure), while monitoring system output for the proper indication.
ECSS‐E‐ST‐20‐07C Rev. 1
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b.
When the emission test involves an uninterrupted set of repeated
measurements using the same measurement equipment, the
measurement system test may be accomplished only one time.
NOTE
Example of such repeated measurements is the
evaluation of different operating modes of the
EUT.
5.3
System level
5.3.1
General
a.
Each item of equipment and subsystem shall have successfully passed
functional acceptance test procedures as installed on the platform, prior
to system level EMC test.
5.3.2
Safety margin demonstration for critical or
EED circuits
a.
A test performed to demonstrate compliance with the safety margin
requirement shall use one or more of the following test approaches:
1.
Inject interference at critical system points at x dB higher level than
exists, while monitoring other system points for improper
responses, where x = EMISM.
2.
Measure the susceptibility of critical system circuits for
comparison to existing interference levels, to determine the
margin.
3.
Sensitize the system to render it x dB more susceptible to
interference, while monitoring for improper response, where x =
EMISM.
b.
Safety margin demonstration for something that is susceptible to a time
domain circuit (including EEDs) shall use time domain methods.
5.3.3
EMC with the launch system
a.
If the spacecraft is not powered during launch, EMC testing with the
launch system need not be performed.
b.
If the spacecraft is powered during launch, the electric field radiated
emission requirements specified in the Launcher User’s manual,
including intentional transmission, shall be verified.
c.
In case a spacecraft RF transmitter is operating under fairing, the
following EMISMs shall be verified:
1.
EMISM with respect to the susceptibility threshold of the EEDs.
2.
EMISM with respect to the spacecraft RF receivers’ susceptibility
threshold (if operational) or damage threshold (otherwise).
ECSS‐E‐ST‐20‐07C Rev. 1
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NOTE
This requirement c. applies also to transmitters
which are switched off during launch and ascent
but can, for example, be switched on temporarily
on the launch pad, for a final health check.
d.
The EMISM between the launch system RF emissions and the spacecraft
RF receivers’ damage threshold shall be verified.
5.3.4
Lightning
a.
Lightning protection specified in ECSS‐E‐ST‐20 (in clause “Inter‐system
EMC and EMC with environment”), shall be verified by analysis from
equipment demonstration.
NOTE 1 Test at system level need not be performed.
NOTE 2 deleted.
5.3.5
Spacecraft and static charging
a.
Material use, bonding of discharge elements, thermal blankets, or
metallic items using a bond for static potential equalization shall be
verified by inspection or measurement at assembly into structure.
b.
If the bond is only used for charging control, the bonding resistance shall
be measured with a dc‐current in the range 10 to 100 μA, under only one
polarity, with a 2‐wires ohmmeter.
NOTE
If the bond is only used for charging control the
clauses 5.3.10a and 5.3.10b do not apply.
5.3.6
Spacecraft DC magnetic field emission
a.
Spacecraft DC magnetic field emission requirements shall be verified by a
combination of analysis and tests.
5.3.7
Intra–system electromagnetic compatibility
a.
For intra‐system EMC tests, the support equipment shall provide the
functionality of exercising culprits and victims, and include the support
equipment instructions.
b.
Wherever 0 dB EMISM is a requirement, functional tests at spacecraft
level may be accepted as a verification of EMC.
5.3.8
Radiofrequency compatibility
a.
Except
for
passive
intermodulation
products,
radiofrequency
compatibility shall be verified by a test at system level.
b.
Absence of passive intermodulation products shall be verified in
accordance with the requirements for “Passive intermodulation”
specified in ECSS‐E‐ST‐20.
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5.3.9
Grounding
a.
The system‐level electrical grounding and isolation shall be verified by
isolation and continuity tests at system assembly.
NOTE
The grounding and isolation design is documented
by the system‐level grounding diagram including
EGSE.
5.3.10
Electrical bonding
a.
Except for bonding used only for charging control, the bonding
resistances shall be measured using a 4‐wires method, under a pulsed DC
current of 1 A.
b.
Except for bonding used only for charging control, the probes shall be
reversed and re‐measured to detect possible non linearities across the
bonded junction.
NOTE
See clause 5.3.5b.
5.3.11
Wiring and shielding
a.
Wiring category and cable shields shall be verified by review of design
and inspection.
5.4
Equipment and subsystem level test procedures
5.4.1
Overview
Test procedures are specified in clauses 5.4.2 through 5.4.12 for verifying
emission and susceptibility requirements at subsystem or equipment level.
Table 5‐3 gives the correspondence between procedures and recommended
limits defined in Annex A.
ECSS‐E‐ST‐20‐07C Rev. 1
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Table 5‐3: Correspondence between test procedures and limits
Informative limit
Annex A
Title of test procedure
Verification
Clause 5
CE on power leads, differential mode, 30 Hz to 100 kHz (1st part)
CE on power leads, differential mode, 100 kHz to 100 MHz (2nd part)
CE on power leads, in‐rush currents
CE on power and signal leads, common mode, 100 kHz to 100 MHz
Specific
RE, low‐frequency magnetic field
Specific
RE, low‐frequency electric field
Specific
RE, electric field, 30 MHz to 18 GHz
CS, power leads, differential mode, 30 Hz to 100 kHz
CS, power and signal leads, common mode, 50 kHz to 100 MHz
CS, power leads, short spike transients
RS, magnetic field, 30 Hz to 100 kHz
RS, electric field, 30 MHz to 18 GHz
Susceptibility to electrostatic discharge
5.4.2
CE, power leads, differential mode, 30 Hz to
100 kHz
5.4.2.1
Purpose
This method is used for measuring conducted emissions in the frequency range
30 Hz to 100 kHz on all input power leads including returns.
5.4.2.2
Test equipment
a.
The test equipment shall be as follows:
1.
Measurement receiver,
2.
Current probe,
3.
Signal generator with amplifier,
4.
DC‐current supply,
5.
Data recording device,
6.
Oscilloscope,
7.
Coaxial “T” connector and coaxial to bifilar transition,
8.
1 and 10 power metal film resistors with inductance lower
than 100 nH,
9.
LISN defined in 5.2.4.
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5.4.2.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6 and
Figure 5‐3.
2.
For measurement system check, configure the test setup as shown
in Figure 5‐5.
3.
For equipment testing, configure the test setup as shown Figure
5‐6.
5.4.2.4
Procedure
a.
The test procedures shall be as follows:
1.
Turn on the measurement equipment and wait until it is stabilized.
2.
If the EMEVP specifies to check the measurement system, check it
by evaluating the overall measurement system from the current
probe to the data output device, as follows:
(a)
Apply a calibrated signal level, at 1 kHz and 100 kHz, which
is at least 6 dB below the emission limit to the current probe.
NOTE
A power amplifier can be necessary at 1 kHz.
(b)
Apply through the current probe a DC‐current equivalent to
the EUT supply current.
NOTE 1 A DC current is applied for verifying that the
current probe will not be saturated by the EUT
DC supply current.
NOTE 2 This DC current is applied through the LISN
for applying the same impedance through the
probe as with the EUT.
(c)
Verify the AC current level as measured with the probe by
comparison with voltage across the 1 resistor at 1 kHz and
the 10 resistor at 100 kHz; also, verify that the current
waveform is sinusoidal.
(d)
Scan the measurement receiver for each frequency in the
same manner as a normal data scan. Verify that the data‐
recording device indicates a level within ±3 dB of the
injected level.
(e)
If readings are obtained which deviate by more than ±3 dB,
locate the source of the error and correct the deficiency prior
to proceeding with the testing.
3.
Test the EUT by determining the conducted emissions from the
EUT input power leads, hot line and return, and measure the
conducted emission separately on each power lead, as follows:
(a)
Turn on the EUT and wait for its stabilization.
(b)
Select a lead for testing and clamp the current probe into
position.
ECSS‐E‐ST‐20‐07C Rev. 1
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(c)
Scan the measurement receiver over the frequency range,
using the bandwidths and minimum measurement times
specified in Table 5‐2, clause 5.2.9.1.
(d)
Repeat 5.4.2.4a.3(b) and 5.4.2.4a.3(c) for each power lead.
Signal
generator
with
amplifier
Data
recorder
Measurement
receiver
Current
probe
LISN
To power source
Oscilloscope
Coax “T” and
bifilar
transition
Resistor
Signal
generator
with
amplifier
Data
recorder
Measurement
receiver
Current
probe
LISN
To power sourc
Oscilloscope
Coax “T” and
bifilar
transition
Resistor
Figure 5‐5: Conducted emission, 30 Hz to 100 kHz, measurement system check
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power sourc
Figure 5‐6: Conducted emission, 30 Hz to 100 kHz, measurement setup
5.4.3
CE, power and signal leads, 100 kHz to
100 MHz
5.4.3.1
Purpose
This test procedure is used to verify that electromagnetic emissions from the
EUT do not exceed the specified requirements for power input leads including
returns, and for common mode emission.
5.4.3.2
Test equipment
a.
The test equipment shall be as follows:
1.
Measurement receiver,
2.
Current probe,
3.
Signal generator,
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4.
Data recording device,
5.
Oscilloscope with 50 input,
6.
50 power divider (6dB “T” connector),
7.
50 coaxial load,
8.
Calibration fixture defined in 5.2.8.3,
9.
LISNs defined in 5.2.4.
5.4.3.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6 and
Figure 5‐3.
2.
Configure the test setup for the measurement system check as
shown in Figure 5‐7.
3.
For compliance testing of the EUT:
(a)
Configure the test setup as shown in Figure 5‐8 for
differential mode testing and Figure 5‐9 for common mode
testing.
(b)
Position the current probe 10 cm from the LISN.
Signal
generator
Oscilloscope
50
input
6dB
T-connector
Data
recorder
Measurement
receiver
Current probe
inside jig
LISN
To power source
50
coaxial
load
Signal
generator
Oscilloscope
50
input
6dB
T-connector
Data
recorder
Measurement
receiver
Current probe
inside jig
LISN
To power sourc
50
coaxial
load
Figure 5‐7: Conducted emission, measurement system check
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power sour
Figure 5‐8: Conducted emission, measurement setup in differential mode
ECSS‐E‐ST‐20‐07C Rev. 1
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EUT
Data recorder
Measurement
receiver
Current probe
LISN
or EGSE
To power source
EGSE
Power lines
Signal lines
OR
EUT
Data recorder
Measurement
receiver
Current probe
LISN
or EGSE
To power sourc
EGSE
Power lines
Signal lines
OR
Figure 5‐9: Conducted emission, measurement setup in common mode
5.4.3.4
Procedures
a.
The test procedures shall be as follows:
1.
Turn on the measurement equipment and wait until it is stabilized.
2.
If the EMEVP specifies to check the measurement system, check it
by evaluating the overall measurement system from the current
probe to the data output device, as follows:
(a)
Apply a calibrated signal level that is at least 6 dB below the
applicable limit at 1 MHz and 10 MHz or at a level allowing
out of the noise reading on the oscilloscope, whatever is
greater, to the current probe in the jig.
(b)
Apply through the current probe using a second wire, a DC
current equivalent to the EUT nominal supply current.
NOTE 1 A DC current is applied for verifying that the
current probe will not be saturated by the EUT
DC supply current.
NOTE 2 This DC current is applied through the LISN
for applying the same impedance through the
probe as with the EUT.
(c)
Verify the AC current level, as measured with the probe by
comparison with the voltage on the T derivation.
(d)
Scan the measurement receiver for each frequency in the
same manner as a normal data scan, and verify that the data‐
recording device indicates a level within ±3 dB of the
injected level.
(e)
If readings are obtained which deviate by more than ±3 dB,
locate the source of the error and correct the deficiency prior
to proceeding with the testing.
3.
Test the EUT by determining the conducted emission from the
input power leads, hot lines and returns separately, and from each
interconnecting bundle (common mode), including the ones with
power leads, as follows:
ECSS‐E‐ST‐20‐07C Rev. 1
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(a)
Turn on the EUT and wait until it is stabilized.
(b)
Select a lead or a bundle for testing and clamp the current
probe into position.
(c)
Scan the measurement receiver over the frequency range,
using the bandwidths and minimum measurement times
specified in Table 5‐2, clause 5.2.9.1.
(d)
Repeat 5.4.3.4a.3(b) and 5.4.3.4a.3(c) for each power lead or
for each bundle.
5.4.4
CE, power leads, inrush current
5.4.4.1
Purpose
This test procedure is used to verify that the inrush current of the EUT does not
exceed the specified requirements for power input leads.
5.4.4.2
Test equipment
a.
The test equipment shall be as follows:
1.
Two‐channels oscilloscope,
2.
Current probe,
3.
Spike generator,
4.
Data recording device,
5.
Coaxial “T” connector,
6.
Coaxial to bifilar transition,
7.
1 power metal film resistor with inductance lower 30 nH and
peak power capability,
8.
LISN defined in 5.2.4,
9.
Switching device, fast bounce‐free power switch, or an actual
power‐controller except if the ON/OFF command is implemented
in the EUT.
5.4.4.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6 and
Figure 5‐3.
2.
Configure the test setup for the measurement system check as
shown in Figure 5‐10.
3.
Configure the test setup for compliance testing of the EUT as
shown in Figure 5‐11.
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Spike
generator
Data
recorder
Current
probe
LISN
To power source
Oscilloscope
Coax “T”
and bifilar
transition
Resistor
Spike
generator
Data
recorder
Current
probe
LISN
To power sourc
Oscilloscope
Coax “T”
and bifilar
transition
Resistor
Figure 5‐10: Inrush current: measurement system check setup
EUT
Data recorder
Current probe
LISN
To power source
Oscilloscope
Power
controller
ON/OFF command
Fast bounce-free
power switch
a
c
b
EUT
Data recorder
Current probe
LISN
To power sourc
Oscilloscope
Power
controller
ON/OFF command
Fast bounce-free
power switch
a
c
b
Figure 5‐11: Inrush current: measurement setup
5.4.4.4
Procedures
a.
The test procedures shall be as follows:
1.
Turn on the measurement equipment and allow a sufficient time
for stabilization.
2.
If specified by the EMEVP, check the measurement system by
evaluating the overall measurement system from the current probe
to the data output device:
(a)
Apply a calibrated spike that is at least 6 dB below the
applicable limit to the current probe.
(b)
Apply through the current probe a DC current equivalent to
the EUT supply current.
NOTE 1 A DC current is applied for verifying that the
current probe will not be saturated by the EUT
DC supply current.
NOTE 2 This DC current is applied through the LISN
for applying the same impedance through the
probe as with the EUT.
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(c)
Check the spike current as measured with the probe by
comparison with the voltage across the resistor.
(d)
Perform the measurement with the current probe on an
oscilloscope in the same manner as for EUT testing and
verify that the data‐recording device indicates a level within
±3 dB of the injected level.
(e)
If readings are obtained which deviate by more than ±3 dB,
locate the source of the error and correct the deficiency prior
to proceeding with the testing.
3.
Test the EUT by determining the conducted emission from the
EUT input power leads, as follows:
(a)
Select the positive lead for testing and clamp the current
probe into position.
(b)
Perform measurement by application of power on the EUT
using a mercury relay (Figure 5‐11.a), the internal EUT
switch (Figure 5‐11.b), or the power controller (Figure
5‐11.c).
NOTE
The method for application of power is defined
in the EMEVR
5.4.4.5
Data presentation
a.
In addition to 5.2.9.4, data presentation shall be a graphic output of
current versus time displaying the transient characteristics with
following conditions:
1.
amplitude resolution within 3 % of the applicable limit,
2.
time base resolution within 10 % of rise time for measurement of
rise and fall slopes.
NOTE
Rise time is the duration between 10 % and 90 % of
peak‐to‐peak amplitude
b.
Two separate displays shall be provided showing respectively the initial
rise time and the full inrush response.
NOTE
Typical time bases are 10 μs full scale for the initial
rise time and 1 ms full scale for the full inrush
response.
5.4.5
DC Magnetic field emission, magnetic
moment
5.4.5.1
Overview
The described test method allows obtaining a rough estimate of the magnetic
moment of the EUT (centred dipole approximation). It involves the constraint
of measuring the magnetic field at distances typically more than three times the
size of the EUT.
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If a better model is needed, making it possible to predict the field at closer
distances or more precisely than the centred dipole approximation allows, then
either multiple dipole modelling techniques or spherical harmonics techniques
can be used.
NOTE
It is the role of the EMCAB to assess the need for
using such techniques, based on mission
requirements.
5.4.5.2
Set-Up
a.
The EUT should be set in an earth field compensated area providing
zero‐field conditions for the intrinsic moment determination.
NOTE 1 This is necessary in case the EUT contains a
significant amount of soft magnetic material, as
without earth field compensation an induced
magnetic moment would appear.
NOTE 2 Earth field compensation is usually ensured by
2 or 3 sets of Helmholtz coils.
b.
A right‐handed orthogonal coordinate system XYZ shall be assigned to
the EUT geometric centre.
c.
The magnetic sensor (single‐axis magnetometer) shall be installed
successively on the 6 semi‐axes at two different reference distances r1 and
r2 from the geometric centre of the EUT and shall measure the field
projection along these lines.
NOTE
The reference distances are typically more than
three times the size of the EUT
d.
Alternatively the EUT may be installed on a turntable and rotated in
front of a fixed magnetometer, presenting each XYZ axis (positive and
negative) successively aligned with the sensor axis.
e.
The magnetic field shall be positive when orientated from the centre of
the EUT towards the magnetometer.
5.4.5.3
Test sequence
a.
The test sequence shall be as follows:
1.
EUT not operating, initial measurements on the six semi‐axes at
the reference distances.
2.
Deperm:
(a)
EUT not operating, application of a deperming field in
accordance with Figure 5‐12 frequency 3 Hz, maximum
amplitude between 4 000 μT and 5 000 μT, successively on
each XYZ axis of the EUT.
NOTE 1 This is usually done using Helmholtz coils.
NOTE 2 A sequence of symmetrical sine periods of
increasing and decreasing amplitude gives
better results than a sine wave modulated by
exponentials or ramp functions.
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(b)
Measurement after deperm on the six semi‐axes at the
reference distances.
3.
Perm:
(a)
EUT not operating, application of a perm field of 300 μT on
each XYZ axis.
(b)
Measurement after perm on the six semi‐axes at the
reference distances.
4.
Stray field: EUT operating, measurement on the six semi‐axes at
the reference distances.
5.
Final deperm: repeat 5.4.5.3a.2.
5.4.5.4
Data presentation
a.
For DC magnetic field emission, data shall be presented as follows,
superseding clauses 5.2.9.4a through 5.2.9.4i:
1.
For each measurement distance, for each of the 6 semi‐axes, the
following induction measurements in μT are plotted in tabular
form:
B(+X), B(‐X), B(+Y), B(‐Y), B(+Z), B(‐Z)
2.
For each measurement distance, mean inductions, for each axis, are
computed in units of μT and plotted in tabular form, using
following equations:
2
X
X
X
B
B
B
,
2
Y
Y
Y
B
B
B
,
2
Z
Z
Z
B
B
B
3.
For each measurement distance r, 3‐axes magnetic moment
components in units of Am² are calculated using the following
equations and reported:
Mx = 5 r3 BX
M in units of Am², r in meters, B in μT
My = 5 r3 BY
Mz = 5 r3 BZ
4.
Using values of Mx, My and Mz at both distances r1 and r2, values
M1 and M2 of the magnetic moment are calculated using the
following equations and reported:
M1 = Mx(r1)2 + My(r1)2 + Mz(r1)2
M2 = Mx(r2)2 + My(r2)2 + Mz(r2)2
NOTE
If the EUT is a centred dipolar source, then
M1 = M2.
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deperm field
time
B (
µ
T)
Increase : t > 200 s
Decrease : t > 400 s
5000 µT
- 5000 µT
< 0.03 µT
at switch off
Increase : 2 %
Decrease : 1 %
Figure 5‐12: Smooth deperm procedure
5.4.6
RE, electric field, 30 MHz to 18 GHz
5.4.6.1
Purpose
This test procedure is used to verify that electric field emissions from the EUT
and its associated cabling do not exceed specified requirements.
5.4.6.2
Test equipment
a.
The test equipment shall be as follows:
1.
Measurement receiver,
2.
Data recording device,
3.
Linearly polarized antennas,
NOTE
The following antennas are commonly used:
30 MHz to 200 MHz, biconical, 137 cm tip to tip,
200 MHz to 1 GHz, double ridge horn, 69,0 cm by
94,5 cm opening, or log‐periodic,
1 GHz to 18 GHz, double ridge horn, 24,2 cm by
13,6 cm opening.
4.
Signal generators,
5.
Stub radiator,
6.
LISN defined in 5.2.4, optional.
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5.4.6.3
Test setup
a.
A basic test setup for the EUT as shown and described in Figure 5‐3 and
5.2.6 shall be maintained to ensure that the EUT is oriented such that the
surface that produces the maximum radiated emissions is toward the
front edge of the test setup boundary.
NOTE
The LISN should be used.
b.
The measurement system shall be checked by configuring the test
equipment as shown in Figure 5‐13.
c.
To test the EUT antenna positioning, the test setup boundary of the EUT
and associated cabling for use in positioning of antennas shall be
determined.
d.
To test the EUT antenna positioning, the physical reference points on the
antennas shown in Figure 5‐14 for measuring heights of the antennas and
distances of the antennas from the test setup boundary shall be used as
follows:
1.
Position antennas 1 m from the front edge of the test setup
boundary for all setups.
2.
Position antennas above the floor ground plane.
3.
Ensure that no part of any antenna is closer than 1 m from the
walls and 0,5 m from the ceiling of the shielded enclosure.
e.
The antenna positions shall be determined as follows:
1.
For testing below 200 MHz:
(a)
For setups with the side edges of the boundary 3 m or less,
one position, with the antenna centred with respect to the
side edges of the boundary.
(b)
For setups with the side edges of the boundary greater than
3 m, N antenna positions at spacing as shown in Figure 5‐15,
where N is the edge‐to‐edge boundary distance (in metres)
divided by 3 and rounding up to an integer.
2.
For testing from 200 MHz up to 1 GHz, place the antenna in such a
number of positions that the entire width of each EUT enclosure
and the first 35 cm of cables and leads interfacing with the EUT
enclosure are within the 3 dB beamwidth of the antenna.
3.
For testing at 1 GHz and above, place the antenna in such a
number of positions that the entire width of each EUT enclosure
and the first 7 cm of cables and leads interfacing with the EUT
enclosure are within the 3 dB‐beamwidth of the antenna.
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Test setup boundary
Shielded
enclosure
Antenna
Signal
generator
Measurement
receiver
Data recording
device
Connected for
measurement
Connected for
system check
Figure 5‐13: Electric field radiated emission. Basic test setup
Floor
Ground plane
Test setup
boundary
Antenna
0,9 m
1 m
1,2 m
Figure 5‐14: Electric field radiated emission. Antenna positioning
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Test setup boundary
Length x(m); N positions = x/3 (rounded up nearest
integer)
Shielded enclosure
Antenna
Antenna
Antenna
x/N (m)
x/N (m)
x/2 N (m)
x/2 N (m)
1 m
Figure 5‐15: Electric field radiated emission. Multiple antenna positions
5.4.6.4
Test procedures
a.
The measurement equipment shall be turned on and waited until it is
stabilized.
b.
It shall be verify that the ambient requirements specified in 5.2.2.3 are
met and plots of the ambient taken.
c.
The measurement system shall be checked as follows:
1.
Using the system check path of Figure 5‐13, perform the following
evaluation of the overall measurement system from each antenna
to the data output device at the highest measurement frequency of
the antenna:
(a)
Apply a calibrated signal level that is at least 6 dB below the
limit (limit minus antenna factor) to the coaxial cable at the
antenna connection point.
(b)
Scan the measurement receiver in the same manner as a
normal data scan, and verify that the data‐recording device
indicates a level within ±3 dB of the injected signal level.
(c)
If readings are obtained which deviate by more than ±3 dB,
locate the source of the error and correct the deficiency prior
to proceeding with the testing.
2.
Using the measurement path of Figure 5‐13, perform the following
evaluation for each antenna to demonstrate that there is electrical
continuity through the antenna:
(a)
Radiate a signal using an antenna or stub radiator at the
highest measurement frequency of each antenna.
(b)
Tune the measurement receiver to the frequency of the
applied signal and verify that a received signal of
appropriate amplitude is present.
NOTE
This evaluation is intended to provide a coarse
indication that the antenna is functioning properly.
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There is no requirement to measure accurately the
signal level.
d.
The EUT shall be tested by using the measurement path of Figure 5‐13
and by determining the radiated emissions from the EUT and its
associated cabling as follows:
1.
Turn on the EUT and wait until it is stabilized.
2.
Scan the measurement receiver for each applicable frequency
range, using the bandwidths and minimum measurement times in
5.2.9.1
3.
Orient the antennas for both horizontally and vertically polarized
fields.
4.
Repeat steps 5.4.6.4d.2 and 5.4.6.4d.3 for each antenna position
determined under 5.4.6.3c, 5.4.6.3d, and 5.4.6.3e.
5.4.6.5
Data Presentation
a.
In addition to 5.2.9.4, data presentation shall provide a statement
verifying the electrical continuity of the measurement antennas as
determined in 5.4.6.4c.1(c).
5.4.7
CS, power leads, 30 Hz to 100 kHz
5.4.7.1
Purpose
This test procedure is used to verify the ability of the EUT to withstand signals
coupled on input power leads.
5.4.7.2
Test equipment
a.
The test equipment shall be as follows:
1.
Signal generator,
2.
Power amplifier,
3.
1,5 to 2,7 power metal film resistor with inductance lower
1 000 nH and peak power capability,
4.
Oscilloscopes,
5.
Current probe,
6.
Differential high voltage‐probe,
7.
injection transformer,
8.
LISN defined in 5.2.4 optional.
5.4.7.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6 and
Figure 5‐3.
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2.
Check measurement system by configuring the test equipment in
accordance with Figure 5‐16, and setting up the oscilloscope to
monitor the voltage across the resistor.
3.
Test the EUT by configuring the test equipment as shown in Figure
5‐17.
O s c illo sc o p e
d iffe re n tial p ro b e
S ig n a l
g e n e ra to r
P o w e r
a m p lifie r
C u rre n t
p ro b e
In je ctio n
tran sfo rm e r
D a ta
re co rd e r
O s cillo sc o p e
R e sisto r
1 ,5 to 2 ,7
Figure 5‐16: CS, power leads, measurement system check set‐up
EU T
Stim ulation and
m onitoring of
EU T
LISN
Current
probe
Power
inputs
Injection
transformer
Data
recorder
O scilloscope
O scilloscope
differential probe
Signal
generator
Power
am plifier
1,5 to 2,7
Figure 5‐17: CS, power leads, signal injection
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5.4.7.4
Procedures
a.
The measurement equipment shall be turned on and waited until it is
stabilized.
b.
The measurement system shall be checked using the measurement
system check setup for waveform verification as follows:
1.
Set the signal generator to the lowest test frequency.
2.
Increase the applied signal until the oscilloscope indicates the
voltage level specified by application of clause 4.2.8, verify that the
output waveform is sinusoidal, and verify that the indication given
by the current probe is within 3 dB of the expected level derived
from the 1 resistor voltage.
3.
Repeat 5.4.7.4b.2 by setting the signal generator to the highest test
frequency.
c.
The EUT shall be tested as follows:
1.
Turn on the EUT and wait until it is stabilized.
2.
Set the signal generator to the lowest test frequency, and increase
the signal level until the testing voltage or current limit specified
by application of clause 4.2.8, is reached on the power lead.
3.
Repeat 5.4.7.4c.2 at all frequency steps through the testing
frequency range.
4.
Evaluate the susceptibility as follows.
(a)
Monitor the EUT for degradation of performance.
(b)
If susceptibility is noted, determine the threshold level in
accordance with 5.2.10.3.
5.
Repeat 5.4.7.4c.2 to 5.4.7.4c.4 for each power lead.
5.4.8
CS, bulk cable injection, 50 kHz to 100 MHz
5.4.8.1
Purpose
This test procedure is used to verify the ability of the EUT to withstand
sinusoidal waves coupled on the EUT associated cables and power leads.
5.4.8.2
Test equipment
a.
The test equipment shall be as follows:
1.
Signal generator with amplitude or pulse modulation capability,
2.
pulse generator, 1 kHz – 100 kHz, adjustable duty cycle,
3.
power amplifier, 50 kHz – 100 MHz,
4.
current injection probe, 50 kHz – 100 MHz,
5.
current measurement probe, 50 kHz – 100 MHz,
6.
one or two calibration fixture(s) (jigs) defined in 5.2.8.3,
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7.
one two‐channels oscilloscope, 50 input impedance,
8.
waveform recording device,
9.
50 coaxial load,
10.
LISN defined in 5.2.4,
11.
spectrum analyzer (optional).
5.4.8.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as shown and described in
5.2.6 and Figure 5‐3.
2.
For calibration:
(a)
Configure the test equipment in accordance with Figure
5‐18.
(b)
Place the injection probe and the monitor probe around the
central conductor of their respective jigs.
NOTE
The monitor probe and associated jig are
optional.
(c)
Terminate one end of the jig with a 50 ‐coaxial load and
connect the other end to a 50 ‐input oscilloscope.
(d)
If a current monitor probe is used, connect it to another 50
oscilloscope input.
3.
For testing the EUT:
(a)
Configure the test equipment as shown Figure 5‐20.
(b)
Place the injection and monitor probes around a cable
bundle interfacing an EUT connector.
(c)
Position the monitor probe:
5 cm from the connector if the overall length of the
connector and backshell does not exceed 5 cm,
at the overall length of the connector and backshell,
otherwise.
(d)
Position the injection probe 5 cm from the monitor probe.
5.4.8.4
Test procedures
a.
The measurement equipment shall be turned on and waited until it is
stabilized.
b.
The measurement system shall be calibrated by performing the following
procedures using the calibration setup:
1.
Set the frequency of the generator to 50 kHz and apply the pulse
modulation, Figure 5‐19.
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2.
Increase the applied signal until the oscilloscope indicates the
voltage specified by application of clause 4.2.8.
3.
Verify that both inputs of the oscilloscope, voltage monitored on
50 and current monitored by the current probe, are consistent
within 3 dB. This is applicable only if a current probe is used
during calibration
4.
Record the generator settings.
5.
Repeat 5.4.8.4b.2 through 5.4.8.4b.4 for each measurement
frequency.
c.
The EUT shall be tested by performing the following procedures and
using the EUT test setup:
1.
Turn on the EUT and wait until it is stabilized.
2.
Select a bundle for testing and clamp the current probes into
position.
(a)
Set the modulated sine generator to a test frequency, at low
output level.
(b)
Adjust the modulation in duty cycle and frequency.
(c)
Increase the generator output to the level determined during
calibration, without exceeding the current limit specified by
application of clause 4.2.8 and record the peak current
obtained.
(d)
Monitor the EUT for degradation of performance.
(e)
If susceptibility is noted, determine the threshold level as
measured by the current monitor probe in accordance with
5.2.10.3.
(f)
Repeat 5.4.8.4c.2(a) through 5.4.8.4c.2(e) for each test
frequency.
3.
Repeat 5.4.8.4c.2. applying the test signals to each bundle
interfacing with each connector or all bundles taken together.
d.
The calibration need not be re‐performed before testing each EUT
bundle.
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Signal
generator
50
Power
amplifier
50
coaxial load
Oscilloscope 50
input
or spectrum analyser
Injection probe
Monitor probe
External
modulation
source
Ext mod
IN
Jig
Jig
Signal
generator
50
Power
amplifier
50
coaxial lo
Oscilloscope 50
input
or spectrum analyser
Injection probe
Monitor probe
External
modulation
source
Ext mod
IN
Jig
Jig
Figure 5‐18: Bulk cable injection, measurement system check set‐up
Time
Vo
lt
Burst length
Period
Time
Vo
lt
Burst length
Perio
Figure 5‐19: Signal test waveform
EUT
LISN
(or EUT, or
EGSE)
Monitor
probe
Data
recorder
Injection probe
Oscilloscope/
Spectrum analyser
Signal
generator
50
Power
amplifier
External
modulation
source
Ext mod
IN
Figure 5‐20: CS of power and signal leads, bulk cable injection
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5.4.9
CS, power leads, transients
5.4.9.1
Purpose
This test procedure is used to verify the ability of the EUT to withstand short
spikes coupled on EUT power leads, including grounds and returns that are not
grounded internally to the equipment or subsystem.
5.4.9.2
Test equipment
a.
The test equipment shall be as follows:
1.
Spike generator with following characteristics:
(a)
Pulse width of 10 μs and 0,15 μs,
(b)
Pulse repetition rate capability up to 10 pulses per second,
(c)
Voltage output as required, positive then negative,
(d)
Output control,
(e)
Adequate transformer current capacity commensurate with
line being tested,
(f)
Output impedance 5 or less for 0,15 μs and 1 or less for
10μs transient,
(g)
External synchronization and triggering capability.
2.
Oscilloscope with 50 MHz bandwidth or greater.
3.
Differential high‐voltage probe.
4.
Isolation transformer.
5.
5 resistor power metal film resistor with inductance lower
100 nH and peak power capability.
6.
LISN defined in 5.2.4, with added inductor for a total inductance
not less than 20 μH for parallel injection.
5.4.9.3
Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6 and
Figure 5‐3.
2.
For calibration:
(a)
Configure the test equipment in accordance with Figure 5‐21
for verification of the waveform.
(b)
Set up the oscilloscope to monitor the voltage across the
5 resistor.
(c)
For EUT testing configure the test equipment as shown in
Figure 5‐22 (series test method) or Figure 5‐23 (parallel test
method).
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NOTE 1 With series injection, the internal LISN capacitor at
the input power side is protecting the source.
NOTE 2 With parallel injection, the internal inductance is
protecting the source, so a minimum value is
needed as specified in 5.4.9.2a.6.
5 resistor
Data
recorder
Oscilloscope
Differential probe
Spike generator
Series or parallel
output
Figure 5‐21: CS of power leads, transients, calibration set‐up
EUT
Oscilloscope
Differential probe
Stimulation and
monitoring of
EUT
LISN
Spike generator
Series output
Power
inputs
Data
recorder
Figure 5‐22: CS of power leads, spike series injection test setup
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EUT
Oscilloscope
Differential probe
Stimulation and
monitoring of EUT
LISN
Spike generator
Parallel output
Power
inputs
Data recorder
Inductors
Figure 5‐23: CS of power leads, spike parallel injection test setup
5.4.9.4
Procedures
a.
The test procedures shall be as follows:
1.
Turn on the measurement equipment and wait until it is stabilized.
2.
Perform the following procedure using the calibration setup:
(a)
Adjust the pulse generator for the pulse width, and pulse
repetition rate.
(b)
Adjust the amplitude of the signal to the level specified in
associated limit.
(c)
Verify that the waveform complies with the requirements, if
not, correct accordingly.
(d)
Record the pulse generator amplitude setting.
3.
Test the EUT by performing the following procedure using the test
setup:
(a)
Turn on the EUT and wait until it is stabilized.
(b)
Adjust the spike generator to a pulse duration.
(c)
Apply the test signal to each power lead and increase the
generator output level to provide the specified voltage
without exceeding the pulsed amplitude setting recorded
during calibration.
(d)
Apply repetitive (6 to 10 pulses per second) positive spikes
to the EUT ungrounded input lines for a period not less than
2 minutes in duration, and if the equipment employ gated
circuitry, trigger the spike to occur within the time frame of
the gate.
(e)
Repeat 5.4.9.4a.3(d) with negative spikes.
(f)
Monitor the EUT for degradation of performance.
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(g)
If susceptibility is noted, determine the threshold level in
accordance with 5.2.10.3 and verify that it is above the
specified requirements.
(h)
Record the peak current as indicated on the oscilloscope.
(i)
Repeat 5.4.9.4a.3(b) through 5.4.9.4a.3(h) on each power
lead.
5.4.10
RS, magnetic field, 30 Hz to 100 kHz
5.4.10.1 Purpose
This test procedure is used to verify the ability of the EUT to withstand radiated
magnetic fields.
5.4.10.2 Test equipment
a.
The test equipment shall be as follows:
1.
Signal source,
2.
Power amplifier,
3.
Radiating loop having the following specifications:
(a)
Diameter:
12 cm
(b)
Number of turns:
20
(c)
Wire:
N°12 AWG, insulated copper
(d)
Magnetic flux density: 9,5107 pT/A of applied current at a
distance of 5 cm from the plane of the loop.
4.
Loop sensor having the following specifications:
(a)
Diameter:
4 cm
(b)
Number of turns:
51
(c)
Wire:
7‐41 Litz wire (7 strands, N°41 AWG)
(d)
Shielding:
electrostatic
(e)
Correction Factor:
manufacturer’s data for factors to
convert measurement receiver readings to decibels above
one picotesla (dBpT)
5.
Measurement receiver,
6.
Calibration fixture: coaxial transmission line with 50
characteristic impedance, coaxial connections on both ends, and
space for a current probe around the centre,
7.
Current probe,
8.
LISN.
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5.4.10.3 Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in Figure 5‐3
and 5.2.6.
2.
Check the measurement system by configuring the measurement
equipment, the radiating loop, and the loop sensor as shown in
Figure 5‐24.
3.
Test the EUT by configuring the test setup as shown in Figure 5‐25.
Measurement
receiver A
Signal source
and power
amplifier
Measurement
receiver B
5 cm
Radiating loop
Field monitoring loop
Current probe
inside jig
Figure 5‐24: Measurement system check configuration of the radiating system
Signal source and
power amplifier
5 cm
Radiating
loop
EUT
Figure 5‐25: Basic test set‐up
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5.4.10.4 Test procedures
a.
The measurement equipment shall be turned on and waited until it is
stabilized.
b.
The following procedure shall be performed using the calibration setup
for verification of levels.
1.
Set the signal source to a frequency of 1 kHz and adjust the output
to provide a magnetic flux density of 110 dBpT as determined by
the reading obtained on measurement receiver A and the
relationship given in 5.4.10.2a.3(d).
2.
Measure the voltage output from the loop sensor using
measurement receiver B.
3.
Verify that the output on measurement receiver B is within ±3 dB
of the expected value based on the antenna factor and record this
value.
c.
The EUT shall be tested by performing the following procedures for
determination of location and level of susceptibility.
1.
Turn on the EUT and wait until it is stabilized.
2.
Select test frequencies as follows:
(a)
Locate the loop sensor 5 cm from the EUT face or electrical
interface connector being probed and orient the plane of the
loop sensor parallel to the EUT faces and parallel to the axis
of connectors.
(b)
Supply the loop with such a current to produce magnetic
field strengths at least 10 dB greater than the limit specified
by application of clause 4.2.8 but not to exceed 15 A
(183 dBpT).
(c)
Scan the frequency range.
(d)
If susceptibility is noted, select no less than three test
frequencies per octave at those frequencies where the
maximum indications of susceptibility are present.
(e)
Reposition the loop successively to a location in each 30 by
30 cm area on each face of the EUT and at each electrical
interface
connector,
and
repeat
and
5.4.10.4c.2(d) to determine locations and frequencies of
susceptibility.
(f)
From the total frequency data where susceptibility was
noted in 5.4.10.4c.2(c) through 5.4.10.4c.2(e), select three
frequencies per octave over the frequency range.
3.
At each frequency determined in 5.4.10.4c.2(f) apply a current to
the radiating loop that corresponds to the specified limit, move the
loop to search for possible locations of susceptibility without
omitting the locations determined in 5.4.10.4c.2(e) while
maintaining the loop 5 cm from the EUT surface or connector, and
verify that susceptibility is not present.
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5.4.10.5 Data Presentation
a.
In addition to 5.2.10.4, data presentation shall provide:
1.
Tabular data showing verification of the radiating loop in.5.4.10.4b.
2.
Tabular data, diagrams, or photographs showing the locations and
test frequencies determined in.5.4.10.4c.2(e) and 5.4.10.4c.2(f).
5.4.11
RS, electric field, 30 MHz to 18 GHz
5.4.11.1 Purpose
This test procedure is used to verify the ability of the EUT and associated
cabling to withstand electric fields.
NOTE
Additional requirements can apply beyond
18 GHz if SHF or EHF payloads are present. These
are beyond the scope of the present standard.
5.4.11.2 Test equipment
a.
The test equipment shall be as follows:
1.
Signal generators,
2.
Power amplifiers,
3.
Receive antennas,
(a)
under 1 GHz, not applicable.
(b)
1 GHz to 18 GHz, double ridge horn, 24.2 by 13.6 cm
opening.
NOTE
Above 1 GHz receive antennas may be not used,
see 5.4.11.3b.2.
4.
Linearly polarized transmit antennas
NOTE
The following antennas are commonly used:
30 MHz to 200 MHz, biconical, 137 cm tip to tip,
200 MHz to 1 GHz, double ridge horn, 69,0 cm by
94,5 cm opening, or log‐periodic,
1 GHz to 18 GHz, double ridge horn, 24,2 cm by
13,6 cm opening.
5.
Electric field sensors (physically small ‐ electrically short),
6.
Measurement receiver,
7.
Power meter,
8.
Directional coupler,
9.
Attenuator,
10.
Data recording device,
11.
LISN defined in 5.2.4, optional.
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5.4.11.3 Test setup
a.
A basic test setup shall be maintained for the EUT as shown and
specified in 5.2.6. and Figure 5‐3.
NOTE
The LISN can be used.
b.
For measurement system check, following sensors shall be used:
1.
electric field sensors from 30 MHz to 1 GHz.
2.
either receive antennas or electric field sensors above 1 GHz.
NOTE
For the electric sensors and receiving antennas to
be used, see 5.4.11.2a.3 and 5.4.11.2a.5.
c.
Test equipment shall be configured as specified in Figure 5‐26.
d.
The measurement system shall be checked as follows:
1.
Place the electric field sensors 1 m from, and directly opposite, the
transmit antenna as shown Figure 5‐27 and a minimum of 30 cm
above the ground plane, not directly at corners or edges of EUT.
2.
Place the receive antennas prior to placement of the EUT, as shown
Figure 5‐28, on a dielectric stand at the position and height above
the ground plane where the centre of the EUT will be located.
e.
For testing EUT, the transmit antennas shall be placed 1 m from the test
setup boundary as follows:
1.
30 MHz to 200 MHz
(a)
For test setup boundaries 3 m (including all enclosures of
the EUT and the 2 m of exposed interconnecting and power
leads specified in 5.2.6.6.), centre the antenna between the
edges of the test setup boundary, ensuring that the
interconnecting leads represent the actual platform
installation and are shorter than 2 m.
(b)
For test setup boundaries > 3 m, use multiple antenna
positions (N) at spacings as specified in Figure 5‐27, where
the number of antenna positions (N) is determined by
dividing the edge‐to‐edge boundary distance (in metres) by
3 and rounding up to an integer.
2.
200 MHz and above, use multiple antenna positions (N) as shown
Figure 5‐27, where the number of antenna positions (N) is
determined as follows:
(a)
For testing from 200 MHz up to 1 GHz, place the antenna in
a number of positions such that the entire width of each EUT
enclosure and the first 35 cm of cables and leads interfacing
with the EUT enclosure are within the 3 dB beamwidth of
the antenna
(b)
For testing at 1 GHz and above, place the antenna in a
number of positions such that the entire width of each EUT
enclosure and the first 7 cm of cables and leads interfacing
with the EUT enclosure are within the 3 dB beamwidth of
the antenna.
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f.
For testing EUT, the placement of electric field sensors shall be
maintained as specified in 5.4.11.3d.1.
Shielded enclosure
Antenna
Signal
generator
LISN
EUT
Electric field
sensor
display
Test setup boundary
Electric field
sensor
RF amplifier
3 m
1,5 m
EGSE
Figure 5‐26: Test equipment configuration
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Shielded enclosure
Antenna
Antenna
Antenna
x/N (m)
x/N (m)
x/2 N (m)
x/2 N (m)
1m
Electric field
sensor
Electric field
sensor
Electric field
sensor
Test setup boundary
N electric field sensor positions
N antenna positions
x(m) = edge‐to‐edge boundary distance
Electric field
sensor
Electric field
sensor
Electric field
sensor
Figure 5‐27: RS Electric field. Multiple test antenna positions
Signal source
RF amplifier
Power meter
Test setup boundary
Directional
coupler
Signal
source
Shielded enclosure
Measurement
receiver
Connected for
system check
Connected for
measurement
Transmit
antenna
Receive
antenna
Figure 5‐28: Receive antenna procedure
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5.4.11.4 Test procedures
a.
The measurement equipment and EUT shall be turned on and waited
until they are stabilized.
NOTE
It is important at this point to assess the test area
for potential RF hazards and take precautionary
steps to assure safety of test personnel and fire
avoidance.
b.
The measurement system shall be checked and calibrated as follows:
1.
Procedure when using electric field sensors:
(a)
Record the amplitude shown on the electric field sensor
display unit due to EUT ambient.
(b)
Reposition the sensor until the level measured in (a) above is
< 10 % of the field strength to be used for testing.
2.
Procedure when calibrating with the receive antenna:
(a)
Connect a signal generator to the coaxial cable at the receive
antenna connection point (antenna removed), set the signal
source to an output level of 0 dBm at the highest frequency
to be used in the present test setup and tune the
measurement receiver to the frequency of the signal source.
(b)
Verify that the output indication is within ±3 dB of the
applied signal, considering all losses from the generator to
the measurement receiver and, if deviations larger than 3 dB
are found, locate the source of the error and correct the
deficiency before proceeding.
(c)
Connect the receive antenna to the coaxial cable as specified
in Figure 5‐28, set the signal source to 1 kHz pulse
modulation, 50 % duty cycle, establish an electric field at the
test frequency by using a transmitting antenna and
amplifier, and gradually increase the electric field level until
it reaches the limit specified by application of clause 4.2.8.
(d)
Scan the test frequency range and record the input power
levels to the transmit antenna to maintain the required field.
(e)
Repeat procedures 5.4.11.4b.2(a) through 5.4.11.4b.2(d)
whenever the test setup is modified or an antenna is
changed.
NOTE
The ground plane tends to short‐circuit
horizontally polarized fields, so that more
power is needed to achieve the same field value
in horizontal polarization as in vertical
polarization.
c.
The EUT shall be tested as follows:
1.
Procedure when using electric field sensors:
(a)
Establish an unmodulated electric field at the test start
frequency by using an amplifier and transmit antenna, and
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gradually increase the electric field level until it reaches the
limit specified by application of clause 4.2.8.
(b)
Set the signal source to 1 kHz pulse modulation, 50 % duty
cycle and apply the modulation.
(c)
Repeat the test at all frequency tests while maintaining field
strength levels in accordance with the associated limit, and
monitor EUT performance for susceptibility effects.
2.
Procedure when calibrating with the receive antenna:
(a)
Remove the receive antenna and reposition the EUT in
conformance with 5.4.11.3e.
(b)
Set the signal source to 1 kHz pulse modulation, 50 % duty
cycle, establish an electric field at the test start frequency by
using an amplifier and transmit antenna, and gradually
increase the input power level until it corresponds to the
level recorded during the calibration routine.
(c)
Repeat the test at all test frequencies while assuring the
transmitter input power is adjusted in accordance with the
calibration data collected, and constantly monitor the EUT
for susceptibility conditions.
3.
If susceptibility is noted, determine the threshold level in
accordance with 5.2.10.3.
4.
Perform testing over the frequency range with the transmit
antenna vertically polarized, and repeat the testing with the
transmit antenna horizontally polarized.
NOTE
The settings needed to achieve the specified
field level in vertical polarization are reused as
is for the test in horizontal polarization.
5.
Repeat 5.4.11.4c.4 for each transmit antenna position determined in
5.4.11.3e.
5.4.11.5 Data presentation
a.
In addition to 5.2.10.4 , data presentation shall provide:
1.
graphical or tabular data listing (receive antenna procedure only)
all calibration data collected to include input power requirements
used versus frequency, and results of system check in 5.4.11.4b.2(c)
and 5.4.11.4b.2(d).
2.
the correction factors used to adjust sensor output readings for
equivalent peak detection of modulated waveforms.
3.
diagrams or photographs showing actual equipment setup and the
associated dimensions.
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5.4.12
Susceptibility to electrostatic discharges
5.4.12.1 Overview
The purpose of this test is to determine the existence of susceptibility to
electromagnetic effects of electrostatic discharges.
5.4.12.2 Test equipment
a.
The test equipment shall be as follows:
1.
DC high voltage supply or an ESD generator as specified in
IEC 61000‐4‐2 (Edition 1.2).
NOTE
Use of the ESD generator is less hazardous than
use of the DC high voltage supply for test
operators.
2.
The discharge primary circuit is constituted of:
(a)
6 kV spark gap,
NOTE 1 An air spark gap or an overvoltage suppressor
in a sealed pressurized envelop can be used.
NOTE 2 An air spark gap is less stable and has longer
rise time.
(b)
50 pF capacitance, high‐voltage capacitor with inductance
less than 20 nH,
(c)
47 damping resistor (high voltage specification),
NOTE
The value can be adjusted at critical damping
depending on value of capacitance C and self‐
inductance of the discharge circuit;
(d)
10 k resistors (high voltage specification).
NOTE
Choke
resistors
prevent
high‐frequency
components of discharge from flowing in
uncontrolled paths so the discharge parameters
are not dependent on length and position of
high‐voltage source wires.
3.
Monitoring devices:
(a)
Two current probes, 100 A peak capability and more than
100 MHz bandwidth,
(b)
One high‐voltage probe, 10 kV range, 1 MHz bandwidth,
NOTE
If the probe input impedance is not high
enough, it can prevent gap arcing by lowering
the available voltage.
(c)
One two‐channels digital oscilloscope with pretriggering
capability.
NOTE
Typical values are 100 ns pretrigger time,
display window in the range 1 μs to 10 μs and
resolution better than 4 ns.
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5.4.12.3 Setup
a.
The test setup shall be as follows:
1.
Maintain a basic test setup for the EUT as specified in 5.2.6. and
Figure 5‐3.
NOTE
It is important at this point to assess the test
area for potential high‐voltage hazards and
take necessary precautionary steps to assure
safety of test personnel.
2.
When using an ESD generator as a high‐voltage power supply as
shown Figure 5‐30 or Figure 5‐31, it is set in the contact discharge
mode.
3.
Connect the high‐voltage electrode to the discharge circuit at the
node between the spark gap and the capacitor.
4.
The discharge circuit length is not larger than what is necessary to
place in series the 20 cm long coupling wire, the damping resistor,
the discharge capacitor, the spark gap and the current probe.
NOTE
It is important to ensure that the discharge loop
is as small as possible for achieving the
transient pulse duration objective defined in
5.4.12.4a.2(d).
5.
For calibration the test equipment is configured as shown Figure
5‐30, and meeting following provisions:
(a)
the discharge circuit is not coupled to the EUT,
(b)
choke resistors are near the capacitor,
(c)
the current probe monitoring the primary current from the
ESD source is near the damping resistor, at the capacitor
side,
(d)
the high voltage probe is measuring the voltage across the
capacitor, grounded at the damping resistor side.
NOTE
The high‐voltage probe is not meant to measure
the voltage during the discharge but the voltage
reached before discharge
6.
Test the EUT by configuring the test equipment as specified in
Figure 5‐31 and meeting the following provisions:
(a)
the high voltage probe used for calibration is removed,
(b)
the EUT is mounted on a conductive ground plane using the
space vehicle mount and attach points, and operated using
the actual electrical harness, or an EMC test harness of
identical construction to the actual harness.
NOTE
It is preferable to use the actual electrical
harness.
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(c)
the discharge circuit is supported 5 cm above the ground
plane by a non‐conductive standoff with high‐voltage
insulation capability,
(d)
from calibration, the discharge circuit is kept unchanged in
size and shape, and tightly electromagnetically coupled
20 cm along an EUT bundle, held by dielectric bonds
NOTE
A maximum separation distance of 1 cm
between the injection wire and the outer
circumference of the bundle under test is a
condition for achieving a tight electromagnetic
coupling.
(e)
a current probe is monitoring the primary current from the
ESD source near the damping resistor,
(f)
a current probe is monitoring the current in the EUT
harness, 5 cm from the EUT connector.
1
3
3
4
5 cm
5
6
2
7
3
1: EUT
2: EUT or EGSE
3: Access panel
4: Interconnecting cable
5: Non‐conductive
standoff
6: Grounding plane
7: HV source
Figure 5‐29: Spacecraft charging ESD susceptibility test
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Damping
resistor
Choke
resistor
Choke
resistor
ESD sparker
or high‐voltage dc power supply
Spark gap
Current
probe
High‐voltage
capacitor
High‐voltage
probe
Injection wire
Figure 5‐30: Susceptibility to ESD: calibration configuration
Damping
resistor
Choke
resistor
Choke
resistor
Current
probe
High‐voltage
capacitor
Bundle under
test
20cm
coupling
Current
probe
Injection wire
tightly coupled
to the bundle
under test
ESD sparker
or high‐voltage dc power supply
Spark gap
Figure 5‐31: Susceptibility to ESD: test equipment configuration
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5.4.12.4 Procedure
a.
The test procedures shall be as follows:
1.
Turn on the measurement equipment and wait until it is stabilized.
2.
Perform a calibration using the calibration setup:
(a)
Select the spark gap device or adjust the spark length at the
voltage breakdown to be used for the test,
(b)
Turn on the high voltage generator,
(c)
Using the high voltage probe, check the breakdown voltage
value is stable and within 30 % from the value to be used
for the test.
(d)
Monitor the transient current pulse.
NOTE
A goal is 30 A, 30 ns duration at mid‐height,
rise time as short as possible. Means for
minimizing the rise time are adjusting the
damping resistor, reducing the size loop,
checking that both choke resistors are as close
as possible to the capacitor, and technology of
the spark gap (nature of gas and shape of
electrodes).
(e)
Record the last current and voltage couple, displayed with a
common time reference,
(f)
Repeat 5.4.12.4a.2(d) and 5.4.12.4a.2(e) with opposite
polarity.
3.
Test the EUT as follows:
(a)
Fully power the unit during the complete ESD test,
(b)
Turn on the high voltage generator,
(c)
Establish a pulse discharge at a pulse rate of 1 Hz, with a
pulse direction of at least 15 positive and 15 negative,
(d)
Record the last primary and secondary current couple,
displayed with a common time reference,
(e)
Repeat 5.4.12.4a.3(c) and 5.4.12.4a.3(d) on each bundle
interfacing with each electrical connector.
5.4.12.5 Data presentation
a.
Superseding clause 5.2.10.4, data presentation shall be as follows:
1.
Provide tables showing statements of compliance with the
requirement and the induced current level for each interface
connector.
2.
Provide oscilloscope records taken during calibration and EUT
testing procedures.
3.
The requirement of 5.2.10.3 does not apply.
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Annex A (informative)
Subsystem and equipment limits
A.1 Overview
There is no single method for achieving EMC.
Low susceptible equipment is for telecommunication spacecraft flying in
a severe EMI environment due to on board large power and possible
residual ESD.
Low emission equipment is for scientific spacecraft for preserving high
sensitivity of detectors.
Therefore, it is not possible to define a same set of limits for all equipments of
all spacecraft and launchers. The EMCCP is the vehicle for tailoring limits and
test methods.
However, it is a legitimate demand of equipment supplier to ask for EMI limits
outside the frame of a specific project. Conducted and radiated emission limits
and susceptibility limits defined hereafter are recommended for space projects.
A.2 CE on power leads, differential mode,
30 Hz to 100 MHz
In differential mode, on each independent power bus, conducted emissions on
power leads, induced by loads, can be limited in the frequency domain under
following conditions:
limits are in the range extending from 30 Hz to 100 MHz,
a maximum INB in units of dB referenced to 1 μA is a function of
frequency defined in Figure A‐1,
in the low frequency range the limit ICE in units of dB referenced to 1 μA
(dBμA) is function of the consumption Idc (in amperes) of the equipment
on the line, see Figure A‐1:
Idc < 1 A
ICE = 80
1 A < Idc < 100 A
I = 80 + 20 log10(Idc)
Idc > 100 A
I = 120
The mode is called “differential” because measurements are done
separately on hot and return wires, however it comprises common mode
components.
“Independent” means connected to separate power sources.
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100 Adc
30 Adc
10 Adc
3 Adc
1 Adc
0
10
20
30
40
50
60
70
80
90
100
110
120
130
10
100
1 000
10 000
100 000
1 000 000
10 000 000
100 000 000
Frequency (Hz)
C
u
rr
e
n
t l
im
it (d
B
µ
A
)
Figure A‐1: Power leads, differential mode conducted emission limit
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A.3 CE on power leads, in-rush currents
The inrush current of an equipment on the power lines can be limited in the
time domain with following characteristics in order to limit the voltage
transients on the power bus:
During any nominal change of configuration, the rate of change of
current is limited to 5×104 A/s.
At switching ON the rate of change of current is lower than 2×106 A/s,
absolute value of rise and fall slopes.
Specific requirements are usually defined for pulsed radars, plasma
thrusters power units.
Limits can also be specified for the following characteristics in order to achieve
compatibility with the upstream protections of the spacecraft power subsystem.
inrush current duration (in ms);
total charge (in mC);
inrush current slope (in A/μs).
A.4 CE on power and signal leads, common mode,
100 kHz to 100 MHz
The conducted emissions on bundles in common mode can be limited with
following characteristics:
limits are in the range extending from 100 kHz to 100 MHz,
ICE in units of dB referenced to 1 μA (dBμA) is lower than the curve of
Figure A‐2,
the same limit is defined for all cables taken together or bundle per
bundle.
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0
10
20
30
40
50
60
70
80
90
100,000
1,000,000
10,000,000
100,000,000
Frequency (Hz)
Cur
re
n
t l
imi
t (dBµA)
Figure A‐2: Common mode conducted emission limit
A.5 CE on antenna ports
Spurious conducted emissions on antenna ports can be limited to following
values:
receivers 34 dBμV,
transmitters (stand‐by mode): 34 dBμV,
transmitters (transmit mode):
harmonics, except the second and third, and all spurious
emissions: 80dB down the level at the fundamental,
the second and third harmonics 50 +10 log P (where P is the peak
power output) or 80 dB whichever is less.
Equipment with antennas permanently mounted are not in the
scope of this clause.
A.6 DC magnetic field emission
A.6.1 General
The DC magnetic field emission generated by subsystems, equipment and
elementary components is limited or characterized for following purposes:
for establishing the magnetic momentum of the whole space vehicle,
for establishing the composite DC magnetic field at critical locations.
The components of the magnetic emission are DC current loops,
solenoids, the permanent field of hard magnetic materials (magnets) and
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the induced magnetic moment by the Earth‐field on soft magnetic
materials, including hysteresis.
A.6.2 Characterization
Following parameters of magnetic properties can be determined or
characterized:
permanent induction parameters of operating EUT by determination of
magnetic induction B in units of μT under magnetic zero‐field condition,
induced parameters of not operating EUT by determination of magnetic
induction B in units of μT when immerged in a uniform controlled field
of 30 μT (calibrated in absence of EUT) in each of 3 rectangular semi‐axes,
in both directions,
determination of the DC magnetic field emission is performed by either
measurement or similarity,
determination by similarity is applied to equipment or subsystems
coming from other programs, where re‐use as it is or re‐use with only
little modification.
assessment of the dipole model by measurement of magnetic induction B
at least at two different distances r and comparing respective products
r3(m) B(μT),
NOTE
Distances in the range 0,5 m to 1,5 m can be used.
magnitude of the magnetic dipole, (when the equipment is assimilated to
a dipole) either:
by its magnetic moment, or
by the magnetic induction at some distance of reference.
When the unit is assimilated to a dipole, the inverse cube law
dependence with distance applies, the following relation (worst
case) is used for the equivalence between the magnetic moment
and the induction at the distance d:
3
2
7
m
d
Am
M
10
2
T
B
characterization of the magnetic source when the dipole approximation is
inadequate, either by:
a multiple moment model, or
a spherical harmonics model, or
the magnetic induction at the distance of measurement.
The distance of reference is specified by the EMCAB in function of
the size of the space vehicle or of the actual distance between
magnetic sources and susceptible equipment.
The magnetic induction is a rough indication that can be sufficient
for some applications.
The multiple‐moment model or the spherical harmonics model is a
precise determination sometimes needed for sensitive payloads.
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Specific characterization methods are implemented for the
multiple‐moment model or the spherical harmonics identification.
A.6.3 Limit
The DC magnetic emission of subsystems or equipments can be limited at a
level of 0,2 μT at a distance of 1m from any face of the equipment.
This limit corresponds to dipole‐like equipment with a magnetic moment of
1 Am2.
The limitation is achieved through a combination of techniques: current loop
area minimization and coaxial or twisted cables use, non‐magnetic material use,
magnetic shields use, compensation techniques with magnets.
A.7 RE, low-frequency magnetic field
From a few hertz to 50 kHz, the magnetic‐field radiated emissions can be
measured.
Measurement can be performed at several distances for characterizing the
accuracy of a dipole model.
If the EUT can be assimilated to a magnetic dipole, emission limits are
expressed by its magnetic dipole momentum.
No limit is defined at equipment level.
The measurement is only for characterization and useful to verify compliance at
system level through analysis.
Techniques for fulfilling EMC requirement at system level are an appropriate
grounding network, magnetic shields, an optimized location of equipments on
the space vehicle.
A.8 RE, low-frequency electric field
From a few hertz to 30 MHz frequency range the electric‐field radiated
emissions of units can be measured.
The frequency limits are determined by the EMCAB from payload
specifications.
The electric field emission from the equipment is expressed in units of dB above
1 μV/m at a distance of 1 m.
Measurements at several distances are performed for characterizing the decay
law.
No limit is defined at equipment level.
The measurement is only for characterization and useful to verify compliance
with system level requirements through analysis.
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Techniques for fulfilling EMC requirement at system level are reduction of
common mode conducted emission from bundles, and electric shields or
appropriate location of equipments on the space vehicle.
A.9 RE, electric field, 30 MHz to 18 GHz
In the 30 MHz to 18 GHz frequency range, electric‐field radiated‐emissions
from equipment and subsystem including interconnecting cables can be limited
under following conditions:
the limit applies to:
non‐RF equipment,
RF equipment connected to passive loads or EGSE, in nominal
mode, at nominal power,
the limit is defined by the curve in Figure A‐3,
the limit is for both horizontally and vertically polarized fields,
the limit comprises notching lines for launchers or spacecraft receiving
bands not represented in Figure A‐3.
Additional requirements can apply beyond 18 GHz if SHF or EHF
payloads are present. These are beyond the scope of the present
standard.
For equipment having all internal rise times longer than 35 ns, the
specified upper frequency limit can be reduced to 1 GHz.
For non‐RF equipment if the emission is lower than 20 dB below the
requirement between 500 MHz and 1 GHz the specified upper limit can
be reduced to 1 GHz, with the exception of notches above 1 GHz, still to
be tested.
40
50
60
70
80
90
100
1.E+07
1.E+08
1.E+09
1.E+10
1.E+11
Frequency (Hz)
E-
fi
e
ld
(
d
B
µV
/m)
Figure A‐3: Radiated electric field limit
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A.10 CS, power leads, differential mode, 30 Hz to 100 kHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the susceptibility test on
the power leads specified in clause 5.4.7.
the injected voltage level is equal or larger than the level shown in Figure
A‐4,
a limitation of the injected current before the specified voltage is reached
is applied:
the limit of current is 1 Arms
the voltage level when the current limit is reached is measured and
reported.
The current applied is reported.
Independent power lines are tested separately.
NOTE
Independent means “connected to separate power
sources”.
Except in the case of structure return, for each power line, hot and return wires
are tested separately.
NOTE
In case of structure return, the test is only applied
to hot wires.
The test signal covers the [30 Hz‐100 kHz] frequency range.
0
0,2
0,4
0,6
0,8
1
1,2
10
100
1 000
10 000
100 000
1 000 000
Frequency (Hz)
Vol
tag
e
(
V
rm
s)
Figure A‐4: Conducted susceptibility limit, frequency domain
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A.11 CS, power and signal leads, common mode, 50 kHz to
100 MHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the susceptibility test on
the power and signal leads specified in clause 5.4.8:
the common mode level of 3 volts peak to peak or larger is applied,
the limit of the current induced on the bundle is 3 A peak‐to‐peak,
the test signal is pulse modulated,
NOTE
Square wave modulation is a particular case of
pulse modulation.
the duty cycle is depending on the carrier frequency, according to Table
A‐1.
The same level is applied to all cables together or to bundles taken separately.
The common mode induced current on the bundle is reported.
The test signal covers the [50 kHz‐100 MHz] frequency range.
Table A‐1: Equipment: susceptibility to conducted interference, test signal
Frequency range Pulse repetition frequency Duty cycle
50 kHz‐1 MHz
1 kHz
50 % (squarewave)
1 MHz‐10 MHz
100 kHz
20 %
10 MHz‐100 MHz
100 kHz
5 %
A.12 CS, power leads, short spike transients
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the transient susceptibility
test on the power lines specified in clause 5.4.9:
a series of positive spikes, then a series of opposite spikes superposed on
the power voltage shall be applied,
at any time step, the voltage spike amplitude is:
+100 % or ‐100 % of the actual line voltage if the nominal bus
voltage is lower than 100 V, Figure A‐5.
+50 % or ‐100 % of the actual line voltage if the nominal bus
voltage is equal or larger than 100 V
Level 0 in Figure A‐5 represents the DC bus voltage.
Only the positive spike is represented in Figure A‐5.
When a negative spike is applied, the absolute instantaneous
transient voltage goes down to 0, never negative.
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tests are performed with two spike durations, the first zero‐crossing is at
T=150 ns and at T=10 μs.
Independent power lines are tested separately.
Independent means “connected to separate power sources”.
-60
-40
-20
0
20
40
60
80
100
120
0
0,5
1
1,5
2
2,5
3
3,5
4
4,5
Normalized time (in units of T=150ns or T=10µs)
P
e
rcen
tag
e
o
f lin
e v
o
ltage
Figure A‐5: CS, voltage spike in percentage of test bus voltage
A.13 RS, magnetic field, 30 Hz to 100 kHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the radiated susceptibility
test, magnetic field, specified in clause 5.4.10:
the amplitude of the test signal is equal to or larger than the level in
Figure A‐6,
the source is located at 5 cm of any face of the EUT.
The signal test covers the [30 Hz‐100 kHz] frequency range.
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100
110
120
130
140
150
160
170
180
190
10
100
1 000
10 000
100 000
Frequency (Hz)
Lim
it
level
(
d
BpT)
Figure A‐6: Radiated susceptibility limit
A.14 RS, electric field, 30 MHz to 18 GHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for radiated susceptibility test,
electric field, specified in clause 5.4.11:
the amplitude of the test signal is:
equipment in the vicinity of beams, outside of the main frame
considered as a Faraday cage: 10 V/m,
An electric field of more than 10 V/m is applied if RF analysis
demonstrates that the expected electric field seen in flight by the
equipment is larger,
equipment far from main lobes and secondary lobes, outside of the
main frame: 1 V/m,
equipment inside the main frame: 1 V/m.
At RF transmit frequencies, the RS level should be tailored up; at
RF receive frequencies, the RS level should be tailored down for
receivers.
an AM or PAM test signal is used,
both horizontally and vertically polarized fields are used,
circular‐polarized fields are not used.
The signal test covers the [30 MHz‐18 GHz] frequency range.
Additional requirements can apply beyond 18 GHz if SHF or EHF payloads are
present. These are beyond the scope of the present standard.
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90
A.15 Susceptibility to electrostatic discharge
The following dispositions, known to be achievable and already specified in
other standards or project specifications, are proposed for the ESD test specified
in clause 5.4.12.
The test is performed on following equipment, including or not digital circuits:
units comprising high‐voltage power sources,
units man‐handled during normal operation,
This condition applies to manned‐flight,
For man‐handled equipment, an ESD test by the contact discharge
method as defined in IEC‐61000‐4‐2, is more appropriated,
units outside the main frame of the space vehicle designed as a Faraday
cage,
units connected to sensors, actuators, or other units located outside the
main frame designed as a Faraday cage with the exception of the solar
array power bus.
Specific tests defined in ECSS‐E‐ST‐33‐11 are applied to EEDs.
Test of models expected to be or to become flight models is not performed.
ESD testing can cause latent failures of test article.
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91
Bibliography
ECSS‐S‐ST‐00
ECSS system – Description, implementation and general
requirements
MIL‐STD‐461E
Requirements for the control of electromagnetic interference,
characteristics of subsystems and equipment, 20 August
1999; Department of Defence, USA.
